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[null,"1.","Record Nr.",null,"UNIORUON00280930"]
[null,null,"Autore",null,"DEMOSTHENES, M."]
[null,null,"Titolo",null,"Estudos sobre a Nova Capital do Brasil / M. Demosthenes"]
[null,null,"Pubbl/distr/stampa",null,"Rio de Janeiro, : Livraria Agir Editora, 1947"]
[null,null,"Descrizione fisica",null,"XVI, 150 p. ; 23 cm."]
[null,null,"Soggetti",null,"BRASILE - Geografia - Studi"]
[null,null,"Lingua di pubblicazione",null,"Italiano"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,"2.","Record Nr.",null,"UNINA9911007137703321"]
[null,null,"Autore",null,"Pocius Alphonsus V"]
[null,null,"Titolo",null,"Adhesion and Adhesives Technology : An Introduction / / Alphonsus V. Pocius"]
[null,null,"Pubbl/distr/stampa",null,"München : , : Hanser, , 2021"]
[{"$nulls":4},"©2021"]
[null,null,"ISBN",null,"9781523145096"]
[{"$nulls":4},"1523145099"]
[{"$nulls":4},"9781569908501"]
[{"$nulls":4},"1569908508"]
[null,null,"Edizione",null,"[4th ed.]"]
[null,null,"Descrizione fisica",null,"1 online resource (397 pages)"]
[null,null,"Disciplina",null,"668/.3"]
[null,null,"Soggetti",null,"Adhesion"]
[{"$nulls":4},"Adhesives"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,"Nota di contenuto",null,"Intro -- Preface -- Contents -- 1 Introduction -- 1.1 Introduction and Chapter Objectives -- 1.2 Basic Definitions -- 1.3 Advantages and Disadvantages of Adhesive Bonding -- 1.4 Uses of Adhesive Bonding in Modern Industry -- 1.5 Economics of Adhesive Technology -- 1.6 Literature and Other Sources of Information -- 1.7 Summary -- References -- 2 The Mechanical Properties of Materials as They Relate to Adhesion -- 2.1 Introduction -- 2.2 Definition of Mechanical Stresses for Materials Testing -- 2.3 Stress-Strain Plots and the Definition of Materials Property Parameters -- 2.3.1 Tensile Forces -- 2.3.2 Shear Forces -- 2.3.3 Strain Energy Density -- 2.4 Introduction to Linear Elastic Fracture Mechanics -- 2.5 Introduction to Rheology of Liquids -- 2.6 Introduction to Linear Viscoelasticity -- 2.7 An Application of Materials Properties and Mechanics: The Bending of Beams -- 2.8 Summary -- Bibliography -- Problems and Review Questions -- 3 Mechanical Tests of Adhesive Bond Performance -- 3.1 Introduction -- 3.2 Failure Modes and the Definition of Practical Adhesion -- 3.3 Tensile Testing of Adhesive Bonds -- 3.4 Shear Loading of Adhesive Bonds -- 3.4.1 The Standard Lap Shear Specimen -- 3.4.2 Variations on the Lap Shear Specimen -- 3.4.3 Specimen for Determining the True Shear Properties of an Adhesive -- 3.4.4 The Goland-Reissner Analysis of the Lap Shear Specimen -- 3.5 Cleavage "]
[{"$nulls":4},"Loading of Adhesive Bonds -- 3.5.1 Cleavage or Fracture Specimens -- 3.5.1.1 Double Cantilever Beam Specimens -- 3.5.1.2 Linear Elastic Fracture Mechanics Applied to the Double Cantilever Beam Specimen -- 3.5.2 Blister Test -- 3.5.3 Compact Tension Test -- 3.5.4 Wedge Test -- 3.6 Peel Tests -- 3.6.1 Stress Analysis in a Peel Specimen -- 3.7 Summary -- Bibliography -- References -- Problems and Review Questions -- 4 The Basics of Intermolecular Forces and Surface Science."]
