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[null,"1.","Record Nr.",null,"UNINA9910780122303321"]
[null,null,"Autore",null,"Shinder Thomas W"]
[null,null,"Titolo",null,"MCSA/MCSE exam 70-291 study guide and DVD training system [[electronic resource] ] : implementing, managing, and maintaining a Windows Server 2003 network infrastructure / / Thomas W. Shinder, Debra Shinder Littlejohn and Susan Snedaker"]
[null,null,"Pubbl/distr/stampa",null,"[Rockland, Mass.], : Syngress, 2003"]
[null,null,"ISBN",null,"1-281-05617-0"]
[{"$nulls":4},"9786611056179"]
[{"$nulls":4},"0-08-047924-3"]
[null,null,"Edizione",null,"[1st edition]"]
[null,null,"Descrizione fisica",null,"1 online resource (1073 p.)"]
[null,null,"Disciplina",null,"005.447682"]
[null,null,"Soggetti",null,"Electronic data processing personnel - Certification"]
[{"$nulls":4},"Microsoft software - Examinations"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,"Nota di contenuto",null,"Cover; Exam Objectives Map; Contents; Foreword; Chapter 1 Reviewing TCP/IP Basics; Chapter 2 Variable Length Subnet Masking and Client Configuration; Chapter 3 The Dynamic Host Configuration Protocol; Chapter 4 NetBIOS Name Resolution and WINS; Chapter 5 Domain Naming System Concepts; Chapter 6 The Windows Server 2003 DNS Server; Configuring the Windows Server 2003 Routing and Remote Access Service VPN Services; Chapter 8 Configuring the Windows 2003 Routing and Remote Access Service LAN Routing, Dial-up Services, and Routing Protocols; Chapter 9 Security Templates and Software Updates"]
[{"$nulls":4},"Chapter 10 Monitoring and Troubleshooting Network ActivitySelf-Test Questions, Answers, and Explanations; Index; Related Titles"]
[null,null,null,"Sommario/riassunto","Syngress Study Guides guarantee comprehensive coverage of all exam objectives. There are no longer any short cuts or gimmicks that allow candidates to pass Microsoft's new, more rigorous exams. The days of cramming to become a \"\"paper MCSE\"\" are over; candidates must have a full grasp of all core concepts and plenty of hands-on experience to become certified. This book provides complete coverage of Microsoft Exam 70-291 and features one-of-a-kind integration of text, DVD-quality instructor-led training, and Web-based exam simulation and remediation, this study guide & DVD training system gives"]
[null,"2.","Record Nr.",null,"UNINA9910830208203321"]
[null,null,"Titolo",null,"Van der Waals heterostructures : fabrications, properties and applications / / edited by Zhuo Kang [and three others]"]
[null,null,"Pubbl/distr/stampa",null,"Weinheim, Germany : , : Wiley-VCH, , [2023]"]
[{"$nulls":4},"©2023"]
[null,null,"ISBN",null,"3-527-83388-9"]
[{"$nulls":4},"3-527-83386-2"]
[null,null,"Descrizione fisica",null,"1 online resource (338 pages)"]
[null,null,"Disciplina",null,"595.731"]
[null,null,"Soggetti",null,"Heterostructures"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Includes index."]
