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[null,"1.","Record Nr.",null,"UNISA996499862603316"]
[null,null,"Autore",null,"Tong Xingcun Colin"]
[null,null,"Titolo",null,"Advanced materials and components for 5G and beyond / / Colin Tong"]
[null,null,"Pubbl/distr/stampa",null,"Cham, Switzerland : , : Springer, , [2022]"]
[{"$nulls":4},"©2022"]
[null,null,"ISBN",null,"9783031172076"]
[{"$nulls":4},"9783031172069"]
[null,null,"Descrizione fisica",null,"1 online resource (276 pages)"]
[null,null,"Collana",null,"Springer Series in Materials Science ; ; v.327"]
[null,null,"Disciplina",null,"405"]
[null,null,"Soggetti",null,"Physics"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"Intro -- Preface -- Contents -- Abbreviations -- About the Author -- Chapter 1: 5G Technology Components and Material Solutions for Hardware System Integration -- 1.1 Evolution of 5G Technology -- 1.2 5G Technology Components -- 1.2.1 5G Spectrum -- 1.2.2 Massive Multiple-Input Multiple-Output (MIMO) Antennas -- 1.2.3 Network Slicing -- 1.2.4 Dual Connectivity and Long Term Evolution (LTE) Coexistence -- 1.2.5 Support for Cloud Implementation and Edge Computing -- 1.3 Materials Solutions for 5G Hardware System Integration -- 1.3.1 Evolution of the Cellular Base Station and Its Construction Materials -- 1.3.2 Drivers to 5G Hardware System Integration -- 1.3.3 Materials and Electronic Components for 5G Packaging Technology -- 1.3.3.1 Packaging Requirements for 5G Systems -- 1.3.3.2 Dielectric Materials for 5G Module Packages -- 1.3.3.3 Microwave Circuit Design and Materials -- 1.3.3.4 Thermal Conductors and Thermal Management for 5G -- 1.3.3.5 Integration of Passive Components -- 1.3.3.5.1 Discrete Lumped Circuits for sub6 GHz 5G Bands -- 1.3.3.5.2 Distributed Components for mm-Wave -- 1.3.3.6 Antenna Systems in Package -- 1.3.3.7 High-Precision Patterning in Heterogeneous Package Integration for 5G -- 1.3.4 Nanomaterials for Nanoantennas in 5G -- 1.4 Challenges in 5G and Beyond - 6G -- 1.5 Outlook and Future Perspectives -- References -- Chapter 2: Semiconductor Solutions for 5G -- 2.1 Evolution of 5G Semiconductor Technologies -- 2.2 Effect of CMOS Technology Scaling on Millimeter Wave Operations -- 2.3 Distributed and Lumped Design Approaches for Fabricating Passives -- 2.3.1 Distributed Approach -- "]
[{"$nulls":4},"2.3.2 Lumped approach -- 2.4 Comparison of Silicon and III-V Semiconductors -- 2.5 Transistor Model Design Challenge in CMOS Technology -- 2.6 GaN and GaN-on-SiC Wide Bandgap Semiconductors for 5G Applications."]
[{"$nulls":4},"2.6.1 Characteristics of GaN Devices Applied in 5G Technology -- 2.6.2 GaN Power Integration for MMIC in 5G Technology -- 2.6.2.1 GaN Power Integration for MMICS -- 2.6.2.2 GaN Base Station PAs -- 2.6.2.3 GaN Frequency Synthesis -- References -- Chapter 3: Design and Performance Enhancement for 5G Antennas -- 3.1 5G Antenna Classification -- 3.1.1 Classification Based on Input and Output Ports -- 3.1.2 Classification Based on Antenna Types -- 3.2 Performance Enhancement Techniques for 5G Antenna Design -- 3.2.1 General Antenna Performance Enhancement Techniques -- 3.2.2 Mutual Coupling Reduction (Decoupling) Techniques -- 3.3 Structural Design and Building Materials of 5G Antennas -- 3.3.1 SISO Wideband Antennas -- 3.3.1.1 Single Element Antenna -- 3.3.1.2 Multielement Antennas -- 3.3.2 SISO Multiband Antenna -- 3.3.3 MIMO Wideband Antennas -- 3.3.3.1 Multielement Without Metal Rim Antennas -- 3.3.3.1.1 Dual Element Antenna Without Metal Rim -- 3.3.3.1.2 Multielement Antenna Without Metal Rim -- 3.3.3.1.3 Multielement Antenna with Metal Rim -- 3.3.4 MIMO Multiband Antennas -- References -- Chapter 4: PCB Materials and Design Requirements for 5G Systems -- 4.1 The Evolution of Printed Circuit Boards -- 4.1.1 History -- 4.1.2 Materials and Fabrication Process -- 4.2 RF and High Frequency PCB Technologies -- 4.2.1 Basic Circuit Configuration of High-Frequency PCBs -- 4.2.2 Transmission Line Parameters Used in RF/High Frequency PCB Design -- 4.3 Designing High-Frequency PCBs -- 4.3.1 Variables Affecting the Performance of High-Frequency PCBs -- 4.3.2 High-Frequency PCB Layout Techniques -- 4.4 Materials Selection of PCBs for Millimeter Wave Applications -- 4.4.1 High-Frequency PCB Material Selection Guidelines -- 4.4.2 PCB Materials Used for High-Frequency Applications -- 4.4.2.1 PCB Substrate Materials -- 4.4.2.2 Conductors for High-Frequency PCBs."]
