Solder Joint Reliability [[electronic resource] /] / S.W. Ricky Lee

• Autore: Ricky Lee S. W
• Pubblicazione: Bradford, England, : Emerald Group, 2004
• Descrizione fisica: 1 online resource (113 p.)
• Soggetto topico: Solder and soldering; Welded joints
• Note generali: Description based upon print version of record.
• Nota di contenuto: Contents; English abstracts; French abstracts; German abstracts; Editorial; Contributors; Long term mechanical reliability with lead-free solders; Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate; Strategies for improving the reliability of solder joints on power semiconductor devices; CBGA solder joint thermal fatigue life estimation by a simple method; Reliability testing and data analysis of lead-free solder joints for high-density packages; Failure analysis of lead-free solder joints for high-density packages ; Thermal cycling reliability of lead-free chip resistor solder jointsInternet commentary; Book reviews; Company profile; New products; Industry news; Exhibitions and conferences; Appointments; International diary
• Sommario/riassunto: The decision to move to lead-free solders has been made, but processing and performance challenges remain. This paper considers the transition in terms of performance, with particular emphasis on long term, high reliability applications. Comparison of key mechanical properties indicates generally beneficial outcomes of the transition to lead-free alloys, although there is a lack of understanding surroundingˆanomalous'' observations, such as the effects of the bismuth. The lower melting point of Sn-Zn-Bi alloys, together with their comparable mechanical properties, provide further impetus to ad
• Titolo autorizzato: Solder Joint Reliability
• ISBN: 1-280-51553-8; 9786610515530; 1-84544-414-0
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910782916203321
• Lo trovi qui: Univ. Federico II
• Serie: Soldering and Surface Mount Technology. : No. 2 ; ; v. 16.