[null,null,"Nota di contenuto",null,"Cover -- Title Page -- Copyright Page -- Contents -- Preface -- Chapter 1 The 2D Semiconductor Library -- 1.1 Introduction -- 1.2 Emerging 2DLMs for Future Electronics -- 1.2.1 Classification -- 1.2.2 Elemental 2DMLs -- 1.2.2.1 IV A Group -- 1.2.2.2 V group A -- 1.2.2.3 III A Group -- 1.2.3 Hexagonal Boron Nitride (h-BN) -- 1.2.4 Transition Metal Dichalcogenides (TMDCs) -- 1.2.5 Transition Metal Carbides (TMCs) -- 1.2.6 Transition Metal Oxides (TMOs) -- References -- Chapter 2 The 2D Semiconductor Synthesis and Performances -- 2.1 Exfoliation -- 2.1.1 Starting from Graphene -- 2.1.2 Semiconducting 2D Materials -- 2.1.3 Big Family of Exfoliated 2D Materials -- 2.1.4 Mechanical Exfoliation of 2D Materials -- 2.1.5 Liquid Exfoliation of 2D Materials -- 2.1.6 Other Exfoliation Method of 2D Materials -- 2.2 Chemical Vapor Deposition -- 2.2.1 Overview of Chemical Vapor Deposition -- 2.2.2 Atmospheric Pressure Chemical Vapor Deposition (APCVD) -- 2.2.2.1 Synthesis of Single-Element Materials (Graphene) -- 2.2.2.2 Synthesis of TMDCs Bielement Materials -- 2.2.3 Low-Pressure Chemical Vapor Deposition (LPCVD) -- 2.2.3.1 Synthesis of Single-Element Materials (Graphene) -- 2.2.3.2 Synthesis of TMDCs Bielement Materials -- 2.2.3.3 Synthesis of Multielement Materials -- 2.2.4 Plasma-Enhanced Chemical Vapor Deposition -- 2.2.4.1 Overview -- 2.2.4.2 Synthesis of Graphene by PECVD -- 2.2.4.3 Synthesis of VG Nanosheets by PECVD -- 2.2.4.4 Synthesis of TMDCs by PECVD -- 2.2.5 MOCVD -- 2.2.5.1 Overview -- 2.2.5.2 Synthesis of III-V Group Semiconductor by MOCVD -- 2.2.5.3 Synthesis of TMDCs by MOCVD -- References -- Chapter 3 The VdW Heterostructure Controllable "]
[{"$nulls":4},"Fabrications -- 3.1 Wet Transfer -- 3.1.1 Substrate Etching Techniques -- 3.1.2 Electrochemical Delamination Methods -- 3.1.3 Wedging Transfer Method -- 3.2 Controllable Selective Synthesis."]
[{"$nulls":4},"3.2.1 Controllable Synthesis of 2D-2D Heterostructures -- 3.2.1.1 Vertical 2D-2D Heterostructures -- 3.2.1.2 Horizontal 2D-2D Heterostructures -- 3.2.1.3 One-Dimensional Heterostructures -- 3.2.2 Controllable Synthesis of 2D-1D Heterostructures -- 3.2.3 Controllable Synthesis of 2D-3D Heterostructures -- 3.3 Dry Transfer -- 3.3.1 Thermal-release Tape -- 3.3.2 Stamps -- 3.3.3 The Pick-up Methods -- References -- Chapter 4 The Mixed-dimensional VdW Heterostructures -- 4.1 Categorization of Mixed-dimensional VdWHs -- 4.2 Strategies for Constructing Mixed-dimensional VdWHs -- 4.2.1 Transfer-assisted Assembly of Mixed-dimensional VdWHs -- 4.2.2 Direct Growth of Mixed-dimensional VdWHs -- 4.3 Electronic and Sensing Applications -- 4.3.1 Transistors and Spintronics -- 4.3.2 Chemical Sensors -- 4.4 Optoelectronic and Photonic Applications -- 4.4.1 2D-0D Hybridization -- 4.4.2 2D-1D Hybridization -- 4.4.3 2D-3D Hybridization -- 4.5 Energy Applications -- 4.5.1 Application in Photocatalytic Water Splitting -- 4.5.2 Application in Rechargeable Batteries -- 4.5.3 Application in Supercapacitors -- 4.6 Conclusions -- References -- Chapter 5 The VdW Heterostructure Interface Physics -- 5.1 Band Alignment and Charge Transfer in VdWHs -- 5.2 Magnetic Coupling in VdWHs -- 5.2.1 Applications in Valleytronics -- 5.2.2 Applications in Spintronics -- 5.3 Moiré Pattern -- 5.3.1 Band Structure in Moiré Lattice -- 5.3.2 Flat Band-Introduced Superconductivity in Bilayer Graphene -- 5.3.3 Moiré Excitons -- 5.3.4 Moiré Lattice Topology -- 5.4 VdWHs for Protection -- 5.4.1 Introduction of Hexagonal Boron Nitride -- 5.4.2 Graphene Capsulated by h-BN -- 5.4.3 Transition Metal Dichalcogenides Capsulated by h-BN -- 5.4.4 Black Phosphorus Capsulated by h-BN -- 5.5 Characterization Techniques for VdWHs."]