[{"$nulls":4},"4.5 The Role of Materials in High Frequency PCB Fabrication -- 4.6 Material Issues Related to 5G Applications -- 4.6.1 Mixed Signal Acceptance Circuit Board Designs -- 4.6.2 EMI Shielding Challenges -- 4.6.3 Impedance Control and Signal Loss -- 4.6.4 Thermal Management Challenges -- 4.6.5 Moisture Absorption -- References -- Chapter 5: Materials for High Frequency Filters -- 5.1 The 5G Effect on Filter Technologies -- 5.1.1 Current Status of Mobile Device Filter Technologies -- 5.1.2 The 5G Filter Performance Challenges -- 5.1.2.1 The 5G Frequency Spectrum -- 5.1.2.2 The 5G Filter Requirements -- 5.1.2.3 Physical Design and Emerging Solutions for the 5G Filters -- 5.2 Materials and Design for Acoustic Filters -- 5.2.1 Current Application and Band Allocation of Acoustic Filter Technology -- 5.2.2 Basic Working Principle of the BAW Filter -- 5.2.2.1 Structure of the BAW Resonator -- 5.2.2.2 Key Parameters of the BAW Resonator -- 5.2.2.3 Topology of the BAW Filter -- 5.2.3 Materials for the BAW Resonator -- 5.2.3.1 Piezoelectric Materials -- 5.2.3.2 Electrode Materials -- 5.2.4 Temperature Compensation -- 5.2.5 Frequency Tenability -- 5.2.6 Lithium Niobate and Laterally Excited Bulk-Wave Resonators (XBAR) -- 5.3 Microwave and Millimeter Wave Filters Based on MEMS Technology -- 5.3.1 Micromachined Filters -- 5.3.1.1 Surface Micromachining Superconductor Filters -- 5.3.1.2 Planar Microstrip Filters -- 5.3.1.3 Coplanar Waveguide Filters -- 5.3.1.4 Micromachined Dielectric Waveguide Resonate Filters -- 5.3.2 Micromachined Tunable Filters -- 5.4 Metamaterial and Metasurface Filters for 5G Communications -- References -- Chapter 6: EMI Shielding Materials "]
[{"$nulls":4},"and Absorbers for 5G Communications -- 6.1 EMI Shielding Design Principle in 5G Systems -- 6.2 Component Package-Level EMI Shielding for 5G Modules -- 6.3 Board Level EMI Shielding for 5G Systems."]
[{"$nulls":4},"6.4 Design and Materials Selection for 5G Absorbers -- 6.5 Advanced Metallic Composite Materials for High-Frequency EMI Shielding -- 6.5.1 Hollow and Porous Metal-Based EMI Shielding Materials -- 6.5.2 Metal-Based EMI Shielding Composites with Frequency-Selective Transmission -- 6.5.3 Particle-Based EMI Shielding Metallic Composites -- 6.5.4 MXene-Based EMI Shielding Composites -- 6.5.5 Metal-Based Flexible EMI Shielding Materials -- 6.6 Emerging Polymer-Based EMI Shielding and Absorber Materials -- References -- Chapter 7: Thermal Management Materials and Components for 5G Devices -- 7.1 Thermal Management Challenges and Strategies in 5G Devices -- 7.1.1 Form Factor-Constrained Thermal Management Solutions -- 7.1.2 5G Mobile Device Level Thermal Management -- 7.1.3 Base Station Level Thermal Management -- 7.1.4 Emerging Thermal Management Challenges and Strategies -- 7.2 Thermal Management Materials and Components for 5G-Enabled Mobile Devices -- 7.2.1 Thermal Management Design and Fundamental Solutions for Smartphones -- 7.2.1.1 Thermal Management Design Guideline -- 7.2.1.2 Fundamental Thermal Management Solutions -- 7.2.1.2.1 Heat Conduction and Spreading -- 7.2.1.2.2 Convective Air Cooling -- 7.2.1.2.3 Convective Liquid Cooling -- 7.2.2 Material Selection for Heat Spreaders and Heat Sinks -- 7.2.3 Flat Plate Heat Pipes and Vapor Chambers for Mobile Electronic Devices -- 7.2.4 Thermal Interface Materials -- 7.2.5 Thermal Insulation Materials -- 7.2.6 Thermal Metamaterials -- 7.3 Thermal Management of 5G Base Station Antenna Arrays -- 7.3.1 Cooling in Traditional AESA's -- 7.3.2 Cooling in Planar AESA's -- 7.3.3 Antenna Array Cooling at Millimeter Waves -- 7.4 Thermal Management of 5G Edge Computing -- References -- Chapter 8: Protective Packaging and Sealing Materials for 5G Mobile Devices."]