[{"$nulls":4},"4.1 Introduction -- 4.2 Fundamental Forces -- 4.2.1 Electrostatic Forces -- 4.2.2 van der Waals Interactions -- 4.2.2.1 Dipole-Dipole Interactions -- 4.2.2.2 Dipole-Induced Dipole -- 4.2.2.3 Dispersion Forces -- 4.2.3 Interactions through Electron Pair Sharing -- 4.2.4 Repulsive Forces -- 4.3 Surface Forces and Surface Energy -- 4.4 Work of Cohesion and Adhesion -- 4.5 Methods of Measurement of Surface Energy and Related Parameters -- 4.5.1 Surface Tension -- 4.5.1.1 Drop Weight/Volume Method -- 4.5.1.2 Du Nuoy Tensiometer -- 4.5.2 Surface Energy of Solids -- 4.5.2.1 Contact Angle Methods -- 4.5.2.2 Contact Mechanics and Direct Measurement of Solid Surface Energy -- 4.6 Surface Thermodynamics and Predictions of Surface and Interfacial Tensions -- 4.6.1 The Good-Girifalco Relationship -- 4.6.2 The Fowkes Hypothesis and Fractional Polarity -- 4.6.3 The Zisman Plot -- 4.6.4 Modern Application of Contact Angle Measurements -- 4.7 Modern Methods of Surface Analysis -- 4.7.1 Modern Methods for Analysis of the Chemistry of Surfaces -- 4.7.2 Topological Methods of Surface Analysis -- 4.8 Summary -- Bibliography -- References -- Problems and Review Questions -- 5 Basic Physico/Chemical Properties of Polymers -- 5.1 Introduction -- 5.2 Basic Terminology -- 5.2.1 Monomers versus Polymers -- 5.2.2 Basic Types of Polymeric Materials -- 5.2.3 Molecular Weight -- 5.3 Thermal Transitions of Polymers -- 5.3.1 Measurement of Tg -- 5.4 Dynamic Mechanical Measurements and Viscoelasticity -- 5.4.1 Methods of Measurement of Dynamic Mechanical Properties -- 5.4.2 Examples of Dynamic Mechanical Data for Polymers -- 5.5 Time-Temperature Superposition -- 5.6 Summary -- Bibliography -- References -- 6 The Relationship of Surface Science and Adhesion Science -- 6.1 Introduction -- 6.2 Rationalizations of Adhesion Phenomena -- 6.3 Electrostatic Theory of Adhesion."]
[{"$nulls":4},"6.4 Diffusion Theory of Adhesion -- 6.4.1 Diffusive Adhesive Bonding and Block Copolymers at Interfaces -- 6.5 Mechanical Interlocking and Adhesion -- 6.5.1 Kinetics of Pore Penetration -- 6.6 Wettability and Adhesion -- 6.7 Acid-Base Interactions at Interfaces -- 6.8 Covalent Bonding at Interfaces -- 6.8.1 Coupling Agents -- 6.9 The Relationship of Fundamental Forces of Adhesion and Practical Adhesion -- 6.10 The Weak Boundary Layer -- 6.11 Summary -- Bibliography -- References -- Problems and Review Questions -- 7 The Surface Preparation of Adherends for Adhesive Bonding -- 7.1 Introduction -- 7.2 Plastic Surface Preparation -- 7.2.1 Corona Discharge Treatment -- 7.2.1.1 Corona Discharge Treatment of Polyethylene -- 7.2.1.2 Corona Discharge Treatment of Polypropylene -- 7.2.1.3 Corona Discharge Treatment of Poly(ethylene terephthalate) -- 7.2.1.4 Corona Discharge Treatment of Other Materials -- 7.2.2 Flame Treatment -- 7.2.3 Plasma Treatment -- 7.2.3.1 Plasma Treatment of PE -- 7.2.3.2 Plasma Treatment of Other Substrates -- 7.2.4 Other Physical Treatment Methods of Polymer Surfaces -- 7.2.4.1 Treatments Using Ultraviolet Radiation -- 7.2.4.2 Other Vacuum Methods of Surface Preparation -- 7.2.5 Wet Chemical Methods of Treatment of Polymer Surfaces -- 7.2.5.1 Single Surface Chemical Functionalization and Chromic Acid Treatment of PE -- 7.2.5.2 Wet Chemical Surface Treatment of Poly(tetrafluoroethylene) -- 7.2.6 Priming of Polymer "]
[{"$nulls":4},"Surfaces -- 7.2.6.1 Priming of Polyolefins for Cyanoacrylates -- 7.2.6.2 Chlorinated Polyolefins -- 7.2.7 Surface of Composite Materials -- 7.2.7.1 Mechanical Surface Treatment of Composites -- 7.2.7.2 Peel-Plies as a Method of Composite Surface Preparation -- 7.2.7.3 A Comparison of Treatment Methods for Graphite Epoxy Reinforced Composite -- 7.2.7.4 Summary -- 7.3 Metal Surface Preparation."]
