{"text_format":"2","workbook":"xls","n_sheets":1,"sheets":["report2"],"not_rendered":{"charts":0,"images":0,"macros":0,"external_links":1,"defined_names":4,"comments":0,"pivot_tables":0},"unopened":[],"bounds":{"document_bytes":16777216,"sheet_cells":100000,"run_cost":"one","rows_first":2000,"rows_last":500,"rows_between":2000,"halvings":0,"cell_chars":16384,"cell_head_chars":4096},"cells_cut":0,"cells_raw":0,"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"report2","index":0,"n_rows":66,"n_cols":5,"rows_kept":66,"cut":false,"hidden":false,"merged":[[0,2,0,3],[0,4,0,5],[1,2,1,3],[1,4,1,5],[2,2,2,3],[2,4,2,5],[3,2,3,3],[4,2,4,3],[5,2,5,3],[6,2,6,3],[7,2,7,3],[8,2,8,3],[9,2,9,3],[10,2,10,3],[11,2,11,3],[14,2,14,3],[14,4,14,5],[15,2,15,3],[15,4,15,5],[16,2,16,3],[16,4,16,5],[17,2,17,3],[18,2,18,3],[19,2,19,3],[20,2,20,3],[21,2,21,3],[22,2,22,3],[29,2,29,3],[30,2,30,3],[32,2,32,3],[35,2,35,3],[35,4,35,5],[36,2,36,3],[36,4,36,5],[37,2,37,3],[37,4,37,5],[38,2,38,3],[39,2,39,3],[40,2,40,3],[41,2,41,3],[43,2,43,3],[43,4,43,5],[44,2,44,3],[44,4,44,5],[45,2,45,3],[45,4,45,5],[46,2,46,3],[47,2,47,3],[48,2,48,3],[49,2,49,3],[50,2,50,3],[51,2,51,3],[52,2,52,3],[60,2,60,3],[61,2,61,3],[63,2,63,3]],"flags":["formulas_cached_only"]}
[null,"1.","Record Nr.",null,"UNISALENTO991001446479707536"]
[null,null,"Autore",null,"Zaidman, Samuel"]
[null,null,"Titolo",null,"Topics in pseudo-differential operators / S. Zaidman"]
[null,null,"Pubbl/distr/stampa",null,"Harlow : Longman ; Reading, Mass. : Addison Wesley Longman, 1996"]
[null,null,"ISBN",null,"0582277825"]
[null,null,"Descrizione fisica",null,"117 p. ; 25 cm."]
[null,null,"Collana",null,"Pitman research notes in mathematics series, ISSN 02693674 ; 359"]
[null,null,"Classificazione",null,"AMS 35S05"]
[null,null,"Disciplina",null,"515.353"]
[null,null,"Soggetti",null,"Pseudodifferential operators"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Includes bibliographical references and indexes"]
[null,"2.","Record Nr.",null,"UNINA9910350298303321"]
[null,null,"Autore",null,"Lau John H."]
[null,null,"Titolo",null,"Heterogeneous integrations / / by John H. Lau"]
[null,null,"Pubbl/distr/stampa",null,"Singapore : , : Springer Singapore : , : Imprint : Springer, , [2019]"]
[null,null,"ISBN",null,"981-13-7224-1"]
[null,null,"Edizione",null,"[1st ed. 2019.]"]
[null,null,"Descrizione fisica",null,"1 online resource (XXII, 368 p. 386 illus., 342 illus. in color.)"]
[null,null,"Disciplina",null,"621.381"]
[null,null,"Soggetti",null,"Integrated circuits"]
[{"$nulls":4},"Electronics"]
[{"$nulls":4},"Microelectronics"]
[{"$nulls":4},"Electronic circuits"]
[{"$nulls":4},"Electronics and Microelectronics, Instrumentation"]
[{"$nulls":4},"Circuits and Systems"]
[{"$nulls":4},"Electronic Circuits and Devices"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,"Nota di contenuto",null,"Chapter 1. Overview of 3D IC Heterogeneous Integrations -- Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates -- Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers) -- Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges) -- Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates -- Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking -- Chapter 7. 3D IC Heterogeneous Integration in PoP Formats -- Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats -- Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL -- Chapter 10. Future Trends of 3D IC Heterogeneous Integrations."]
