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[null,"1.","Record Nr.",null,"UNISA996279447203316"]
[null,null,"Titolo",null,"2015 International 3D Systems Integration Conference (3DIC 2015) : Sendai, Japan, 31 August - 2 September 2015 / / Institute of Electrical and Electronics Engineers"]
[null,null,"Pubbl/distr/stampa",null,"Piscataway, NJ : , : IEEE, , [2015]"]
[{"$nulls":4},"©2015"]
[null,null,"ISBN",null,"1-4673-9385-1"]
[{"$nulls":4},"1-4673-9386-X"]
[null,null,"Descrizione fisica",null,"1 online resource (353 pages) : illustrations"]
[null,null,"Disciplina",null,"621"]
[null,null,"Soggetti",null,"Three-dimensional integrated circuits"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Includes index."]
[null,null,null,"Sommario/riassunto","Annotation The IEEE 3DIC 2015 will cover all 3D integration topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications."]