[{"$nulls":4},"7.3.1 Surface Preparation of Aluminum for Adhesive Bonding -- 7.3.1.1 The Forest Products Laboratory (FPL) Etch -- 7.4 Anodization Treatments for Adhesive Bonding of Aluminum -- 7.4.1 Mechanism of Anodization -- 7.4.2 Anodization Media -- 7.4.3 Phosphoric Acid Anodization in the Aerospace Industry -- 7.5 General Techniques for the Surface Preparation of Metals -- 7.5.1 Conversion Coatings -- 7.5.2 Abrasion -- 7.5.3 Electrochemical Methods for Treating Metals other than Aluminum -- 7.6 Summary -- Bibliography -- References -- Problems and Review Questions -- 8 The Chemistry and Physical Properties of Structural Adhesives -- 8.1 Introduction to Chapters 8-11 and 13 -- 8.2 Introduction to Structural Adhesives -- 8.2.1 Physical Forms of Uncured Structural Adhesives -- 8.3 Chemistry of Base Resins Used in Structural Adhesives -- 8.3.1 Phenolics -- 8.3.2 Proteins -- 8.3.3 Epoxy Resins -- 8.3.3.1 Time-Temperature-Transformation Diagrams and the Cure of Epoxy Resins -- 8.3.4 Urethane Resins -- 8.3.5 Acrylics -- 8.3.6 High Temperature Performance Structural Adhesives -- 8.4 Formulation of Structural Adhesives for Optimum Performance -- 8.4.1 Formulation of Phenolic Resins -- 8.4.2 Epoxy Resins -- 8.4.3 Acrylics -- 8.4.4 High Temperature Performance Structural Adhesives -- 8.5 Summary -- Bibliography -- References -- Problems and Review Questions -- 9 Durability of Structural Adhesive Bonds -- 9.1 Introduction -- 9.2 Methods of Examining Durability of Structural Adhesive Bonds -- 9.3 Mechanisms of Durability Failure of Adhesive Bonds -- 9.4 Methods Used to Predict Durability -- 9.5 Summary -- References -- 10 The Chemistry and Physical Properties of Elastomer-Based Adhesives -- 10.1 Introduction -- 10.2 Pressure-sensitive Adhesives -- 10.2.1 Chemistry of the Base Resins Used in PSAs -- 10.2.2 Chemistry of Tackifiers -- 10.2.2.1 Natural Product Based Tackifiers."]
[{"$nulls":4},"10.2.2.2 Petroleum Based Tackifiers -- 10.2.2.3 Other Tackifiers -- 10.2.3 Testing of Pressure-sensitive Adhesives -- 10.2.3.1 Measurements of Tack -- 10.2.3.2 Measurement of Peel -- 10.2.3.3 Measurement of Shear -- 10.2.4 Balance of Properties -- 10.2.5 PSA Performance Viewed as a Time Scale in Viscoelastic Response -- 10.2.6 PSA Viscoelasticity and Tack -- 10.2.7 PSA Peel and Viscoelasticity -- 10.2.8 Shear and Creep Behavior of PSAs -- 10.2.9 Summary -- 10.3 Rubber-Based, Contact Bond and Other Elastomeric Adhesives -- 10.3.1 Formulation of RBAs -- 10.3.2 Base Polymers -- 10.3.3 Tackifiers -- 10.3.4 Pigments and Fillers -- 10.3.5 Crosslinking/Vulcanization of RBAs -- 10.3.6 Solvents -- 10.3.7 Elastomeric Adhesives, Sealants and Release Coatings Based upon Silicone Chemistry -- 10.4 Summary -- Bibliography -- References -- Problems and Review Questions -- 11 Thermoplastic, Pseudothermoplastic, and Other Adhesives -- 11.1 Introduction -- 11.2 Hot Melt Adhesives -- 11.2.1 Introduction -- 11.2.2 Polymer Physical Properties and Hot Melt Adhesives -- 11.2.3 Formulation of Hot Melt Adhesives -- 11.2.4 Synthetically Designed Hot Melt Adhesives -- 11.2.5 Curing Hot Melts -- 11.3 Polyvinyl Acetate-Based Adhesives -- 11.4 Polyvinyl Acetal Adhesives -- 11.5 Thermoplastic or Pseudo-thermoplastic Adhesives based upon Natural Products -- 11.5.1 Starches -- 11.5.2 Cellulosics -- 11.6 Summary -- Bibliography "]
[{"$nulls":4},"-- References -- 12 Adhesion in Biological Systems -- 12.1 Introduction -- 12.2 Adhesion in Microbiological Systems -- 12.3 Biofilm Formation -- 12.4 Growth Stages of Biofilms -- 12.4.1 Attachment to a Surface -- 12.4.2 Irreversible Attachment of Bacteria -- 12.4.3 Maturation Phase -- 12.4.4 Biofilm Dispersal -- 12.5 Maintenance or Elimination of Biofilms -- 12.6 Adhesion in the Cling Ability of the Tokai Gecko."]
