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[null,"1.","Record Nr.",null,"UNINA990001195230403321"]
[null,null,"Autore",null,"Ciamberlini, Corrado"]
[null,null,"Titolo",null,"Algebra pratica / di Ciamberlini C."]
[null,null,"Pubbl/distr/stampa",null,"s.l. : Paravia, s.d."]
[null,null,"Locazione",null,"MA1"]
[null,null,"Collocazione",null,"205-H-51"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,"2.","Record Nr.",null,"UNINA9911020188603321"]
[null,null,"Autore",null,"Iordache Octavian"]
[null,null,"Titolo",null,"Evolvable designs of experiments : applications for circuits / / Octavian Iordache"]
[null,null,"Pubbl/distr/stampa",null,"Weinheim, : Wiley-VCH, c2009"]
[null,null,"ISBN",null,"9786612021961"]
[{"$nulls":4},"9781282021969"]
[{"$nulls":4},"1282021966"]
[{"$nulls":4},"9783527624027"]
[{"$nulls":4},"3527624023"]
[{"$nulls":4},"9783527624034"]
[{"$nulls":4},"3527624031"]
[null,null,"Descrizione fisica",null,"1 online resource (232 p.)"]
[null,null,"Disciplina",null,"621.3192"]
[null,null,"Soggetti",null,"Chemical engineering - Mathematical models"]
[{"$nulls":4},"Experimental design"]
[{"$nulls":4},"Printed circuits - Design and construction"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references (p. 205-210) and index."]
[null,null,"Nota di contenuto",null,"Evolvable Designs of Experiments: Applications for Circuits; Contents; Preface; Abbreviations; Part One Introduction; 1 Printed Circuits; 1.1 Technology Presentation; 1.2 Inner-Layer Processing; 1.3 Materials Preparation; 1.4 Lamination; 1.5 Drilling; 1.6 Making the Hole Conductive; 1.7 Imaging; 1.8 Electroplating; 1.9 Copper Etching; 1.10 Solder Masking; 1.11 Surface Finishing; 1.12 Routing; 1.13 Testing and Inspection; 1.14 Assembling; 2 Problem Solving for Reliability and Quality; 2.1 Conventional Paradigms; 2.2 Complexity and Time Frames; 2.3 Quasilinearity, Circularity, and Closure"]
[{"$nulls":4},"2.4 Advance of Reliability ParadigmsPart Two Evolvable Designs of Experiments (EDOE); 3 Polystochastic Models; 3.1 What Is PSM?; 3.2 Basic Notions for Categorical Frame; 3.3 Illustrative Examples of PSM and Categorical Frames; 3.3.1 Lumped Stochastic Chains; 3.3.2 Conditional Stochastic Chains; 4 First-Order Wave Equation; 4.1 Algebraic Frames for Time''T''and Space''Z''; 4.2 The First-Order Wave Equation; 4.3 ''Kinetic''Model: Walsh-Hadamard Matrices; 4.4 ''Convection''Model: Latin Squares; 4.4.1 GF(3) Solution; 4.4.2 GF(4) "]
[{"$nulls":4},"Solution; 4.5 Spectral Analysis: Correlation"]
[{"$nulls":4},"5 Informational Analysis: EDOE Matrices5.1 Walsh-Hadamard Matrices and Latin Square Designs; 5.2 Classification Procedures: Informational Criteria; 5.3 Informational Entropy and Distances; 5.4 Adaptability in Classification; 5.5 Informational Results; 5.5.1 Proposition 1; 5.5.2 Proposition 2; 5.5.3 Proposition 3; 5.6 Relation with Thermodynamics; 5.7 Ranking, Discarding, and Replication of the Columns; 5.8 Lumping and Splitting Columns; 5.9 Juxtaposing and Cutting; 5.10 Tables of DOE Matrices; 6 EDOE Methodology; 6.1 Scientific and Engineering Methods; 6.2 Center Design and Hierarchy"]
[{"$nulls":4},"6.3 Recursivity and Focusing6.4 Problem-Solving Framework for PCB Quality; 6.5 Forward and Backward Search; 6.6 Interactions: Dissociation-Integration; 6.7 EDOE Basic Steps; 6.7.1 Problem Statement; 6.7.2 Propose the Preliminary Problem-Solving Framework; 6.7.3 Select the DOE Matrices; 6.7.4 Run Center Design; 6.7.5 Analyze Results; 6.7.6 Run Multiple Forward and Backward Steps; 6.7.7 Perform Dissociation-Integration Experiments; 6.7.8 Establish the New Center Design; 6.7.9 Repeat the Testing Procedure from the New Center Design; 6.7.10 Run Simulations: Analyze the Solutions of the Problem"]
[{"$nulls":4},"6.8 EDOE Frame and SKUP Schema6.9 Comparison of EDOE with other Methods; Part Three Case Studies; 7 Solder Wicking; 7.1 Illustrative Failure Analysis; 7.2 Illustrative EDOE Frame; 7.3 SKUP Schema for Solder Wicking; 8 Reliability Analysis; 8.1 EDOE for Reliability; 8.2 SKUP Schema for Reliability; 8.3 Reliability Management System: Main Elements; 8.4 Reliability Prediction Software; 8.5 Minicoupons; 8.6 Reliability Analysis; 8.7 IST Electrical Resistance Analysis; 9 Drilling; 9.1 Drilling Quality Framework; 9.2 Test Coupons; 9.3 Testing Small Plated Through Holes: SKUP Schema for Drilling"]
[{"$nulls":4},"9.4 Reliability Tests"]
[null,null,null,"Sommario/riassunto","Adopting a groundbreaking approach, the highly regarded author shows how to design methods for planning increasingly complex experiments. He begins with a brief introduction to standard quality methods and the technology in standard electric circuits. The book then gives numerous examples of how to apply the proposed methodology in a series of real-life case studies. Although these case studies are taken from the printed circuit board industry, the methods are equally applicable to other fields of engineering."]