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[null,"1.","Record Nr.",null,"UNINA9910954964003321"]
[null,null,"Titolo",null,"Nanoimprinting and its applications / / edited by Akihiro Miyauchi"]
[null,null,"Pubbl/distr/stampa",null,"Singapore : , : Jenny Stanford Publishing, , [2019]"]
[{"$nulls":4},"©2019"]
[null,null,"ISBN",null,"0-429-03192-0"]
[{"$nulls":4},"0-429-62687-8"]
[{"$nulls":4},"0-429-62851-X"]
[null,null,"Edizione",null,"[1st ed.]"]
[null,null,"Descrizione fisica",null,"1 online resource (210 pages)"]
[null,null,"Disciplina",null,"621.381531"]
[null,null,"Soggetti",null,"Nanolithography"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,"Nota di contenuto",null,"Cover -- Half Title -- Title Page -- Copyright Page -- Contents -- Preface -- 1. Introduction -- 1.1 Background -- 1.2 Principle of Nanoimprinting -- 1.3 Applications -- 2. Template Technology -- 2.1 Template Fabrication -- 2.1.1 Photolithography -- 2.1.2 Self-Organization by a Block Copolymer -- 2.1.3 Self-Organization by Anodic Oxidation -- 2.1.4 Interference Exposure -- 2.2 Release Process -- 2.2.1 Release Layer -- 2.2.2 Degradation of the Release Layer -- 2.2.3 Recovery of the Release Layer -- 3. Thermal Nanoimprinting -- 3.1 Process -- 3.2 Resin Materials -- 3.3 Molds -- 3.4 Equipment -- 3.5 Example of Thermal Nanoimprinting: Sheet Nanoimprinting -- 3.5.1 Experimental -- 3.5.2 Results and Analysis -- 4. Photonanoimprinting -- 4.1 Process -- 4.2 Materials -- 4.2.1 UV-Curable Resin -- 4.2.2 Coupling Treatment -- 4.3 Molds -- 4.3.1 Glass Mold -- 4.3.2 Soft Mold -- 4.4 Equipment -- 4.4.1 Parallel Press -- 4.4.2 Roll Press -- 4.5 Example of Photonanoimprinting -- 4.5.1 Process Sequence -- 4.5.2 Soft Mold -- 4.5.3 Coupling Treatment Process -- 4.5.4 Dry Etching of Aluminum -- Appendix A: Fidelity of a Soft Mold -- Appendix B: Resin Viscosity in Nanospace -- Appendix C: Restriction of Air Bubbles -- 5. Room-Temperature Nanoimprinting -- 5.1 Introduction -- 5.2 RT-NILUsing a PDMS Mold -- 5.2.1 Patterning -- 5.2.2 Three-Dimensional Nanostructure Fabrication -- 5.3 Example of NIL -- 5.3.1 Moth Eye Structure Fabrication -- 5.3.2 Gold Nanoparticle Formation Using an Imprinted HSQ Pattern for SERS -- 5.4 Conclusions -- 6. Basic Mechanisms of Nanoimprint Lithography -- 6.1 "]
[{"$nulls":4},"Introduction -- 6.2 Basic Process Mechanisms -- 6.3 Result and Discussion -- 6.3.1 Impact of the Applied Pressure -- 6.3.2 Impact of the Aspect Ratio -- 6.3.3 Impact of the Initial Resin Thickness -- 6.4 Defect Analysis and Process Optimization."]
[{"$nulls":4},"6.4.1 Typical Defect in High-Aspect-Ratio Pattern Fabrication -- 6.4.2 Simulation and Experiments -- 6.4.2.1 Step 1: Pressing and holding -- 6.4.2.2 Step 2: Cooling -- 6.4.2.3 Step 3: Releasing -- 6.4.3 Optimization of the Process Sequence -- 6.4.4 High-Aspect-Ratio Pattern Fabrication -- 6.5 Time-Dependent Analysis -- 6.5.1 Numerical Models -- 6.5.2 Experimental Study -- 6.5.3 Result and Discussion -- 6.6 Summary -- 7. UV Nanoimprint Lithography Process Simulation -- 7.1 Introduction -- 7.2 Resist-Filling Process -- 7.2.1 Numerical Model -- 7.2.2 Resist Droplet Process under Air Ambient -- 7.2.3 Resist Spin-Coating Process under Condensable Gas Ambient -- 7.3 UV Exposure Process -- 7.3.1 Numerical Model -- 7.3.2 Simulation Models and Demonstrations -- 7.3.2.1 Impact of feature size -- 7.3.2.2 Impact of optical index -- 7.4 UV Curing Process -- 7.4.1 Numerical Model -- 7.5 Experimental Results -- 7.5.1 Photoinitiator Concentration during UV Exposure -- 7.5.2 Monomer Conversion -- 7.5.3 Elastic Modulus -- 7.6 Summary -- 8. Demolding Process Simulation -- 8.1 Introduction -- 8.2 Numerical Model -- 8.2.1 Numerical Model -- 8.2.2 Parameter Extraction by Experiment -- 8.3 Demolding Mechanism -- 8.4 Result and Discussion -- 8.4.1 Impact on the Critical Stresses P[sub(s)] and P[sub(n)] -- 8.4.2 Impact on Aspect Ratio -- 8.4.3 Impact on Sidewall Slope Angle -- 8.5 Summary -- 9. Measurement and Analysis Methods in Nanoimprinting -- 9.1 Pattern Observation by Scanning Electron Microscopy -- 9.2 Pattern Observation and Frictional Force Measurements by Atomic Force Microscopy -- 9.3 Differential Scanning Calorimetry for Glass Transition Temperature and UV Curing Speed -- 10. Applications -- 10.1 Optical Applications -- 10.1.1 Antireflection -- 10.1.2 Polarizer -- 10.1.3 Microlens -- 10.2 Biodevices -- 10.2.1 Cell Culture -- 10.2.2 Immunoassay."]
[{"$nulls":4},"10.3 Applications to Energy Devices -- 10.3.1 Fuel Cells -- 10.3.2 Solar Cells -- 10.4 Electric Devices -- 10.5 Nanoimprint Lithography for the High-Volume Manufacturing of Advanced Semiconductor Devices -- 10.5.1 Introduction -- 10.5.2 Wafer Imprint Tool -- 10.5.2.1 Wafer throughput -- 10.5.2.2 Alignment and overlay -- 10.5.2.3 Defectivity and mask life -- 10.5.3 Mask Replication Systems -- 10.5.3.1 Critical dimension uniformity -- 10.5.3.2 Image placement -- 10.5.4 Conclusions -- Appendix D: Bragg's Law -- Index."]
[null,null,null,"Sommario/riassunto","Nanoimprinting has grown rapidly since it was proposed in 1995 by Prof. Chou. Now machines, resins, and molds for nanoimprinting are commercially available worldwide. The application fields of nanoimprinting are expanding to not only electronics but also optics, biology, and energy because nanoimprinting is a simple and convenient method for nanofabrication, and some devices are now being mass-produced. In the near future, the application of nanoimprinting in display and semiconductor fields is expected. This book explains the fundamentals of nanoimprinting in terms of materials, processes, and machines. It also describes the applications of nanoimprinting in optics, biology, energy, and electronics. In addition, it includes as many practical examples of nanoimprinting as possible. The fundamentals will help advanced undergraduate and graduate students understand nanoimprinting. The examples will be useful for both researchers working in nanoimprinting for the first time and engineers involved in research and development of various devices using nanostructures."]