2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference / / Institute of Electrical and Electronics Engineers
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| Titolo: |
2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference / / Institute of Electrical and Electronics Engineers
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| Pubblicazione: | Piscataway : , : IEEE, , 2016 |
| Descrizione fisica: | 1 online resource |
| Disciplina: | 621.381 |
| Soggetto topico: | Electronic industries |
| Sommario/riassunto: | Annotation It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation It is a major forum, providing opportunities to network and meet leading experts, in addition to exchange of up to date knowledge in the field. |
| Altri titoli varianti: | 2016 IEEE 37th International Electronics Manufacturing Technology |
| Titolo autorizzato: | 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference |
| ISBN: | 1-5090-3443-9 |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910171903003321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |