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[null,"1.","Record Nr.",null,"UNINA9910965393403321"]
[null,null,"Titolo",null,"Copper alloys : preparation, properties and applications / / Michael Naboka and Jennifer Giordano, editors"]
[null,null,"Pubbl/distr/stampa",null,"Hauppauge, N.Y., : Nova Science Publishers, c2011"]
[null,null,"ISBN",null,"1-62081-544-3"]
[null,null,"Edizione",null,"[1st ed.]"]
[null,null,"Descrizione fisica",null,"1 online resource (281 p.)"]
[null,null,"Collana",null,"Materials science and technologies"]
[null,null,"Disciplina",null,"669/.3"]
[null,null,"Soggetti",null,"Copper alloys - Metallurgy"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"Intro -- COPPER ALLOYS: PREPARATION, PROPERTIES AND APPLICATIONS -- COPPER ALLOYS: PREPARATION, PROPERTIES AND APPLICATIONS -- CONTENTS -- PREFACE -- Chapter 1  ELECTROCATALYTIC OXIDATION OF METHANOL AND GLUCOSE ON NICU ALLOY ELECTRODE -- ABSTRACT -- 1. INTRODUCTION -- 2. MATERIALS AND METHODS -- 3. RESULTS AND DISCUSSION -- 3.1. Surface Analysis of Electrodeposited NiCu Alloy -- 3.2. Electrochemical Behavior of GC/Ni and GC/NiCu in Alkaline Solution -- 3.3. Electro-Oxidation of Methanol -- 3.4. Electro-Oxidation of Glucose -- CONCLUSION -- REFERENCES -- Chapter 2  ELECTRODEPOSITION OF COPPER BASED ALLOYS AND MULTILAYER FOR GIANT MAGNETO RESISTANCE APPLICATIONS -- ABSTRACT -- INTRODUCTION -- EXPERIMENTAL SURVEY -- EFFECT OF NUMBER OF BILAYERS -- EFFECT OF MAGNETIC LAYER THICKNESS ON THE GMR -- EFFECT OF NON-MAGNETIC LAYER THICKNESS ON THE GMR -- CO-CU/CU MULTILAYER FILMS -- Ni-Cu/Cu Multilayer Films -- Co-Ni-Cu/Cu Multilayer Films -- Fe-Co-Cu/Cu Multilayer Films -- Fe-Ni-Cu/Cu Multilayer Films -- Co-Zn-Cu/Cu Multilayer Films -- Fe-Co-Ni-Cu/Cu Multilayer Films -- CONCLUSION -- REFERENCES -- Chapter 3  DEVELOPMENT AND CHARACTERIZATION OF NICKEL-COPPER-BASED SUBSTRATES FOR 2ND GENERATION HIGH-CRITICAL TEMPERATURE SUPERCONDUCTING TAPES -- ABSTRACT -- INTRODUCTION -- EXPERIMENTAL -- RECRYSTALLIZATION TEXTURE -- Pure Copper -- Binary Nickel-Copper -- Ternary Ni-Cu-Co Alloy -- Ternary Ni-Cu-W Alloy -- MAGNETIC PROPERTIES -- OXIDATION BEHAVIOUR -- MECHANICAL PROPERTIES -- APPLICATION OF NI-CU-CO ALLOY TEXTURED SUBSTRATE FOR YBCO FILM DEPOSITION -- CONCLUSION -- ACKNOWLEDGMENT -- "]
[{"$nulls":4},"REFERENCES -- Chapter 4  MAGNETORESISTANCE EFFECTS IN CU AND CO, CO/CU MULTILAYERS AND GRANULAR CU-CO ALLOYS AND IN RAPIDLY QUENCHED GD-DOPED CU-CO ALLOYS -- ABSTRACT -- INTRODUCTION -- MAGNETORESISTANCE OF PURE COPPER."]