[null,null,null,"Sommario/riassunto","Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for "]
[{"$nulls":4},"researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc."]
[null,"3.","Record Nr.",null,"UNIORUON00436905"]
[null,null,"Autore",null,"PRILEPIN, Zachar"]
[null,null,"Titolo",null,"Leonid Leonov: \"Igra ego byla ogromna\" / Zachar Prilepin. Moskva: Molodaja gvardija, 2010"]
[null,null,"Pubbl/distr/stampa",null,"569 p., : tav. ; 22 cm."]
[null,null,"ISBN",null,"978-52-350-3318-4"]
[null,null,"Lingua di pubblicazione",null,"Russo"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,"4.","Record Nr.",null,"UNINA9911010537003321"]
[null,null,"Autore",null,"Ullah Abrar"]
[null,null,"Titolo",null,"Proceedings of International Conference on Information Technology and Applications : ICITA 2024 / / edited by Abrar Ullah, Sajid Anwar"]
[null,null,"Pubbl/distr/stampa",null,"Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2025"]
[null,null,"ISBN",null,"981-9617-58-8"]
[null,null,"Edizione",null,"[1st ed. 2025.]"]
[null,null,"Descrizione fisica",null,"1 online resource (956 pages)"]
[null,null,"Collana",null,"Lecture Notes in Networks and Systems, , 2367-3389 ; ; 1248"]
[null,null,"Disciplina",null,"006.3"]
[null,null,"Soggetti",null,"Computational intelligence"]
[{"$nulls":4},"Artificial intelligence"]
[{"$nulls":4},"Telecommunication"]
[{"$nulls":4},"Mathematical statistics - Data processing"]
[{"$nulls":4},"Computational Intelligence"]
[{"$nulls":4},"Artificial Intelligence"]
[{"$nulls":4},"Communications Engineering, Networks"]
[{"$nulls":4},"Statistics and Computing"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,"Nota di contenuto",null,"Unveiling the Hidden Pandemic of IoT Malware with Biological and Health Approaches -- Auditing Windows Bluetooth Security at the Application Layer -- Comparison of Machine Learning Models for Early Prediction of Diabetes with LIME Interpretability -- Pattern Recognition in Disaster Response: Leveraging Machine Learning for Twitter Analysis -- TTL: Transformer and Transfer Learning Approach To Detect Sunflower Disease -- The Moderating Role of Risk Aversion in an Extended UTAUT Cryptocurrency Adoption Model -- NLP on Text Messages using Sentimentality Investigation -- Audio-Visual Features-based Framework for Advertisement Detection from Sports Videos -- Context-aware Medical Question Answering: An Extended Transformers-Based Approach with BioBERT Encoding for Restricted Domain Queries -- Enhancing Seabass Detection in Aquaculture: A Step Towards Automated Behavioural Analysis using AI."]
[null,null,null,"Sommario/riassunto","This book includes high-quality papers presented at 18th International Conference on Information Technology and Applications (ICITA 2024), held in Sydney, Australia, during October 17–19, 2024. The book presents original research work of academics and industry "]
[{"$nulls":4},"professionals to exchange their knowledge of the state-of-the-art research and development in information technology and applications. The topics covered in the book are cloud computing, business process engineering, machine learning, evolutionary computing, big data analytics, internet of things and cyber-physical systems, information and knowledge management, computer vision and image processing, computer graphics and games programming, mobile computing, ontology engineering, software and systems modeling, human computer interaction, online learning /e-learning, computer networks, and web engineering."]