IEEE transactions on components, packaging, and manufacturing technology . Part B Advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the IEEE Lasers and Electro-Optics Society
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| Titolo: |
IEEE transactions on components, packaging, and manufacturing technology . Part B Advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the IEEE Lasers and Electro-Optics Society
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| Pubblicazione: | New York, NY, : Institute of Electrical and Electronics Engineers, c1994-c1998 |
| Disciplina: | 621.3 |
| Soggetto topico: | Electronic packaging |
| Electronic industries | |
| Mise sous boîtier (Électronique) | |
| Mise sous boîtier (Électronique) - Périodiques | |
| Mise sous boîtier (Microélectronique) - Périodiques | |
| Soggetto genere / forma: | Périodique électronique (Descripteur de forme) |
| Ressource Internet (Descripteur de forme) | |
| ISSN: | 1558-3686 |
| Note generali: | Title from IEEExplore homepage (viewed Jun. 21, 2000). |
| Refereed/Peer-reviewed | |
| Titolo autorizzato: | IEEE transactions on components, packaging, and manufacturing technology |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Periodico |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910626115903321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |