IEEE transactions on components and packaging technologies : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society

• Pubblicazione: New York, NY, : Institute of Electrical and Electronics Engineers, ©1999-2010
• Disciplina: 621.3
• Soggetto topico: Electronic apparatus and appliances; Electric apparatus and appliances; Electronic industries; Electric industries; Appareils électroniques - Périodiques; Appareils électriques - Périodiques; Industries électroniques - Périodiques; Industries électriques - Périodiques; Appareils électriques; Industries électroniques; Industries électriques; Elektronik; Fertigungstechnik; Zeitschrift; Werkstoff; Elektrotechnik; Elektronisches Bauelement
• Soggetto genere / forma: Periodicals.
• ISSN: 1557-9972
• Note generali: Refereed/Peer-reviewed; Title from IEEExplore homepage (viewed June 23, 2000).
• Titolo abbreviato (Periodici): IEEE T COMPON PACK T; COMPONENTS AND PACKAGING TECHNOLOGIES, IEEE TRANSACTIONS ON [SEE ALSO COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, PART A: PACKAGING TECHNOLOGIES, IEEE TRANSACTIONS ON]; IEEE TRANSACTIONS ON COMPONENTS & PACKAGING TECHNOLOGIES; IEEE TRANS. COMPON. PACKAG. TECHNOL; IEEE trans. compon. packag. technol
• Altri titoli varianti: Transactions on components and packaging technologies; Components and packaging technologies; Institute of Electrical and Electronics Engineers transactions on components and packaging technologies; Components and packaging technologies, IEEE transactions on
• Titolo autorizzato: IEEE transactions on components and packaging technologies
• Formato: Materiale a stampa
• Livello bibliografico: Periodico
• Lingua di pubblicazione: Inglese
• Record Nr.: 996201083503316
• Lo trovi qui: Univ. di Salerno