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[null,"1.","Record Nr.",null,"UNINA9910972482503321"]
[null,null,"Titolo",null,"Topics in audiovisual translation / / edited by Pilar Orero"]
[null,null,"Pubbl/distr/stampa",null,"Amsterdam ; ; Philadelphia, PA, : John Benjamins, c2004"]
[null,null,"ISBN",null,"9786612160233"]
[{"$nulls":4},"9781282160231"]
[{"$nulls":4},"1282160230"]
[{"$nulls":4},"9789027295125"]
[{"$nulls":4},"9027295123"]
[null,null,"Edizione",null,"[1st ed.]"]
[null,null,"Descrizione fisica",null,"1 online resource (xiii, 225 p.) : ill"]
[null,null,"Collana",null,"Benjamins translation library, , 0929-7316 ; ; v. 56"]
[null,null,"Classificazione",null,"IM 5115"]
[null,null,"Disciplina",null,"778.5/2344"]
[null,null,"Soggetti",null,"Dubbing of motion pictures"]
[{"$nulls":4},"Dubbing of television programs"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and indexes."]
[null,null,"Nota di contenuto",null,"Introduction: Audiovisual translation: A new dynamic umbrella / Pilar Orerovii -- 1. PROFESSIONAL PERSPECTIVES -- Film dubbing: its process and translation / Xènia Martinez -- Subtitling methods and team-translation / Diana Sánchez -- 2. AVT THEORY -- In search of a theoretical framework for the study of audiovisual translation / Jorge Díaz-Cintas -- Synchronization in dubbing: A translational approach / Frederic Chaume -- Parameters for the classification of subtitles / Eduard Bartoll -- 3. IDEOLOGY AND AVT -- Translation in bilingual contexts: Different norms in dubbing translation / Rosa Agost -- Language-political implications of subtitling / Henrik Gottlieb -- 4. TEACHING AVT -- A place for film dialogue analysis in subtitling courses / Aline Remael -- Language awareness through training in subtitling / Josélia Neves -- e-AVT: A perfect match: Strategies, functions and interactions in an on-line environment for learning audiovisual translation / Miquel Amador, Carles Dorado and Pilar Orero -- 5. AVT RESEARCH -- The challenge of research in audio-visual translation / Francesca Bartrina -- Tradaptation cinématographique / Yves Gambier -- Myths about documentary translation / Eva Espasa Boras -- Closed subtitling in Brazil / Vera Lucia Santiago Araújo -- Index."]
[null,null,null,"Sommario/riassunto","The late twentieth-century transition from a paper-oriented to a media-oriented society has triggered the emergence of Audiovisual "]
[{"$nulls":4},"Translation as the most dynamic and fastest developing trend within Translation Studies. The growing interest in this area is a clear indication that this discipline is going to set the agenda for the theory, research, training and practice of translation in the twenty-first century. Even so, this remains a largely underdeveloped field and much needs to be done to put Screen Translation, Multimedia Translation or the wider implications of Audiovisual Translation on a par with other fields within Translation Studies. In this light, this collection of essays reflects not only the “state of the art” in the research and teaching of Audiovisual Translation, but also the professionals’ experiences. The different contributions cover issues ranging from reflections on professional activities, to theory, the impact of ideology on Audiovisual Translation, and the practices of teaching and researching this new and challenging discipline. In expanding further the ground covered by the John Benjamins’ book (Multi)Media Translation (2001), this book seeks to provide readers with a deeper insight into some of the specific concepts, problems, aims and terminology of Audiovisual Translation, and, by this token, to make these specificities emerge from within the wider nexus of Translation Studies, Film Studies and Media Studies. In a quickly developing technical audiovisual world, Audiovisual Translation Studies is set to become the academic field that will address the complex cultural issues of a pervasively media-oriented society."]
[null,"2.","Record Nr.",null,"UNINA9911004748103321"]
[null,null,"Titolo",null,"Advances in CMP/polishing technologies for the manufacture of electronic devices / / edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa"]
[null,null,"Pubbl/distr/stampa",null,"Oxford, : Elsevier, 2012"]
[null,null,"ISBN",null,"1-283-35498-5"]
[{"$nulls":4},"9786613354983"]
[{"$nulls":4},"1-4377-7860-7"]
[null,null,"Edizione",null,"[1st ed.]"]
[null,null,"Descrizione fisica",null,"1 online resource (330 p.)"]
