3D Imaging—Multidimensional Signal Processing and Deep Learning : Multidimensional Signals, Images, Video Processing and Applications, Volume 2 / / edited by Lakhmi C. Jain, Roumen Kountchev, Yonghang Tai, Roumiana Kountcheva

• Pubblicazione: Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2022
• Edizione: 1st ed. 2022.
• Descrizione fisica: 1 online resource (237 pages)
• Disciplina: 006.6
• Soggetto topico: Computational intelligence; Signal processing; Artificial intelligence; Image processing - Digital techniques; Computer vision; Computational Intelligence; Signal, Speech and Image Processing; Artificial Intelligence; Computer Imaging, Vision, Pattern Recognition and Graphics
• Persona (resp. second.): JainL. C.
• Nota di bibliografia: Includes bibliographical references and index.
• Nota di contenuto: Using Meta Path Information to Adjust Embedded Recommendation System -- Study on Remote Sensing Retrieval of Land Surface Evapotranspiration in Poyang Lake Region in Typical Hydrological Year -- Development and Design of Surface Quality Online Inspection System Based on Machine Vision -- Research on the Application of Artificial Intelligence in Unstructured Data Resource Management of Power News Information -- Research on Image Quality Assessment of Vehicle Panoramic View Equipment -- An Experimental Study on Extraction Method of Tobacco Color Distribution Feature -- Intelligent Campus Blog Preprocessing Model -- Research on the Distribution Map of Weeds in Rice Field Based on SegNet -- Analysis and Application of Medical Images in the Field of Artificial Intelligence -- Terahertz Surface-Plasmon-Polaritons Gradient Index Lens -- Research on Artificial Intelligence System Design of Ideological and Political Education -- Research on Interactive Art Design System Based on Artificial Intelligence Technology -- Design of Automatic Verification System for Electronic Balance Based on Machine Vision -- Research on 3D Virtual Emotional Interaction Design Based on Network Digitization -- Application of Artificial Intelligence Technology in Marketing -- Research on Application of OpenGL-based Game Design -- Accuracy Analysis and Verification of Ground based Radar Differential Interferometry.
• Sommario/riassunto: This book gathers selected papers presented at the conference “Advances in 3D Image and Graphics Representation, Analysis, Computing and Information Technology,” one of the first initiatives devoted to the problems of 3D imaging in all contemporary scientific and application areas. The two volumes of the book cover wide area of the aspects of the contemporary multidimensional imaging and outline the related future trends from data acquisition to real-world applications based on new techniques and theoretical approaches. This volume contains papers aimed at the multidimensional systems and signal processing, deep learning, mathematical approaches and the related applications. The related topics are multidimensional multi-component image processing; multidimensional image representation and super-resolution; compression of multidimensional spatio-temporal images; multidimensional image transmission systems; multidimensional signal processing; prediction and filtering of multidimensional process; intelligent multi-spectral and hyper-spectral image processing, intelligent multi-view image processing, 3D deep learning, 3D GIS and graphic database; data-based MD image retrieval and knowledge data mining; watermarking, hiding and encryption of MD images; intelligent visualization of MD images; forensic analysis systems for M3D graphics algorithm; 3D VR (Virtual Reality)/AR (Augmented Reality); applications of multidimensional signal processing; applications of multidimensional systems; multidimensional filters and filter-banks. .
• Titolo autorizzato: 3D Imaging—Multidimensional Signal Processing and Deep Learning
• ISBN: 981-19-2452-X
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910590070803321
• Lo trovi qui: Univ. Federico II
• Serie: Smart Innovation, Systems and Technologies, . 2190-3026 ; ; 298