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[null,"1.","Record Nr.",null,"UNINA990005552020403321"]
[null,null,"Autore",null,"Guilelmus Arvernus"]
[null,null,"Titolo",null,"De Trinitate / William of Auvergne ; an edition of the Latin text with an introduction by Bruno Switalski"]
[null,null,"Pubbl/distr/stampa",null,"Toronto : Pontifical Institute of Medieval Studies, 1976"]
[null,null,"ISBN",null,"0888440340"]
[null,null,"Descrizione fisica",null,"IX, 269 p. ; 27 cm"]
[null,null,"Collana",null,"Studies and texts ; 34"]
[null,null,"Locazione",null,"FLFBC"]
[null,null,"Collocazione",null,"B 473"]
[null,null,"Lingua di pubblicazione",null,"Latino"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,"2.","Record Nr.",null,"UNISA996390497003316"]
[null,null,"Autore",null,"Smith Richard <1500-1563.>"]
[null,null,"Titolo",null,"A confutation of a certen booke, called a defence of the true, and Catholike doctrine of the sacrame[n]t, &c. sette fourth of late in the name of Thomas Archebysshoppe of Canterburye. By Rycharde Smyth, Docter of diuinite, and some tyme reader of the same in Oxforde [[electronic resource]]"]
[null,null,"Pubbl/distr/stampa",null,"[Paris, : R. Chaudière, 1550?]"]
[null,null,"Descrizione fisica",null,"166 [i.e. 168], [1] leaves"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","A reply to: Cranmer, Thomas.  A defence of the true and catholike doctrine of the sacrament of the body and bloud of Christ (STC 6000)."]
[{"$nulls":4},"Imprint from colophon."]
[{"$nulls":4},"Running title reads: A confutation of the defence of the true and the catholike."]
[{"$nulls":4},"With a final errata leaf."]
[{"$nulls":4},"Numerous errors in foliation; foliation deduced from signature collation."]
[{"$nulls":4},"Signatures: A-X."]
[{"$nulls":4},"Reproduction of the original in the British Library."]
[null,null,null,"Sommario/riassunto","eebo-0018"]
[null,"3.","Record Nr.",null,"UNINA9911003689103321"]
[null,null,"Autore",null,"Prall Kirk"]
[null,null,"Titolo",null,"CMOS Plasma and Process Damage / / by Kirk Prall"]
[null,null,"Pubbl/distr/stampa",null,"Cham : , : Springer Nature Switzerland : , : Imprint : Springer, , 2025"]
[null,null,"ISBN",null,"3-031-89029-9"]
[null,null,"Edizione",null,"[1st ed. 2025.]"]
[null,null,"Descrizione fisica",null,"1 online resource (XIX, 466 p. 399 illus., 368 illus. in color.)"]
[null,null,"Disciplina",null,"621.3815"]
[null,null,"Soggetti",null,"Electronic circuit design"]
[{"$nulls":4},"Embedded computer systems"]
[{"$nulls":4},"Solid state physics"]
[{"$nulls":4},"Electronics Design and Verification"]
[{"$nulls":4},"Embedded Systems"]
[{"$nulls":4},"Electronic Devices"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,"Nota di contenuto",null,"Chapter 1. BACKGROUND -- Chapter 2. THE ANTENNA EFFECT -- Chapter 3. DIODE AND TRANSISTOR PROTECTION -- Chapter 4. SIGNATURES OF PROCESS DAMAGE -- Chapter 5. ELECTRICAL SIGNATURES OF PROCESS DAMAGE -- Chapter 6. LATENT DAMAGE AND RELIABILITY DEGRADATION -- Chapter 7. ATOMIC-LEVEL DEFECTS AND ELECTRICAL EFFECTS -- Chapter 8. TECHNOLOGY SPECIFIC PROCESS DAMAGE -- Chapter 9. COMMON SOURCES OF PROCESS DAMAGE -- Chapter 10. INLINE PROCESS DAMAGE MEASUREMENTS -- Chapter 11. PROCESS DAMAGE TEST STRUCTURES -- Chapter 12. DESIGN RULES RELATED TO PROCESS DAMAGE  -- Chapter 13. PARAMETRIC DAMAGE TESTING STRATEGY AND PROCEDURES -- Chapter 14. THE ROLE OF HYDROGEN -- Chapter 15. METALLIC DEFECTS -- Chapter 16. MOBILE ION CONTAMINATION -- Chapter 17. FIXED CHARGE."]
[null,null,null,"Sommario/riassunto","This book discusses the complex technology of building CMOS computer chips and covers some of the unusual problems that can occur during chip manufacturing. Readers will learn how plasma and process damage results from the high-energy processes that are used in chip manufacturing, causing harm to the chips, functional failure and reliability problems. Provides an up-to-date, single-source reference on CMOS plasma and process damage, for engineers from all disciplines Offers concise, comprehensive coverage, discussing real problems with necessary background for working engineers Applies to "]
[{"$nulls":4},"design, layout, mask making, lithography, process and device engineering, testing and reliability."]