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Investigations of some clay deposits in Washington and Idaho / / by John W. Hosterman, V.E. Scheid, V.T. Allen, and I.G. Sohn



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Autore: Hosterman John W (John Wallace), <1923-> Visualizza persona
Titolo: Investigations of some clay deposits in Washington and Idaho / / by John W. Hosterman, V.E. Scheid, V.T. Allen, and I.G. Sohn Visualizza cluster
Pubblicazione: Washington, D.C. : , : United States Department of the Interior, Geological Survey, , 1960
Washington, D.C. : , : Government Printing Office
Descrizione fisica: 1 online resource (iv, 147 pages, 9 pages of plates) : illustrations, maps, charts
Soggetto topico: Clay - Idaho
Clay - Washington (State)
Clay
Soggetto geografico: Idaho
Washington (State)
Persona (resp. second.): AllenV. T.
ScheidV. E.
SohnI. G <1911-2000, > (Israel Gregory)
Note generali: "Prepared in cooperation with the United States Bureau of Mines."
This article supersedes: Stanford clay deposit, Latah County, Idaho (1954), Stockton and Stanley Hill clay deposits, Kootenai County, Idaho (1954), Camas Prairie clay deposits, Lewis and Idaho Counties, Idaho (1954), Olsen high-alumina and high-iron clay deposits, Latah County, Idaho (1954), Canfield-Rogers high-alumina clay deposit, Latah County, Idaho (1954), Bovill clay deposit, Latah County, Idaho (1954), Deary high alumina clay deposit, Latah County, Idaho (1954), Excelsior high-alumina clay deposit, Spokane, Washington (1954), Geologic setting of the clay deposits of Latah County, Idaho and adjacent areas (1953), Preliminary report, Deary high-alumina clay deposit, Latah County, Idaho (1946), Excelsior high-alumina clay deposit, Spokane County, Washington (1946)
Title from title screen (viewed July 23, 2014).
Nota di bibliografia: Includes bibliographical references (pages 38-39) and index.
Titolo autorizzato: Investigations of some clay deposits in Washington and Idaho  Visualizza cluster
Formato: Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione: Inglese
Record Nr.: 9910707449703321
Lo trovi qui: Univ. Federico II
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