Heat conduction within linear thermoelasticity / William Alan Day

• Autore: Day, William A.
• Pubblicazione: New York, : Springer, 1985
• Descrizione fisica: VIII, 82 p. ; 23 cm
• Soggetto topico: 35K05 - Heat equation [MSC 2020]; 74-XX - Mechanics of deformable solids [MSC 2020]; 35K55 - Nonlinear parabolic equations [MSC 2020]; 74F05 - Thermal effects in solid mechanics [MSC 2020]; 74A15 - Thermodynamics in solid mechanics [MSC 2020]; 80A19 - Diffusive and convective heat and mass transfer, heat flow [MSC 2020]; 80A21 - Radiative heat transfer [MSC 2020]
• Soggetto non controllato: Developments; Differential equations; Elasticity; Entropy; Growth; Heat; Influence; Integrals; Maximum; Minimum; Partial differential equations; Solutions; Temperature
• Titolo autorizzato: Heat conduction within linear thermoelasticity
• ISBN: 978-03-87961-56-9
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: VAN0054574
• Lo trovi qui: Univ. Vanvitelli
• Localizzazioni e accesso elettronico: /sebina/repository/catalogazione/documenti/Day - Heat conduction within linear thermoelasticity.pdf
• Serie: Springer tracts in natural philosophy Berlin [etc.] . -Springer ; 30