{"text_format":"2","workbook":"xls","n_sheets":1,"sheets":["report2"],"not_rendered":{"charts":0,"images":0,"macros":0,"external_links":1,"defined_names":1,"comments":0,"pivot_tables":0},"unopened":[],"bounds":{"document_bytes":16777216,"sheet_cells":100000,"run_cost":"one","rows_first":2000,"rows_last":500,"rows_between":2000,"halvings":0,"cell_chars":16384,"cell_head_chars":4096},"cells_cut":0,"cells_raw":0,"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"report2","index":0,"n_rows":23,"n_cols":5,"rows_kept":23,"cut":false,"hidden":false,"merged":[[0,2,0,3],[0,4,0,5],[1,2,1,3],[1,4,1,5],[2,2,2,3],[2,4,2,5],[3,2,3,3],[5,2,5,3],[8,2,8,3],[9,2,9,3],[10,2,10,3],[11,2,11,3],[12,2,12,3],[16,2,16,3],[17,2,17,3],[21,2,21,3]],"flags":["formulas_cached_only"]}
[null,"1.","Record Nr.",null,"UNINA9911006553303321"]
[null,null,"Autore",null,"Xiao Hong"]
[null,null,"Titolo",null,"Introduction to semiconductor manufacturing technology / / Hong Xiao"]
[null,null,"Pubbl/distr/stampa",null,"Bellingham, Wash. : , : SPIE, , [2012]"]
[{"$nulls":4},"©2012"]
[null,null,"ISBN",null,"9780819490933"]
[{"$nulls":4},"1-62870-104-8"]
[{"$nulls":4},"0-8194-9093-8"]
[null,null,"Edizione",null,"[Second edition]"]
[null,null,"Descrizione fisica",null,"1 online resource (704 pages)"]
[null,null,"Collana",null,"SPIE Press monograph ; ; PM220"]
[null,null,"Disciplina",null,"621.3815/2"]
[null,null,"Soggetti",null,"Semiconductors - Design and construction"]
[{"$nulls":4},"Semiconductor industry"]
[{"$nulls":4},"Semiconductors - Disseny i construcció"]
[{"$nulls":4},"Semiconductors - Indústria i comerç"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references."]
[null,null,"Nota di contenuto",null,"Preface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary."]
[null,null,null,"Sommario/riassunto","Integrated circuit fabrication is a complex process, and engineers must have a deep understanding of the intricate technolgies involved in order to be successful. This book, intended for technical and college students, provides an overview of key concepts, equipment, and techniques used in fabs today. A history of the field is included as context for modern practictioners. The second edition covers advancements made in the past decade and adds new illustrations."]