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Titolo: | IEEE transactions on electronics packaging manufacturing : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society |
Pubblicazione: | New York, NY, : Institute of Electrical and Electronics Engineers, ©1999- |
Disciplina: | 621.3 |
Soggetto topico: | Electronic apparatus and appliances - Design and construction |
Manufacturing processes | |
Electronic industries | |
Electronic packaging | |
Production engineering | |
Mise sous boîtier (Électronique) | |
Fabrication | |
Industries électroniques | |
Appareils électroniques - Conception et construction | |
Technique de la production | |
Soggetto genere / forma: | Periodicals. |
ISSN: | 1558-0822 |
Note generali: | Refereed/Peer-reviewed |
Title from IEEExplore homepage (viewed June 29, 2000). | |
Titolo abbreviato (Periodici): | IEEE T ELECTRON PA M |
ELECTRONICS PACKAGING MANUFACTURING, IEEE TRANSACTIONS ON | |
IEEE TRANS. ELECTRON. PACKAG. MANUF | |
IEEE T ELECTRON PACK | |
IEEE trans. electron. packag. manuf | |
Altri titoli varianti: | Transactions on electronics packaging manufacturing |
Electronics packaging manufacturing | |
Institute of Electrical and Electronics Engineers transactions on electronics packaging manufacturing | |
Electronics packaging manufacturing, IEEE transactions on | |
Titolo autorizzato: | IEEE transactions on electronics packaging manufacturing |
Formato: | Materiale a stampa |
Livello bibliografico | Periodico |
Lingua di pubblicazione: | Inglese |
Record Nr.: | 9910626117903321 |
Lo trovi qui: | Univ. Federico II |
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