[{"$nulls":4},"8.1 Design of 5G Millimeter Wave Compatible Covers for High-End Mobile Devices -- 8.1.1 Dielectric Cover Design -- 8.1.2 Metallic Cover Design with Inserted Dielectric Slots -- 8.1.3 Integration Design Consideration -- 8.2 Thin Film Encapsulation in 5G Electronic Packaging -- 8.3 Adhesives and Sealants for 5G Systems -- References -- Chapter 9: Perspectives on 5G and Beyond Applications and Related Technologies -- 9.1 Applications in Industry Verticals and Their Needs -- 9.1.1 5G in Automotive -- 9.1.2 Big Data Analytics in 5G -- 9.1.3 5G Emergency Communications -- 9.1.4 Future Factories Enabled by 5G Technology -- 9.1.5 Smart Health-Care Network Based on 5G -- 9.1.6 5G Technology for Smart Energy Management and Smart Cities -- 9.1.6.1 5G Technology for Smart Cities -- 9.1.6.2 Applications of 5G Technology in the Construction Industry and Infrastructures -- 9.1.6.3 Smart Building System Integrated with 5G Communication Technology -- 9.2 Perspectives on 6G Wireless Communications -- 9.3 Challenges and Prospects of Core Materials and Components for 5G and Beyond -- 9.3.1 Ultralow-Loss High-Reliability Copper-Clad Laminates -- 9.3.2 5G Metamaterials and Low-Loss High-Performance RF Technology -- 9.3.3 5G Low-Loss Magnetoelectric Functional Materials and Devices -- 9.3.4 Multimodule Integrated Printed Circuit Boards -- 9.3.5 Manufacturing Technology of Photoelectric Integrated Cables -- 9.3.6 Photonics-Assisted Ultrabroadband RF Transceiver Integrated Modules -- 9.3.7 All-Optical Network and Superlarge-Core Fiber Optic Cables -- References -- Index."]
[null,"2.","Record Nr.",null,"UNINA9910791978603321"]
[null,null,"Autore",null,"Macdougall J. D. <1944->"]
[null,null,"Titolo",null,"Why geology matters [[electronic resource] ] : decoding the past, anticipating the future / / Doug Macdougall"]
[null,null,"Pubbl/distr/stampa",null,"Berkeley, : University of California Press, c2011"]
[null,null,"ISBN",null,"1-283-27799-9"]
[{"$nulls":4},"9786613277992"]
[{"$nulls":4},"0-520-94892-0"]
[null,null,"Descrizione fisica",null,"1 online resource (305 p.)"]
[null,null,"Classificazione",null,"RB 10123"]
[null,null,"Disciplina",null,"551.7"]
[null,null,"Soggetti",null,"Historical geology"]
[{"$nulls":4},"Geology"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"Frontmatter -- Contents -- Illustrations -- Preface -- Acknowledgments -- Chapter One. Set in Stone -- Chapter Two. Building Our Planet -- Chapter Three. Close Encounters -- Chapter Four. The First Two Billion Years -- Chapter Five. Wandering Plates -- Chapter Six. Shaky Foundations -- Chapter Seven. Mountains, Life, and the Big Chill -- Chapter Eight. Cold Times -- Chapter Nine. The Great Warming -- Chapter Ten. Reading LIPs -- Chapter Eleven. Restless Giants -- Chapter Twelve. Swimming, Crawling, and Flying toward the Present -- Chapter Thirteen. Why Geology Matters -- Bibliography and Further Reading -- Index"]
[null,null,null,"Sommario/riassunto","Volcanic dust, climate change, tsunamis, earthquakes-geoscience explores phenomena that profoundly affect our lives. But more than that, as Doug Macdougall makes clear, the science also provides important clues to the future of the planet. In an entertaining and accessibly written narrative, Macdougall gives an overview of Earth's astonishing history based on information extracted from rocks, ice cores, and other natural archives. He explores such questions as: What is the risk of an asteroid striking Earth? Why does the temperature of the ocean millions of years ago matter today? How are efforts to predict earthquakes progressing? Macdougall also explains the legacy of greenhouse gases from Earth's past and shows how that legacy shapes our understanding of today's human-caused climate change. We find that geoscience in fact illuminates many of today's most pressing "]
[{"$nulls":4},"issues-the availability of energy, access to fresh water, sustainable agriculture, maintaining biodiversity-and we discover how, by applying new technologies and ideas, we can use it to prepare for the future."]