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[null,"1.","Record Nr.",null,"UNINA9910872987903321"]
[null,null,"Titolo",null,"2001 IEEE Electrical Performance of Electronic Packaging"]
[null,null,"Pubbl/distr/stampa",null,"[Place of publication not identified], : I E E E, 2001"]
[null,null,"Descrizione fisica",null,"1 online resource (xi, 344 pages) : illustrations"]
[null,null,"Disciplina",null,"621.381/046"]
[null,null,"Soggetti",null,"Electronic packaging"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Bibliographic Level Mode of Issuance: Monograph"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"MONDAY, OCTOBER 29, 2001\t -- SESSION I - KEYNOTE\t -- A Future View of Server Systems (Keynote) 3\t(4) -- SESSION II - LOW POWER\t -- Architectural Approaches to Reducing Power Rtem Costs (Invited Paper) 7\t(2) -- ``Watts'' the Matter: Power Reduction Issues (Invited Paper) 9\t(2) -- Digital Signal Processors (DSPs) for Low Power Consumption Wireless Applications (Invited Paper) 11\t(6) -- SESSION III - RF/MICROWAVE\t -- Characterization of the Novel Anisotropic Uniplanar Compact Photonic Band-Gap Ground Plane (UC-PBG-GP) 17\t(4) -- Measuring Radiation of Small Electronic Equipment in Three-Dimensional TEM Cells 21\t(4) -- Effects of Decreasing Extent of Electromagnetic Field at LSI Mounting Area on Radiated Emission from PCB 25\t(4) -- Millimeter Wave Package Design: A Comparison of Simulation and Measurement Results 29\t(6) -- SESSION IV - TRANSMISSION LINE MODELING\t -- Recovering Lossy Multiconductor Transmission Line Parameters From Impedance or Scattering Representations 35\t(4) -- The Effects of Via Transitions on Differential Signals 39\t(4) -- Analysis of Transmission Line Circuits Using Multi-Dimensional Model Reduction Techniques (Student Paper) 43\t(4) -- Prime: Passive Realization of Interconnect Models from Measured Data 47\t(4) -- Time-Domain Scattering Method Using Triangle Impulse Responses for Modeling Electronic Packaging Components 51\t(4) -- Analysis of Transmission Line Structures Using a Dynamic Analysis through WIPL-D 55\t(6) -- SESSION V - OPEN FORUM (POSTERS) AND RECEPTION\t -- Power Distribution\t -- Reducing Power Bus Impedance at Resonance with Lossy Components (Student Paper) 61\t(4) -- Characterization of Via-Induced Parallel-Plate Resonances in a Printed Circuit Board 65\t(4) -- Modelling of Multi-Layered Power Supply Planes with Vias 69\t(4) "]
[{"$nulls":4},"-- Characterization of On-Chip Capacitance Effects for I/O Circuits and Core Circuits 73\t(4) -- Analysis of Power/Ground Planes by PCB Simulator with Model Order Reduction Technique 77\t(4) -- Signal Integrity\t -- The Use of Loop Inductances in Signal Integrity Modeling 81\t(4) -- Design and Verification of Differential Transmission Lines 85\t(4) -- Composite Effects of Reflections and Ground Bounce for Signal Line through a Split Power Plane 89\t(4) -- Microwave\t -- Integrated RF Function Architectures in Fully-Organic SOP Technology 93\t(4) -- Development of RF/Microwave On-chip Inductors Using an Organic Micromachining Process 97\t(4) -- Development of Planar Antennas in Multi-layer Packages for RF-System-on-a-Package Applications 101\t(4) -- CPW High Q Inductors on Organic Substrates (Student Paper) 105\t(4) -- Microwave Frequency Crosstalk Model of Redistribution Line Patterns of Wafer Level Package 109\t(4) -- Measurements\t -- Robust Extraction of the Frequency-Dependent Characteristic Impedance of Transmission Lines using One-port TDR Measurements - (Student Paper) 113\t(4) -- Picosecond-pulse Propagation Measurement on Microstrip Meander Lines Using a Novel Optical Near-Field Mapping Probe (Student Paper) 117\t(4) -- Measurement of RF Properties of Glob Top and Under-Encapsulant Materials 121\t(4) -- A Broad Band Through-Line-Line De-Embedding Technique for BGA Package Measurements 125\t(4) -- A De-embedding Technique for Interconnects 129\t(4) -- Characterization of Thin Film Organic Materials at High Frequency 133\t(4) -- Complex Dielectric Constant Measurement Techniques for High-Speed Signaling 137\t(4) -- Modeling Techniques\t -- Model Extraction and Waveform Correlation via a Generalized Frequency-and Time-Domain Optimizer 141\t(4) -- Equivalent Circuit Representation and Dimension Reduction Technique for Efficient FDTD Modeling of Power/Ground Plane (Student Paper) 145\t(4) -- Modelling Complex Via Hole Structures 149\t(4) -- Comparison Between Chebyshev and Power Series Expansion Functions for Interpolating Data 153\t(4) -- Field Analysis in Inhomogeneously-Filled Stripline Circuits 