A practical approach to VLSI System on Chip (SoC) design : a comprehensive guide / / Veena S. Chakravarthi

• Autore: Chakravarthi Veena S.
• Pubblicazione: Cham, Switzerland : , : Springer International Publishing, , [2022]; ©2022
• Edizione: Second edition.
• Descrizione fisica: 1 online resource (355 pages) : illustrations
• Disciplina: 621.395
• Soggetto topico: Integrated circuits - Very large scale integration - Design and construction; Systems on a chip
• Note generali: Includes index.
• Nota di contenuto: Intro -- Foreword to the First Edition by Faraj Aalaei -- Foreword to the First Edition by Ashok Soota -- Foreword to the First Edition by Walden C. Rhines -- Preface to the Second Edition -- Praise for the First Edition -- Preface to the First Edition -- About the Book -- Why read this book? -- What Problems Does It Solve? -- Who is the audience? -- What are the prerequisites to reading this book? -- Why become a VLSI designer? -- Contents -- Abbreviations -- Chapter 1: Introduction -- 1.1 Introduction to CMOS VLSI -- 1.2 Application Areas of SoC -- 1.3 Trends in VLSI -- 1.4 System on Chip Complexity -- 1.5 Integration Trend from Circuit to System on Chip -- 1.6 Speed of Operation -- 1.7 Die Size -- 1.8 Design Methodology -- 1.9 SoC Design and Development -- 1.10 Skill Set Required -- 1.11 EDA Environment -- 1.12 Challenges in All -- Reference -- Chapter 2: System on Chip (SoC) Design -- 2.1 Part 1 -- 2.1.1 System on Chip (SoC) -- 2.2 Constituents of SoC -- 2.2.1 Processor Subsystem Cores -- 2.3 Application-Specific Processors -- 2.4 Control Processors -- 2.5 Digital Signal Processors -- 2.6 Vector Processors -- 2.6.1 Embedded Memory Core -- 2.6.2 Analog Cores -- 2.6.3 Interface Cores -- 2.6.4 On-Chip Clock Generators, PLLs, and Sensors -- 2.7 Part 2 -- 2.7.1 SoC Development Life Cycle -- 2.8 SoC Design Requirements -- 2.9 Design Strategy -- 2.10 SoC Design Planning -- 2.11 System Modeling -- 2.12 System Module Development Feasibility Study -- 2.13 IP Design Decisions -- 2.14 Verification IPs -- 2.15 Target Technology Decision -- 2.16 Development Plan -- 2.17 EDA Tool Plan -- 2.18 Design Center Infrastructure -- 2.19 Computational Servers -- 2.20 Filers -- 2.21 Workstations -- 2.22 Backup Servers -- 2.23 Source Control Server -- 2.24 Firewalls -- 2.25 Resource Planning -- 2.26 SoC Design Flow -- 2.26.1 SoC Chip High-Level Design Methodology. ; 2.26.2 Digital SoC Core Development Flow -- 2.26.3 Processor Subsystem Core Design -- 2.26.4 SoC Integrated Design Flow -- 2.27 EVM Design Development Flow -- 2.28 Software Development Flow -- 2.29 Product Integration Flow -- Chapter 3: SoC Constituents -- 3.1 SoC Constituents -- 3.1.1 Embedded Processor Subsystem for System on Chip -- Choice of Embedded Processors for SoC -- Embedded General-Purpose RISC Processors -- 3.1.2 DSP Processors -- 3.2 Issues of Hw-Sw Co-Design -- 3.2.1 Processor Subsystems -- 3.2.2 Processor Configuration Tools -- 3.2.3 Processor Development Boards -- 3.3 Embedded Memories -- 3.3.1 Types of Memories -- 3.3.2 Choice of Memories -- 3.3.3 Memory Compiler and Compiled Memories -- 3.4 Protocol Blocks -- 3.5 Mixed Signal Blocks -- 3.6 Radio Frequency (RF) Control Blocks -- 3.7 Analog Blocks -- 3.8 Third-Party IP Cores -- 3.9 System Software -- 3.9.1 OSI System Model -- Physical Layer (Layer 1) -- Data Link Layer (Layer 2) -- Network Layer (Layer 3) -- Transport Layer (Layer 4) -- Session Layer (Layer 5) -- Presentation Layer (Layer 6) -- Application Layer (Layer 7) -- 3.10 GAMP Classification of Software -- 3.10.1 Hardware -- 3.10.2 Device Driver -- 3.10.3 Firmware -- 3.10.4 Middleware -- 3.10.5 Software -- 3.10.6 Cloud -- 3.11 Design-Specific Blocks -- Chapter 4: VLSI Logic Design and HDL -- 4.1 SoC Design Concepts -- 4.1.1 Logic Design Fundamentals -- 4.1.2 System Clock and Clock Domains -- 4.1.3 Asynchronous and Synchronous Resets -- Metastability -- Standard Cells and Compiled Logic Blocks -- Hard and Soft Macros -- Data Buffers and Buffer Managers -- Design Assertions -- 4.1.4 Synchronous Sequential Functional Blocks -- 4.2 Asynchronous Circuits -- 4.3 Speed Matching -- 4.4 Network on Chip Architecture -- 4.5 Hardware Accelerator -- 4.6 Hardware Description Languages (HDL) -- 4.7 Behavioral Modelling of the Hardware System. ; 4.8 Dataflow Modeling of the Hardware System -- 4.9 Structural Modeling of the Hardware System -- 4.10 Input-Output Pad Instantiation -- 4.10.1 Power Ground Corner Pad Instantiation (Fig. 4.17) -- Chapter 5: Synthesis and Static Timing Analysis (STA) -- 5.1 Part 1: SoC Synthesis -- 5.1.1 Set Synthesis Environment -- Read Library -- Read HDL Design Files -- Elaborate the Design Files -- Read Design Constraints -- Optimization Constraint -- Synthesis -- Analyze -- Generate Reports -- 5.1.2 SoC Design Constraints -- 5.2 Design Rule Constraints -- 5.3 SoC Design Synthesis -- 5.4 Low-Power Synthesis -- 5.4.1 Introduction to Low-Power SoCs -- 5.4.2 Universal Power Format (UPF) -- 5.5 Reports -- 5.5.1 Gate Level Netlist Verification -- 5.6 Part 2: Static Timing Analysis (STA) -- 5.7 Timing Definition -- 5.8 Timing Delay Calculation Concepts -- 5.9 Timing Analysis -- 5.10 Modeling Process, Voltage, and Temperature Variations -- 5.10.1 Equivalent Cells -- 5.11 Timing and Design Constraints -- 5.12 Organizing Paths to Groups -- 5.13 Design Corners -- 5.14 Challenges of STA During SoC Design -- Chapter 6: SoC Design for Testability (DFT) -- 6.1 Need for Testability -- 6.2 Guidelines for SoC Design for Testability -- 6.3 DFT Logic Insertion Techniques -- 6.3.1 Scan Insertion -- 6.3.2 Boundary Scan -- 6.4 Boundary Scan Insertion Flow -- 6.4.1 Memory Built-in Self-Test (MBIST) -- 6.4.2 Stuck-at Faults -- 6.4.3 Transition Faults -- 6.4.4 Coupling Faults -- 6.4.5 Neighborhood Pattern-Sensitive Faults -- 6.4.6 MBIST Algorithms -- 6.5 ROM Test Algorithm -- 6.6 Power Aware Test Module (PATM) Insertion -- 6.6.1 Logic BIST Insertion -- 6.6.2 Writing out DFT SDC -- 6.6.3 Compression Insertion -- 6.7 On-SoC Clock Generation (OSCG) Insertion -- 6.8 Challenges in SoC DFT -- 6.9 Memory Clustering -- 6.10 DFT Simulations -- 6.11 ATPG Pattern Generation. ; 6.12 Automatic Test Equipment Testing (ATE Testing) -- Chapter 7: SoC Design Verification -- 7.1 Importance of Verification -- 7.2 Verification Plan and Strategies -- 7.3 Verification Plan -- 7.4 Functional Verification -- 7.5 Verification Methods -- 7.5.1 Black Box Verification -- 7.5.2 White Box Verification -- 7.5.3 Gray Box Verification -- 7.6 Design for Verification -- 7.7 Verification Example -- 7.8 Verification Tools -- 7.9 Verification Language -- 7.10 Automation Scripts -- 7.11 Design for Verification -- 7.12 Assertions in Verification -- 7.13 Verification Reuse and Verification IPs -- 7.14 Universal Verification Methodology (UVM) -- 7.15 Bug and Debug -- 7.16 Bug Tracking Workflow -- 7.17 Formal Verification -- 7.18 FPGA Validation -- 7.19 Validation on Development Boards -- Chapter 8: SoC Physical Design -- 8.1 Re-convergent Model of VLSI SoC Design -- 8.2 File Formats -- 8.3 SoC Physical Design -- 8.4 Physical Design Theory -- 8.5 Stick Diagrams -- 8.6 Physical Design Setup and Floor Plan -- 8.7 Floor Planning -- 8.8 SoC Power Plan -- 8.9 Two-Step Synthesis of SoC Design -- 8.10 Placement -- 8.11 Physical Design Constraints -- 8.12 Clock Tree Synthesis (CTS) -- 8.13 Routing -- 8.14 ECO Implementation -- 8.15 Advanced Physical Design of SOCs -- 8.15.1 For Low-Power Consumption -- 8.15.2 For Advanced Technology -- 8.15.3 High Performance -- 8.16 Photolithography and Mask Pattern -- Chapter 9: SoC Physical Design Verification -- 9.1 SoC Design Verification by Formal Verification -- 9.2 Model Checking -- 9.3 Logic Equivalence Check (LEC) -- 9.4 Static Timing Analysis (STA) -- 9.5 ECO Checks -- 9.6 Electromigration (EM) -- 9.7 Simultaneous Switching Noise (SSN) -- 9.8 Electrostatic Discharge (ESD) Protection -- 9.9 IR and Cross Talk Analysis -- 9.10 Layout Verse Schematic (LVS) -- 9.11 Gate Level Simulation -- 9.12 Electrical Rule Check (ERC). ; 9.13 DRC Rule Check -- 9.14 Design Rule Violation (DRV) Checks -- 9.15 Design Tape Out -- Chapter 10: SoC Packaging -- 10.1 Introduction to VLSI SoC Packaging -- 10.2 Classification of Packages -- 10.3 Criteria for Selection of Packages -- 10.4 Package Components -- 10.5 Package Assembly Flow -- 10.6 Packaging Technology -- 10.7 Flip-Chip Packages -- 10.8 Typical Packages -- 10.9 Package Performance -- 10.10 System Integration -- 10.11 Packaging Trends -- 10.11.1 Stacked Die Integration -- 10.11.2 3D Integration Schemes -- Chapter 11: Reference Designs -- 11.1 Design for Trial -- 11.2 Prerequisites -- 11.3 User Guidelines -- 11.4 Design Directory -- 11.5 Part 1 -- 11.6 Design Examples -- 11.7 Part II -- 11.7.1 Design Flow -- 11.7.2 Logic Equivalence Check (LEC) -- 11.8 Part III -- 11.8.1 MINI-SoC Design -- IO Diagram -- Index.
• Titolo autorizzato: A Practical Approach to VLSI System on Chip (SoC) Design
• ISBN: 9783031183638; 9783031183621
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 996503565003316
• Lo trovi qui: Univ. di Salerno