[{"$nulls":4},"12.6.1 Attempts to Artificially Produce the Gecko Features and Adhesive Ability."]
[null,null,null,"Sommario/riassunto","This book describes in clear understandable language the three main disciplines of adhesion technology: mechanics of the adhesive bond; chemistry of adhesives; and surface science. Some knowledge of physical and organic chemistry is assumed but no familiarity with the science of adhesion is required."]
[null,"3.","Record Nr.",null,"UNINA9911016073003321"]
[null,null,"Autore",null,"He Manchao"]
[null,null,"Titolo",null,"AI for Rock Dynamics / / by Manchao He, LiGe Wang, Wei Yao, Wengang Dang, Zhuo Wang"]
[null,null,"Pubbl/distr/stampa",null,"Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2025"]
[null,null,"ISBN",null,"981-9653-42-8"]
[null,null,"Edizione",null,"[1st ed. 2025.]"]
[null,null,"Descrizione fisica",null,"1 online resource (XVI, 518 p. 162 illus., 130 illus. in color.)"]
[null,null,"Disciplina",null,"624.1513"]
[null,null,"Soggetti",null,"Rock mechanics"]
[{"$nulls":4},"Soil mechanics"]
[{"$nulls":4},"Civil engineering"]
[{"$nulls":4},"Engineering geology"]
[{"$nulls":4},"Materials science"]
[{"$nulls":4},"Geotechnical engineering"]
[{"$nulls":4},"Soil and Rock Mechanics"]
[{"$nulls":4},"Civil Engineering"]
[{"$nulls":4},"Geoengineering"]
[{"$nulls":4},"Materials Science"]
[{"$nulls":4},"Geotechnical Engineering and Applied Earth Sciences"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,"Nota di contenuto",null,"Introduction -- Theoretical basis of rock dynamics -- Rock dynamics test device and test technique -- Rock dynamic properties -- Propagation characteristics of stress wave in rock -- Rockburst dynamics and engineering protection -- Key techniques for numerical simulation of rock dynamics -- Engineering applications in rock dynamics -- Conclusions."]
[null,null,null,"Sommario/riassunto","This Open Access book covers various aspects in rock dynamics comprehensively, such as theoretical foundations, testing techniques, dynamic properties, stress wave propagation, rockburst dynamics, numerical simulation, and engineering applications. AI for Rock Dynamics is a groundbreaking Open Access monograph that redefines publishing through Luffa AI, a China-developed large language model (LLM). Set to captivate at the London Book Fair 2025, it marks a transformative milestone in rock mechanics and beyond. Covering theoretical foundations, testing instruments, numerical simulation, and "]
[{"$nulls":4},"engineering applications, it’s an essential resource for professionals in civil engineering, mining, and geology alike. Its clear presentation, illustrations, and practical insights make it pivotal for tackling rock mechanics challenges. Unique for its homegrown LLM, it showcases Chinese AI’s potential to advance research. As China’s first LLM-powered book, it revolutionizes knowledge production, organization, and dissemination. This landmark was achieved through a strategic partnership between CNPIEC Kexin Technology, CSRME, and Springer Nature, unprecedentedly integrating cutting-edge technology, academic expertise, and global publishing prominence. Published as Open Access, it democratizes knowledge, fostering collaboration and innovation. The first of its kind signifies AI’s potential to transform publishing, streamlining content creation and enhancing dissemination. AI for Rock Dynamics is a beacon of progress, uniting technology and academia to push knowledge boundaries with concerted efforts. Please Join us in celebrating this historic achievement and witness the dawn of AI-powered publishing."]