Metal based thin films for electronics [[electronic resource] /] / Klaus Wetzig, Claus M. Schneider (eds.)

• Pubblicazione: Weinheim, : Wiley-VCH, c2003
• Descrizione fisica: 1 online resource (390 p.)
• Disciplina: 621.38152
• Soggetto topico: Thin films; Metallic films
• Altri autori: WetzigKlaus SchneiderClaus M (Claus Michael)
• Note generali: Description based upon print version of record.
• Nota di bibliografia: Includes bibliographical references and index.
• Nota di contenuto: Metal Based Thin Films for Electronics; List of Contributors; Contents; 1 Introduction; 2 Thin Film Systems: Basic Aspects; 2.1 Interconnects for Microelectronics; 2.1.1 Introduction; 2.1.2 Metallization Layers; 2.1.3 Materials Science of Metallic Interconnects; 2.1.4 Function of Barrier and Nucleation Layers and Materials Selection; 2.2 Metallization Structures in Acoustoelectronics; 2.2.1 Introduction; 2.2.2 Fundamentals of Surface Acoustic Waves; 2.2.3 Interdigital Transducers (IDTs); 2.2.4 Reflector Gratings; 2.2.5 Waveguides, Energy Trapping; 2.2.6 Multistrip Couplers ; 2.3 Silicide Layers for Electronics2.3.1 Introduction; 2.3.2 The Basic Chemical and Physical Properties; 2.3.3 Preparation of Silicides; 2.3.4 Silicides with Metallic Conductivity; 2.3.5 Semiconducting Silicides; 2.3.6 Heterogeneously Disordered Silicide Films; 2.4 Complex Layered Systems for Magnetoelectronics; 2.4.1 Introduction; 2.4.2 Magnetism: A Primer; 2.4.3 Magnetic Coupling Phenomena; 2.4.4 Electric Transport in Layered Magnetic Systems; 2.4.5 Functional Thin Film Systems; 2.5 Multilayer and Single-Surface Reflectors for X-Ray Optics; 2.5.1 Introduction ; 2.5.2 Refraction and Reflection at Single Boundaries2.5.3 Bragg Reflection at 1D Lattice Systems; 2.5.4 Multilayer Preparation; References; 3 Thin Film Preparation and Characterization Techniques; 3.1 Thin Film Preparation Methods; 3.1.1 Introduction; 3.1.2 Physical Vapor Deposition; 3.1.3 Chemical Vapor Deposition; 3.1.4 Non-Vacuum Based Deposition; 3.1.5 Outlook; 3.2 Electron Microscopy and Diffraction; 3.2.1 Transmission Electron Microscopy (TEM) - Imaging; 3.2.2 TEM - Selected Area Electron Diffraction; 3.2.3 In situ-SEM Methods; 3.2.4 Electron Backscatter Diffraction ; 3.3 X-Ray Scattering Techniques3.3.1 Wide Angle Diffraction; 3.3.2 Reflectometry; 3.3.3 Soft X-Rays and Magnetic Scattering; 3.4 Spectroscopic Techniques; 3.4.1 Element Distribution Analysis; 3.4.2 Element Depth Profile Analysis; 3.5 Stress Measurement Techniques; 3.5.1 Stress and Strain; 3.5.2 Substrate Curvature; 3.5.3 Measurement Techniques; References; 4 Challenges for Thin Film Systems Characterization and Optimization; 4.1 Electromigration in Metallization Layers; 4.1.1 Fundamentals; 4.1.2 Methods for Quantitative Damage Analysis; 4.1.3 Al Interconnects; 4.1.4 Cu Interconnects ; 4.2 Barrier and Nucleation Layers for Interconnects4.2.1 Introduction; 4.2.2 PVD Barrier Layers for Copper Interconnects; 4.2.3 Barrier/Seed Microstructure and Step Coverage; 4.2.4 New Barrier/Seed Concepts using CVD and ALD; 4.2.5 Atomic Layer Deposition (ALD); 4.3 Acoustomigration in Surface Acoustic Waves Structures; 4.3.1 General Remarks; 4.3.2 Acoustomigration Mechanism; 4.3.3 Metallization Concepts for Power SAW Structures; 4.3.4 Experimental Set-up; 4.3.5 Acoustomigration Experiments; 4.4 Thermal Stability of Magnetoresistive Layer Stacks ; 4.4.1 Metallic Multilayers as GMR Model Systems
• Sommario/riassunto: This up-to-date handbook covers the main topics of preparation, characterization and properties of complex metal-based layer systems. The authors -- an outstanding group of researchers -- discuss advanced methods for structure, chemical and electronic state characterization with reference to the properties of thin functional layers, such as metallization and barrier layers for microelectronics, magnetoresistive layers for GMR and TMR, sensor and resistance layers. As such, the book addresses materials specialists in industry, especially in microelectronics, as well as scientists, and can also
• Titolo autorizzato: Metal based thin films for electronics
• ISBN: 1-280-52109-0; 9786610521098; 3-527-60647-5; 3-527-60253-4
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910830309903321
• Lo trovi qui: Univ. Federico II