Development of a qualification standard for adhesives used in hybrid microcircuits [[electronic resource] /] / J.J. Licari, B.L. Weigand, and C.A. Soykin
(Visualizza in formato marc)
(Visualizza in BIBFRAME)
| Autore: |
Licari James J. <1930->
|
| Titolo: |
Development of a qualification standard for adhesives used in hybrid microcircuits [[electronic resource] /] / J.J. Licari, B.L. Weigand, and C.A. Soykin
|
| Pubblicazione: | [Huntsville], Ala. : , : National Aeronautics and Space Administration, George C. Marshall Space Flight Center, , [1981] |
| Descrizione fisica: | 1 online resource (viii, pages 109) : illustrations |
| Soggetto topico: | Hybrid integrated circuits |
| Adhesion tests | |
| Adhesives | |
| Microelectronics | |
| Procedures | |
| Specifications | |
| Standards | |
| Altri autori: |
WeigandB. L
SoykinC. A
|
| Note generali: | Title from title screen (viewed on Feb. 13, 2012). |
| "December 1981." | |
| "Performing organization, Rockwell International Corporation, Electronics Devices Division"--Technical rept. t.p. | |
| Nota di bibliografia: | Includes bibliographical references (page 109). |
| Titolo autorizzato: | Development of a qualification standard for adhesives used in hybrid microcircuits |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910701479703321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |