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[null,"1.","Record Nr.",null,"UNISA996575519503316"]
[null,null,"Titolo",null,"2020 IEEE 26th International Symposium on On-Line Testing and Robust System Design (IOLTS) / / Institute of Electrical and Electronics Engineers"]
[null,null,"Pubbl/distr/stampa",null,"[Place of publication not identified] : , : Institute of Electrical and Electronics Engineers, , 2020"]
[null,null,"ISBN",null,"1-7281-8187-9"]
[null,null,"Descrizione fisica",null,"1 online resource"]
[null,null,"Disciplina",null,"519.5"]
[null,null,"Soggetti",null,"Robust statistics"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Sommario/riassunto","On Line Testing and Robust Electronic System Design."]
[null,"2.","Record Nr.",null,"UNINA9910576876203321"]
[null,null,"Autore",null,"Seok Seonho"]
[null,null,"Titolo",null,"MEMS Packaging Technologies and 3D Integration"]
[null,null,"Pubbl/distr/stampa",null,"MDPI - Multidisciplinary Digital Publishing Institute, 2022"]
[null,null,"Descrizione fisica",null,"1 online resource (210 p.)"]
[null,null,"Soggetti",null,"Biology, life sciences"]
[{"$nulls":4},"Research & information: general"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Sommario/riassunto","This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation."]