[null,null,"Disciplina",null,"671.35"]
[null,null,"Soggetti",null,"Grinding and polishing"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"Front Cover; CMP/Polishing Technologies for the Manufacture of Electronic Devices; Copyright Page; Contents; Contributors; Preface; About the Authors; 1. Introduction; References; 2. Details of the Fabrication Process for Devices with a Silicon Crystal Substrate; 2.1 History of Semiconductor Devices and their Types; 2.2 Semiconductor Device Process Technology and current Situation; 2.2.1 Element Isolation Structure; 2.2.2 Multilayer Interconnections; References; 3. The Current Situation in Ultra-Precision Technology - Silicon Single Crystals as an Example"]
[{"$nulls":4},"3.1 Production of Single Crystal Silicon3.2 Slicing: Pre- and Post-Process; 3.2.1 Slicing; 3.2.1.1 Introduction; 3.2.1.2 Abrasive Wire; Loose-Abrasive Wire; Comparison Between Wire Saw and ID Saw; Fundamentals of Free Abrasive Machining; Fixed-Abrasive Wire; Saw Damage on the Surface of Silicon Wafer; 3.2.1.3 Electrical Discharge Machining (EDM); 3.2.1.4 Wire Electrolytic-Spark Hybrid Machining; 3.2.2 Beveling; 3.3 Lapping of Silicon; 3.3.1 Introduction; 3.3.1.1 Brief History; 3.3.2 Lapping Mechanism; 3.3.3 Mathematical Model; 3.3.3.1 Ductile and Brittle Regime"]
[{"$nulls":4},"3.3.3.2 Calculation of Material Removal Rate3.3.4 Kinematics; 3.3.4.1 Sliding Velocity; 3.3.4.2 Equation for Streaks on a Work Piece; 3.3.4.3 Equations for Streaks on a Lap; 3.3.4.4 Effects of Different Parameters on Material Removal Rate; Effect of Lapping Pressure on the MRR; Effect of Abrasive Size on the MRR; 3.3.5 Types of Lapping (Focus: Double-Sided Lapping); 3.3.5.1 Double-Sided Lapping; 3.3.5.2 Mechanism; "]
[{"$nulls":4},"3.3.5.3 Machine Set-up; 3.3.5.4 Process Cycle; 3.3.5.5 Advantages of Double-Sided Lapping; 3.3.5.6 Parameters of Double-Sided Lapping; 3.3.5.7 Lapping with Bonded Abrasives"]
[{"$nulls":4},"3.3.5.8 Process Capabilities for Lapping3.3.6 Abrasives and Lubricants; 3.3.6.1 Types of Abrasives; (1) Diamond; (2) Cubic Boron Nitride (CBN); (3) Norbide Abrasive; (4) Silicon Carbide; (5) Aluminum Oxide; (6) Fused Aluminas; (7) Corundum; (8) Garnet; (9) Unfused Alumina (hydrated-calcined); (10) Micro-Graded Flours; (11) Linde Powders; (12) Other Abrasive Materials; 3.3.7 Equipment; 3.3.7.1 Lapping Plate; 3.3.7.2 Charging of the Lapping Plate; 3.3.7.3 Different Types of Lapping Plate; 3.3.7.4 Carriers Used in Double-Sided Lapping; 3.3.7.5 Ultrasonic Cleaner; 3.3.8 Abrasive Slurry"]
[{"$nulls":4},"3.3.8.1 Abrasives3.3.9 Introduction to Silicon; 3.3.10 Lapping of Silicon Wafers - Experiments; 3.3.10.1 Mounting the Wafer; 3.3.10.2 Double-Sided Lapping Kinematics; 3.3.10.3 Lapping Process; 3.3.10.4 Effects of Lapping Wheels; 3.3.10.5 Slurry and Its Effects; 3.3.10.6 Silicon Machining; 3.3.10.7 Common Lapping Wheel Problems and Solutions; 3.3.11 Lapping Machine; 3.3.12 Experimental Set-up; 3.3.13 Experimental Results; Plots; Equations Used to Calculate the Material Removal Rate; Observations; 3.3.14 Conclusions; 3.4 Etching; 3.4.1 Acid Etching of Silicon; 3.4.2 Alkaline Etching of Silicon"]
[{"$nulls":4},"3.5 Ultra-Precision Polishing/CMP of Silicon Wafers"]
[null,null,null,"Sommario/riassunto","CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community.    Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes a"]