Proceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits [IPFA '97 : 21-25 July, 1997, Raffles City Convention Centre, Singapore
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| Titolo: |
Proceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits [IPFA '97 : 21-25 July, 1997, Raffles City Convention Centre, Singapore
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| Pubblicazione: | [Place of publication not identified], : Institute of Electrical and Electronics Engineers, 1997 |
| Disciplina: | 621.3815 |
| Soggetto topico: | Integrated circuits - Congresses - Defects |
| Integrated circuits - Congresses - Testing | |
| Electrical & Computer Engineering | |
| Engineering & Applied Sciences | |
| Electrical Engineering | |
| Persona (resp. second.): | HoPhilip |
| RadhakrishnanM. K | |
| ChimWai Kin | |
| Note generali: | Bibliographic Level Mode of Issuance: Monograph |
| Titolo autorizzato: | Proceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910872407503321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |