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[null,"1.","Record Nr.",null,"UNISA996280928103316"]
[null,null,"Titolo",null,"2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) : New Orleans, LA, USA 11-14 October 2015 / / Institute of Electrical and Electronics Engineers"]
[null,null,"Pubbl/distr/stampa",null,"Piscataway, New Jersey : , : IEEE, , 2015"]
[null,null,"ISBN",null,"1-4799-8494-9"]
[null,null,"Descrizione fisica",null,"1 online resource (291 pages) : illustrations"]
[null,null,"Disciplina",null,"621.38152"]
[null,null,"Soggetti",null,"Compound semiconductors"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Includes index."]
[null,null,null,"Sommario/riassunto","CSICS is a technology and integrated circuit conference showcasing many of the finest achievements made in compound semiconductor technology and circuits CSICS has grown to encompass GaAs, InP, GaN, SiGe, SiC, InSb, nano scale CMOS, and graphene semiconductor technologies and their application to RF, mm wave, high speed, and energy conversion circuits and systems Specific technical areas of interest include Innovative device concepts in emerging technologies, Nitrides, InP, III V on Si, Ge on Si, Graphene, Analog, RF, mixed signal, mm wave, THz circuit blocks and ICs in III V, CMOS, SiGe BiCMOS, Power conversion circuits and technologies, Optoelectronic and photonic devices and ICs, System applications, Wireless handsets and base stations, Vehicular and military RADAR, High speed digital systems, Fiber optics and photonics, Device and circuit modeling EM and EDA tools, Thermal simulation and advanced packaging of high power devices and ICs, Device and IC manufacturing processes."]