2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) / / Institute of Electrical and Electronics Engineers
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| Titolo: |
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) / / Institute of Electrical and Electronics Engineers
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| Pubblicazione: | [Place of publication not identified] : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica: | 1 online resource (138 pages) |
| Disciplina: | 621.381046 |
| Soggetto topico: | Electronic packaging |
| Sommario/riassunto: | EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society. |
| Altri titoli varianti: | 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems |
| Titolo autorizzato: | 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) |
| ISBN: | 1-7281-4585-6 |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910437231703321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |