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[null,"1.","Record Nr.",null,"UNINA9911004800603321"]
[null,null,"Autore",null,"Licari James J. <1930->"]
[null,null,"Titolo",null,"Adhesives technology for electronic applications : materials, processes, reliability / / by James J. Licari and Dale W. Swanson"]
[null,null,"Pubbl/distr/stampa",null,"Norwich, NY, : William Andrew Pub., c2005"]
[null,null,"ISBN",null,"1-282-01328-9"]
[{"$nulls":4},"9786612013287"]
[{"$nulls":4},"0-8155-1600-2"]
[null,null,"Descrizione fisica",null,"1 online resource (477 p.)"]
[null,null,"Collana",null,"Materials and processes for electronic applications series"]
[null,null,"Disciplina",null,"621.381"]
[null,null,"Soggetti",null,"Electronics - Materials"]
[{"$nulls":4},"Adhesives"]
[{"$nulls":4},"Electronic packaging"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"Front Cover; Adhesives Technology for Electronic Applications: Materials, Processes, Reliability; Copyright Page; Table of Contents; Chapter 1. Introduction; 1.1 ADHESIVE TYPES AND DEFINITIONS; 1.2 SUMMARY OF PACKAGING TECHNOLOGIES; 1.3 HISTORY OF ADHESIVES IN ELECTRONIC APPLICATIONS; 1.4 COMPARISON OF POLYMER ADHESIVES WITH METALLURGICAL AND VITREOUS ATTACHMENT MATERIALS; 1.5 SPECIFICATIONS; 1.6 THE MARKET; REFERENCES; Chapter 2. Functions and Theory of Adhesives; 2.1 MECHANICAL ATTACHMENT; 2.2 ELECTRICAL CONNECTIONS; 2.3 THERMAL DISSIPATION; 2.4 STRESS DISSIPATION; REFERENCES"]
[{"$nulls":4},"Chapter 3. Chemistry, Formulation, and Properties of Adhesives3.1 CHEMISTRY; 3.2 FORMULATION; 3.3 PROPERTIES; REFERENCES; Chapter 4. Adhesive Bonding Processes; 4.1 CLEANING; 4.2 SURFACE TREATMENTS; 4.3 ADHESIVE DISPENSING; 4.4 PLACEMENT OF DEVICES AND COMPONENTS; 4.5 CURING; 4.6 REWORK; REFERENCES; Chapter 5. Applications; 5.1 GENERAL APPLICATIONS; 5.2 SPECIFIC APPLICATIONS; REFERENCES; Chapter 6. Reliability; 6.1 FAILURE MODES AND MECHANISMS; 6.2 SPECIFICATIONS; REFERENCES; Chapter 7. Test and Inspection Methods; 7.1 PHYSICAL TESTS; 7.2 ELECTRICAL TESTS; 7.3 ENVIRONMENTAL TESTS"]
[{"$nulls":4},"7.4 THERMAL TESTS7.5 MECHANICAL AND THERMOMECHANICAL TESTS; 7.6 CHEMICAL ANALYSIS; REFERENCES; Appendix; CONVERSION "]
[{"$nulls":4},"FACTORS; ABBREVIATIONS, ACRONYMS, AND SYMBOLS; Index"]
[null,null,null,"Sommario/riassunto","This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and rel"]