[{"$nulls":4},"5.5.1 Scanning Transmission Electron Microscopy for Characterization of Structural and Related Properties -- 5.5.2 Scanning Probe Microscopy for Characterization of Structural and Electrical Properties -- 5.5.3 Optical and Vibrational Spectroscopy for Characterization of Electron-, Exciton-, and Phonon-Related Properties -- References -- Chapter 6 The VdW Heterostructure Multi-field Coupling Effects -- 6.1 Introduction -- 6.2 The Multifield Coupling Effect Characterization for 2D Van der Waals Structures -- 6.2.1 The Multifield Microscopy Techniques on 2D VdW Structures -- 6.2.1.1 The Electric-Field-Integrated STM-STS Technique -- 6.2.1.2 The Thermal-Field-Integrated STM-STS Technique -- 6.2.1.3 The Multifield-Integrated TEM Technique -- 6.2.1.4 The Optical-Field-Integrated KPFM Technique -- 6.2.2 The Multifield Optical Spectroscopy Techniques on 2D VdW Structures -- 6.2.2.1 The TERS Technique Based on STM and Raman Spectroscopy -- 6.2.2.2 The S-SNOM Based on AFM -- 6.2.3 The Perspective of Multifield Integration Characterization for 2D VdW Structures -- 6.3 The Multifield Modulation for Electrical Properties of 2D Van der Waals Structures -- 6.3.1 Strain-Engineered Electrical Properties of 2D VdW Structures -- 6.3.2 Electric Field-Engineered Electrical Properties of 2D VdW Structures -- 6.3.3 Thermal-Engineered Electrical Properties of VdW Structures -- 6.4 The Multifield Modulation for Optical Properties of 2D Van der Waals Structures -- 6.4.1 Strain-Engineered Optical Properties of 2D VdW Structures -- 6.4.2 Electric-Engineered Optical Properties of 2D VdW Structures -- 6.4.3 Thermal-Engineered Optical Properties of VdW Structures -- References -- Chapter 7 VdW Heterostructure Electronics -- 7.1 Van der Waals PN Junctions -- 7.2 Van der Waals Metal-"]
[{"$nulls":4},"Semiconductor Junctions -- 7.3 Field-effect Transistor -- 7.3.1 Basic Structure."]
