Handbook of semiconductor silicon technology / / edited by William C. O'Mara, Robert B. Herring, Lee Philip Hunt

• Pubblicazione: Park Ridge, N.J., U.S.A., : Noyes Publications, c1990
• Descrizione fisica: 1 online resource (721 p.)
• Disciplina: 621.381/046; 621.381046
• Soggetto topico: Semiconductors; Silicon crystals
• Altri autori: O'MaraWilliam C HerringRobert B HuntLee P (Lee Philip)
• Note generali: Description based upon print version of record.
• Nota di bibliografia: Includes bibliographical references.
• Nota di contenuto: Cover image; Title page; Table of Contents; MATERIALS SCIENCE AND PROCESS TECHNOLOGY SERIES; Copyright; Foreword; Preface; NOTICE; Chapter 1: Chemistry and Properties of Coatings: Polyurethanes-Epoxies-Phenoxies-Silicones; POLYURETHANES; EPOXIES; PHENOXIES; SILICONES; RTV (Room Temperature Vulcanizing) Silicones; Chapter 2: Chemistry and Properties of Coatings: Polyimides-Fluorocarbons-Polyxylylenes; POLYIMIDES; FLUOROCARBONS; POLYXYLYLENES; ELECTRONIC APPLICATIONS ; Chapter 3: Chemistry and Properties of Coatings: Polyesters- Polyvinyls- Polystyrenes- Acrylics- Diallylphthalates- Polyamides- Phenolics- PolysulfidesPOLYESTERS; POLYVINYLS; POLYSTYRENES; ACRYLICS; DIALLYLPHTHALATE AND OTHER ALLYLIC POLYMERS; POLYAMIDES; PHENOLICS; POLYSULFIDES; Chapter 4: Functions of Coatings; ELECTRICAL PROPERTIES; ENVIRONMENTAL PROTECTION; THERMAL CONDUCTIVITY; Chapter 5: Manufacturing Technology; CLEANING; APPLICATION METHODS; CURING AND POLYMERIZATION OF SOLID FILMS; THIN-FILM DEPOSITION; GENERAL PROPERTIES OF THIN-FILM POLYMER COATINGS; Chapter 6: Circuit Coatings ; CIRCUIT-BOARD COATINGSRESIST COATINGS; COATINGS FOR THIN- AND THICK-FILM CIRCUITS; Chapter 7: Coatings for Space Electronics; OUTGASSING; STERILIZATION; SPACE AND NUCLEAR RADIATION; Chapter 8: Wire and Coil Coatings; MAGNET-WIRE CLASSIFICATIONS; WIRE-COATING TYPES; IMPREGNATING VARNISHES; APPLICATION AND WINDING METHODS; TESTING WIRE COATINGS; EFFECTS OF RADIATION; STRIPPING OF WIRE COATINGS; Chapter 9: Coatings for Electronic Components and Devices; FUNCTIONS OF PLASTIC PACKAGING MATERIALS FOR DISCRETE DEVICES; PLASTIC PACKAGING MATERIALS; THIN-FILM COATINGS ; FUNCTIONS OF COATING MATERIALS FOR HYBRID MICROCIRCUITS28APPLICATION METHODS; PARAMETERS AFFECTING ELECTRONIC DEVICES; COMMERCIAL AND MILITARY USES OF PLASTIC PACKAGES; Chapter 10: Specifications; MATERIAL SPECIFICATIONS; PROCESS SPECIFICATIONS; ELECTRICAL-PERFORMANCE SPECIFICATIONS; COMMERCIAL, MILITARY, AND FEDERAL SPECIFICATIONS; TEST METHODS FOR ORGANIC COATINGS; Appendix; Index
• Sommario/riassunto: This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics. Since the original edition, the applications of coatings for the environmental protection of electronic systems have greatly increased, largely driven by the competitive need to reduce costs, weight and volume. The demands for high-speed circuits for the rapid processing of signals and data, high-density circuits for the storage and retrieval of megabits of memory, and the improved reliability required of electronics for guiding and controlling weapons and space vehicles have triggered
• Titolo autorizzato: Handbook of semiconductor silicon technology
• ISBN: 1-282-00278-3; 9786612002786; 1-59124-249-5
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9911006669103321
• Lo trovi qui: Univ. Federico II
• Serie: Materials science and process technology series.