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[null,"1.","Record Nr.",null,"UNINA9911006981703321"]
[null,null,"Titolo",null,"MEMS : a practical guide to design, analysis, and applications / / edited by Jan G. Korvink and Oliver Paul"]
[null,null,"Pubbl/distr/stampa",null,"Norwich, NY, : W. Andrew Pub."]
[{"$nulls":4},"Heidelberg, Germany, : Springer, c2006"]
[null,null,"ISBN",null,"9786612253058"]
[{"$nulls":4},"1-59124-988-0"]
[null,null,"Descrizione fisica",null,"1 online resource (993 p.)"]
[null,null,"Disciplina",null,"621"]
[null,null,"Soggetti",null,"Microelectromechanical systems"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","\"Micro-electro-mechanical systems\"--Cover."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"Front Cover; MEMS: A Practical Guide to Design, Analysis, and Applications; Copyright Page; Contents; Foreword; Preface; Chapter 1. Microtransducer Operation; 1.1 Introduction; 1.2 Transduction; 1.3 Microsystem Performance; 1.4 Transducer Operation Techniques; 1.5 Powering Microsystems; References; Chapter 2. Material Properties: Measurement and Data; 2.1 Introduction; 2.2 Measurement Methods; 2.3 Data; References; Chapter 3. MEMS and NEMS Simulation; 3.1 Introduction; 3.2 Simulation Scenario; 3.3 Generic Organization of a Computational Tool; 3.4 Methods for Materials Simulation"]
[{"$nulls":4},"3.5 Computational Methods that Solve PDEs3.6 Design Automation Methods; 3.7 A Simulation Strategy; 3.8 Case Studies; 3.9 Summary; 3.10 Acknowledgments; References; Chapter 4. System-Level Simulation of Microsystems; 4.1 Introduction; 4.2 Behavioral Modeling of MEMS Components; 4.3 Formulation of Equations of Motion; 4.4 Structured Design Tools; 4.5 Conclusions; References; Chapter 5. Thermal-Based Microsensors; 5.1 Introduction; 5.2 Thermoresistors; 5.3 Silicon Diodes and Transistors as Thermal Microsensors; 5.4 Thermoelectric Microsensors"]
[{"$nulls":4},"5.5 CMOS-Compatible Thermal-Based Microsensors and Microactuators5.6 Diagnostic Thermal-Based Microstructures; 5.7 Conclusion; References; Chapter 6. Photon Detectors; 6.1 Introduction; 6.2 Detectors; 6.3 Thin-Film Transistors; 6.4 Pixel Integration; 6.5 Imaging Arrays; 6.6 New Challenges in Large-Area Digital Imaging; References; Chapter 7. Free-Space Optical MEMS; 7.1 Introduction; 7.2 General Discussion of Micromirror Scanners; 7.3 Electrostatic Scanners; "]
[{"$nulls":4},"7.4 Scanning Mirrors with Magnetic and Electromagnetic Actuators; 7.5 Micromirror Arrays with Mirror Size =100 Micrometers"]
[{"$nulls":4},"9.5 Magnetoresistors9.6 Magnetodiodes; 9.7 Magnetotransistors and Related Microsensors; 9.8 Magnetic Field-based Functional Multisensors; 9.9 Interfaces and Improvement of Characteristics of Magnetic Microsensors; 9.10 Conclusions and Outlook; References; Chapter 10. Mechanical Microsensors; 10.1 Introduction; 10.2 Inertial Sensors; 10.3 Pressure Sensors; 10.4 Force and Torque Sensors; References; Chapter 11. Semiconductor-Based Chemical Microsensors; 11.1 Introduction; 11.2 Thermodynamics of Chemical Sensing; 11.3 Chemomechanical Sensors; 11.4 Thermal Sensors; 11.5 Optical Sensors"]
[{"$nulls":4},"11.6 Electrochemical Sensors"]
[null,null,null,"Sommario/riassunto","Does MEMS technology offer advantages to your company's products? Will miniature machines on a chip solve your application objectives for ôsmaller, better, cheaper, and faster'ö If you are a product development engineer or manager, the decision to design a MEMS device implies having an application and market. This book offers you a practical guide to making this important business decision. Here, both veterans and newcomers to MEMS device design will get advice on evaluating MEMS for their business, followed by guidance on selecting solutions, technologies and design support tools. You will se"]