IC Component Sockets
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| Autore: |
Liu Weifeng
|
| Titolo: |
IC Component Sockets
|
| Pubblicazione: | [Place of publication not identified], : John Wiley & Sons Incorporated, 2004 |
| Descrizione fisica: | 1 online resource (230 pages) |
| Disciplina: | 621.381531 |
| Soggetto topico: | Printed circuits - Equipment and supplies |
| Electric connectors | |
| Microelectronic packaging | |
| Persona (resp. second.): | PechtMichael |
| Note generali: | Bibliographic Level Mode of Issuance: Monograph |
| Nota di bibliografia: | Includes bibliographical references and index. |
| Nota di contenuto: | 1. IC Component Socket Overview -- 2. Component Socket Properties -- 3. IC Component Socket Materials -- 4. Component Sockets for PTH Packages -- 5. Component Sockets for J-Leaded Packages -- 6. Component Sockets for Gull-wing Packages -- 7. Component Sockets for BGA Packages -- 8. Component Sockets for LGA Packages -- 9. Failure Modes and Mechanisms -- 10. Socket Testing and Qualification -- 11. Reliability Assessment -- 12. Standards and Specifications -- App. B. Socket Manufacturers. |
| Sommario/riassunto: | Although Integrated Circuit (IC) component sockets have assumed an essential role in IC design, test, and performance upgrade, there is currently no single source covering all aspects of IC component sockets. This book is a valuable reference for IC managers and engineers who face the challenges of grasping the rapid evolution of interconnection technology. |
| Titolo autorizzato: | IC Component Sockets |
| ISBN: | 1-280-55666-8 |
| 9786610556663 | |
| 0-471-64826-4 | |
| 0-471-64827-2 | |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910830106603321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |