Advanced processing and manufacturing technologies for nanostructured and multifunctional materials II : a collection of papers presented at the 39th International Conference on Advanced Ceramics and Composites January 25-30, 2015 Daytona Beach, Florida / / Tatsuki Ohji [and four others], editors

• Pubblicazione: Hoboken, New Jersey : , : The American Ceramic Society : , : Wiley, , 2016; ©2016
• Descrizione fisica: 1 online resource (199 p.)
• Disciplina: 666
• Soggetto topico: Ceramics; Mechanics
• Soggetto genere / forma: Electronic books.
• Persona (resp. second.): OhjiT (Tatsuki)
• Note generali: Description based upon print version of record.
• Nota di bibliografia: Includes bibliographical references and index.
• Nota di contenuto: TitlePage; Copyright; Contents; Preface; Introduction; Advanced Processing and Manufacturing; Development of High Temperature Joining and Thermomechanical Characterization Approaches for SiC/SiC Composites; Abstract; Introduction; Experimental; Results and Discussion; Conclusions; Acknowledgement; References; Microstructural Observation of Interfaces in Diffusion Bonded Silicon Carbide Ceramics by TEM; Abstract; Introduction; Experimental; Results and Discussion; SEM of Diffusion Bonds; TEM of Diffusion Bonds; Effects of Interlayer Type and Fiber Direction on Chemical Reaction; Conclusions ; ReferencesPreparation and Characterization of RB-SiC Ceramics Fabricated from Phenolic Resin/SiC; Abstract; Introduction; Experimental; Results and Discussion; Conclusion; Reference; New Combined Method of MPS and FEM for Simulating Friction Stir Processing; Abstract; Introduction; Method for Analysis; Combination of MPS and FEM; Results and Discussion; Results of MPS Method; Thermal Analysis of FEM; Mechanical Analysis of FEM; Conclusions; References; Novel Visualizing Technique of The Tips of the Cracks for Indentation Fracture Resistance Method; Abstract; Introduction ; Experimental ProcedureMaterials; Test Procedure; Results and Discussion; Conclusions; References; Slip-Casting by Water-Absorbing Resin Mold Enables Crack-Free CE Ramic Molding System and Products with Partially Different Thicknesses; Abstract; Introduction; Principle; Experimental; Results and Discussion; Crack-Free Effect Verification; Application to Products with Partially Different Thicknesses; Conclusion; References; Influence of Lanthanoid Dopant and N/O Substitution on the Electronic Structure and Luminescent Properties of Lanthanum Silicon Oxynitride Phosphors; Abstract; Introduction ; Structure Models and Computational MethodsResults and Discussion; Calculated Electronic Structure; Influence of Eu-O Distance on Calculated Band Gaps; Conclusions; AcknowledgementS; References; Effect of Ti3 SiC2 Particulates on the Mechanical and Theological Behavior of Sn Matrix Composites; Abstract; 1. Introduction; 2. Experimental; 3.2 Results and Discussion; 3.3 Mechanisms; 4. Conclusions; 5. AcknowledgementS; 6. References; Field Assisted Sintering of Silicate Glass - Containing Alumina; Abstract; Introduction; Experimental Procedure; Results; Conclusions; Acknowledgement; References ; Modeling the First Activation Stages of The Fe(hfa)2TMEDA CVD Precursor on a Heated Growth SurfaceAbstract; Introduction; Computational Methods; Results and Discussion; Conclusions; References; Development of High Aspect Ratio Hexagonal Boron Nitride Filler by Mechanical Exfoliation; Abstract; Introduction; Experimental; Results and Discussion; Conclusions; Reference; Preparation and Characterization of Nanostructured Films:honey Study of Hydrophobicity and Antibacterial Properties for Surface Protection; Abstract; Introduction; Materials and Methods; Results and Discussion; Conclusions ; Acknowledgment
• Titolo autorizzato: Advanced processing and manufacturing technologies for nanostructured and multifunctional materials II
• ISBN: 9781119211662; 9781119211686; 1-119-21167-0
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910137179103321
• Lo trovi qui: Univ. Federico II
• Serie: Ceramic Engineering and Science Proceedings