157\t(4) -- Modeling of Multi-vias Coupling for High Speed Interconnects 161\t(4) -- Fast Capacitance Extraction of Conductors Embedded in a Layered Medium (Student Paper) 165\t(4) -- Modeling of Interconnects and Electromagnetic Field Distributions Using FDTD Method 169\t(4) -- Reduced-Order Models based on Measured S-Parameters for Time-Frequency Analysis of Microwave Circuits using Genetic Algorithms 173\t(4) -- An Iteration-Free Fast Multilevel Solver for Dense Method of Moment Systems 177\t(4) -- Fast Electromagnetic Modeling for Electronic Packaging in Layered Media 181\t(4) -- An Alternating Implicit Block Overlapped FDTD (AIBO-FDTD) Method and Its Estimation with Parallel Computation 185\t(4) -- Crosstalk for Curvilinear Conductors by Utilising a Nonuniform Transmission Line Approach 189\t(4) -- Unit Cell Modeling of Meander Delay Line based on Finite-Difference Time-Domain Method and Floquet's Theorem (Student Paper) 193\t(6) -- TUESDAY, OCTOBER 30, 2001\t -- SESSION VI - POWER DISTRIBUTION\t -- Simulations of Frequency Dependencies of Delta-I Noise 199\t(4) -- Simultaneous Switching Noise Analysis on Bus Lines Using Coupled Circuit and Electromagnetic Simulation 203\t(4) -- Analysis of Multi-Layered Irregular Power Distribution Planes with Vias Using Transmission Matrix Method (Student Paper) 207\t(4) -- An Approach to Measuring Power Supply Impedance of Microprocessors 211\t(4) -- Powering Intel® Pentium® 4 Generation Processors 215\t(6) -- SESSION VII - EM MODELING\t -- Flat Package Industance Extraction with Ground Plane Current "]
[{"$nulls":4},"Precalculation (Student Paper) 221\t(4) -- Generalized PEEC Models for Three-Dimensional Interconnect Structures and Integrated Passives of Arbitrary Shapes 225\t(4) -- Efficient Construction of Two-Port Passive Macromodels for Resonant Network (Student Paper) 229\t(4) -- Coupled Electromagnetic-Circuit Simulation of Arbitraily-Shaped Conducting Structures 233\t(4) -- New Efficient Method of Modeling Electronics Packages with Power and Ground Planes 237\t(6) -- SESSION VIII - MODEL ORDER REDUCTION\t -- Recent Advances in Reduced-Order Modeling of Complex Interconnects 243\t(4) -- Physically Consistent Transmission Line Models For High-Speed Interconnects in Lossy Dielectrics 247\t(4) -- Triangle Impulse Response (TIR) Calculation for Lossy Transmission Line Simulation (Student Paper) 251\t(4) -- A Comparative Study of Two Transient Analysis Algorithms for Lossy Transmission Lines with Frequency-Dependent Data 255\t(4) -- Global Multi-Level Reduction Technique for Nonlinear Simulation of High-Speed Interconnect Circuits (Student Paper) 259\t(6) -- SESSION IX - POWER DECOUPLING\t -- Modeling Shared-Via Decoupling in a Multi-Layered Structure using the CEMPIE Approach 265\t(4) -- ARIES: Using Annual-Ring Embedded Resistors to Set Capacitor ESR in Power Distribution Networks 269\t(4) -- Design Oriented Analysis of Package Power Distribution System Considering Target Impedance for High Performance Microprocessors 273\t(4) -- Effective Decoupling Radius of Decoupling Capacitor 277\t(6) -- WEDNESDAY, OCTOBER 31, 2001\t -- SESSION X - SYSTEM DESIGN\t -- Modeling and Measurement of the Alpha 21364 Package 283\t(4) -- SI and Design Considerations for Gbps PCBs In Communication Systems 287\t(4) -- Design and Performance Evaluation of Pentium® III Microprocessor Packaging 291\t(4) -- Design Optimization Methodology for Simultaneous Bidirectional Interface 295\t(4) -- High Bandwidth Low Latency Chip To Chip Interconnects Using High Performance MLC Glass Ceramic Power4R MCM 299\t(4) -- A Novel Efficient Approach of Including Frequency-Dependent Power Delivery Effects in Bus Signal Integrity Simulation 303\t(6) -- SESSION XI - MEASUREMENT\t -- Package Model Extraction from Multi-port S-parameters 309\t(4) -- Understanding Modeling and Measurements of Differential Transmission Lines 313\t(4) -- Experimental Study of the Ground Plane in Asymmetric Coupled Silicon Lines 317\t(4) -- High Sensitivity Magnetic Near Field Probe Based on Ferromagnetic Thin-Film Technology 321\t(6) -- SESSION XII - MODELING\t -- Solution Space Analysis of"]
[{"$nulls":4},"Interconnects for Low Voltage Differential Signaling (LVDS) Applications 327\t(4) -- Behavioral Modeling of Digital IC Input and Output Ports 331\t(4) -- Accurate Closed-Forum Expressions for the Frequency-Dependent Line Parameters of Coupled On-Chip Interconnects on Silicon Substrate 335\t(4) -- RF Modeling of Vertical Interconnection Between Power-Ground Plane Combined with 2D TLM 339\t(4) -- Author Index 343."]