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The Effect of Surface Wettability on the Defrost Process / / by Yang Liu, Francis A. Kulacki



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Autore: Liu Yang Visualizza persona
Titolo: The Effect of Surface Wettability on the Defrost Process / / by Yang Liu, Francis A. Kulacki Visualizza cluster
Pubblicazione: Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019
Edizione: 1st ed. 2019.
Descrizione fisica: 1 online resource (386 pages) : illustrations
Disciplina: 551.5253
Soggetto topico: Thermodynamics
Heat engineering
Heat - Transmission
Mass transfer
Materials—Surfaces
Thin films
Engineering Thermodynamics, Heat and Mass Transfer
Surfaces and Interfaces, Thin Films
Persona (resp. second.): KulackiFrancis A
Nota di bibliografia: Includes bibliographical references and index.
Nota di contenuto: Chapter1: Introduction -- Chapter2: Prior Research -- Chapter3: A Model of the Defrost Process -- Chapter4: Solution Methods -- Chapter5: Experimental Design -- Chapter6: Results -- Chapter7: Conclusion.
Sommario/riassunto: This SpringerBrief presents a recent advancement in modeling and measurement of the effect of surface wettability on the defrost process. Carefully controlled laboratory measurements of the defrosting of cooled surfaces are used to reveal the effect of surface wetting properties on the extent and speed of frost removal by melting or slumping. The experiments are accompanied by visualization of frost removal at several defrosting conditions. Analysis breaks the defrost process into three stages according to the behavior of the meltwater. Surface wetting factors are included, and become significant when sufficient meltwater accumulates between the saturated frost layer and the surface. The book is aimed at researchers, practicing engineers and graduate students.
Titolo autorizzato: The Effect of Surface Wettability on the Defrost Process  Visualizza cluster
ISBN: 3-030-02616-7
Formato: Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione: Inglese
Record Nr.: 9910337609703321
Lo trovi qui: Univ. Federico II
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Serie: SpringerBriefs in Thermal Engineering and Applied Science, . 2193-2530