[{"$nulls":4},"MAGNETORESISTANCE OF ALLOYS AND COMPOSITES  COPPER - COBALT -- MAGNETORESISTANCE OF ALLOYS  COPPER - COBALT - GADOLINIUM -- ACKNOWLEDGMENTS -- REFERENCES -- Chapter 5  MECHANICAL PROPERTIES OF COPPER UNDER DYNAMIC LOAD -- ABBREVIATIONS -- DEFINITION OF COOPER PROPERTIES BY KOLSKY METHOD -- Experimental Apparatus for Dynamic Tests -- Determination of the Dynamic Characteristics of Strength and Plasticity -- RESULTS OF TESTS OF COPPER USING KOLSKY METHOD -- CRITICAL SPALL STRENGTH OF COPPER -- Experimental Apparatus for Slpall Strength Determination -- Critical Spall Strength Determination -- Durability of Copper at Explosive Jet High-Speed Stretching -- Dynamic Viscosity and Cooper Relaxation Time Under Dynamic Load -- CONCLUSION -- REFERENCES -- Chapter 6  COPPER ALLOY MICROSTRUCTURES  FOR APPLICATION IN MICROREACTORS -- ABSTRACT -- I. INTRODUCTION -- II. EXPERIMENTAL -- Materials, Processing and Characterization -- III. RESULTS AND DISCUSSION -- III.1. Zeolite Film Growth on Copper-Based Plates -- III.2. Zeolite Film Growth on Brass Microchannels -- III.3. Confined Zeolite Film Growth on Brass Microchannels -- III.3. Zeolite Film Growth on Brass Microgrids -- IV. MICROREACTOR ASSEMBLY  WITH THE ZEOLITE/BRASS MICROSTRUCTURES -- CONCLUSIONS -- ACKNOWLEDGMENTS -- REFERENCES -- Chapter 7  COMPOSITE ELECTRODEPOSITS  WITH C60 FULLERENE -- ABSTRACT -- INTRODUCTION -- EXPERIMENTAL -- RESULTS AND DISCUSSION -- REFERENCES -- Chapter 8  INFLUENCE OF ALLOYING WITH NI, AL, ZN, SN  AND AG ON THE ANNEAL HARDENING EFFECT IN SINTERED COPPER BASE ALLOYS -- ABSTRACT -- INTRODUCTION -- EXPERIMENTAL -- Cold Rolling -- Anneal Hardening Effect -- CONCLUSIONS -- ACKNOWLEDGMENTS -- REFERENCES -- Chapter9HIGHSTRENGTHCOPPER-BASEDCONDUCTORMATERIALS -- Abstract -- 1.GeneralAspectsofCu-BasedConductorMaterials -- 1.1.TheSpecificResistivity -- 1.2.HardeningofConductorMaterials."]
[{"$nulls":4},"1.3.CommonCu-basedConductorMaterials -- 1.3.1.Nickel-BasedPrecipitates -- 1.3.2.Iron-BasedPrecipitates -- 1.3.3.Titanium-BasedPrecipitates -- 1.3.4.Chromium-BasedPrecipitates -- 1.3.5.ComparisonoftheConstituents -- 2.Cu-AgAlloys -- 2.1.PrecipitationReaction -- 2.2.SeparatingMatrixGrains -- 2.3.ThirdElementAdditions -- 2.3.1.CuAgCeandCuAgY -- 2.3.2.CuAgNiandCuAgMg -- 2.3.3.CuAgCrandCuAgFe -- 2.3.4.CuAgZr -- 2.4.StrengthandConductivity -- 3.Cu-NbAlloys -- 3.1.SurpassingtheSolubilityLimits -- 3.2.PrecipitationReaction -- 3.3.MicrostructuresStability -- 3.4.StrengthandConductivity -- 4.SummaryandOutlook -- Acknowledgment -- References -- Chapter 10  NEW MATERIALS FOR TECHNOLOGICAL APPLICATIONS FROM THE  TI CR CU TERNARY SYSTEM -- ABSTRACT -- INTRODUCTION -- Background -- From the Binaries Ti Cr, Ti Cu and Cr Cu to the Ternary  Ti Cr Cu System -- EXPERIMENTAL -- RESULTS -- Phase Equilibria in the Ti Cr Cu System at 800 °C -- The Pseudo Binary (Ti1 Xcrx)(Cr1 Ycuy)2 Phase -- The Ternary Compound Ti3(Crxcu1 X)5 -- The Pseudo Binary (Ti1 Xcrx)2(Crycu1 Y) -- The Pseudo Binary (Ti1 Xcux)(Crycu1 Y) -- The Pseudo Binary Ti2(Crxcu1 X)3 and Ti3(Crxcu1 X)4 -- The Binary Ticu4 Phase -- Metastable \"Ti3Cu\" and \"Ticu3\" Phases -- Physical Properties of a Fcc Cu Solid Solution Phase and the Ternary Ti3CrCu4 Compound -- CONCLUDING SUMMARY -- REFERENCES -- Chapter 11  CHEMICAL MECHANICAL POLISHING OF COPPER ALLOYS -- 1. INTRODUCTION -- "]
[{"$nulls":4},"2. FUNDAMENTALS OF CHEMICAL MECHANICAL POLISHING -- 2.1. Material Removal Rate, MRR -- 2.2. Chemical Processes and Related Mechanisms of Material Removal -- 3. SLURRY COMPOSITIONS -- 4. POLISHING PAD DESIGN -- CONCLUSIONS -- ACKNOWLEDGMENT -- REFERENCES -- INDEX."]
[null,null,null,"Sommario/riassunto","This books presents current research in the study of the preparation, properties and applications of copper alloys. Topics discussed include the electrodeposition of copper based alloys for giant magneto resistance applications; the mechanical properties of copper under dynamic load; copper alloy micro-structures for application in microreactors and high strength copper-based conductor materials."]