[{"$nulls":4},"7.3.2 Advantage Characteristics -- 7.3.3 2D Dielectric Materials -- 7.4 Junction Field-Effect Transistor -- 7.4.1 Current-Voltage Features -- 7.4.2 Working Principle -- 7.4.3 Device Structure -- 7.4.4 Applications -- 7.5 Tunneling Field-Effect Transistor -- 7.5.1 The History of TFET -- 7.5.2 Mechanism of TFET -- 7.5.3 Application of TFET -- 7.6 Van der Waals Integration -- References -- Chapter 8 VdW Heterostructure Optoelectronics -- 8.1 Photodetectors -- 8.1.1 Photovoltaic Effect -- 8.1.2 Photoconductive Effect -- 8.1.3 Tunneling Effect -- 8.1.4 Photo-Thermoelectric Effect -- 8.1.5 Improvement Strategies -- 8.2 Light Emission -- 8.2.1 Light-Emitting Diodes -- 8.2.2 Lasering -- 8.2.3 Single Photon -- 8.3 Optical Modulators -- 8.3.1 All-Optical Modulators -- 8.3.2 Electro-Optic Modulators -- 8.3.3 Thermo-Optic Modulators -- References -- Chapter 9 VdW Heterostructure Electrochemical Applications -- 9.1 Solar Energy -- 9.2 Van der Waals Heterostructure Application in Hydrogen Energy -- 9.2.1 Producing Hydrogen by Water Photolysis -- 9.2.2 Producing Hydrogen by Water Electrolysis -- 9.3 Battery -- 9.3.1 Lithium-ion Batteries, Sodium-ion Batteries, Potassium-ion Batteries -- 9.3.2 Supercapacitors -- 9.4 Catalyst -- 9.5 Biotechnology -- 9.5.1 Biosensors -- 9.5.2 Tissue Engineering -- References -- Chapter 10 Perspective and Outlook -- 10.1 Overall Development Status of 2D Materials -- 10.1.1 Material Preparation: Scalability, Uniformity, and Reproducibility -- 10.1.2 Metrology -- 10.1.3 Construction of Heterostructure: Industry-Compatible Integration Process -- 10.2 Compatibility Between 2D Van der Waals Device Processing and Silicon Technology -- 10.2.1 Compatibility of 2D Van der Waals Device Integration with Traditional Silicon-Based Process -- 10.2.2 Differences Between 2D van der Waals Devices and Traditional Silicon-Based Processes."]
[{"$nulls":4},"10.2.3 2D van der Waals Device Integration Beyond Silicon Technology -- 10.3 Promising Roadmap of Van der Waals Heterostructure Devices [Medium term: 5 years, Long term: 5-10 years] -- 10.4 Promising Roadmap of Optoelectronic Device -- 10.5 Conclusion and Prospect -- References -- Index -- EULA."]
[null,"3.","Record Nr.",null,"UNINA9910896522803321"]
[null,null,"Titolo",null,"Advances in Dynamics of Vehicles on Roads and Tracks III : Proceedings of the 28th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2023, August 21–25, 2023, Ottawa, Canada - Volume 2: Road Vehicles / / edited by Wei Huang, Mehdi Ahmadian"]
[null,null,"Pubbl/distr/stampa",null,"Cham : , : Springer Nature Switzerland : , : Imprint : Springer, , 2024"]
[null,null,"ISBN",null,"3-031-66968-1"]
[null,null,"Edizione",null,"[1st ed. 2024.]"]
[null,null,"Descrizione fisica",null,"1 online resource (997 pages)"]
[null,null,"Collana",null,"Lecture Notes in Mechanical Engineering, , 2195-4364"]
[null,null,"Disciplina",null,"629.049"]
[null,null,"Soggetti",null,"Automotive engineering"]
[{"$nulls":4},"Dynamics"]
[{"$nulls":4},"Nonlinear theories"]
[{"$nulls":4},"Transportation engineering"]
[{"$nulls":4},"Traffic engineering"]
[{"$nulls":4},"Automotive Engineering"]
[{"$nulls":4},"Applied Dynamical Systems"]
[{"$nulls":4},"Transportation Technology and Traffic Engineering"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,null,"Sommario/riassunto","This book offers a timely snapshot of research and development in road vehicle dynamics. Gathering a set of peer-reviewed contributions to the 28th Symposium of the International Association of Vehicle System Dynamics (IAVSD), which was held on August 21–25, 2023 in Ottawa, Canada, this second volume of the proceedings covers a broad range of topics related to on- and off-road vehicles. Topics covered include modelling and simulation, design, control, performance monitoring, and autonomous driving. The papers in this volume also discuss strategies to improve safety, performance, and ride comfort, among others. Overall, this book provides academics and professionals with a timely reference on state-of-the-art theories and methods that can be used to understand, analyze, and improve on- and off-road vehicle safety and performance in a wide range of operating conditions. Chapter \"A Semi-physical Multi-layer Tyre Temperature Model that Enables a Pragmatic Parameter Identification\" is available open access "]
[{"$nulls":4},"under a Creative Commons Attribution 4.0 International License via link.springer.com."]