{"text_format":"2","workbook":"xls","n_sheets":1,"sheets":["report2"],"not_rendered":{"charts":0,"images":0,"macros":0,"external_links":1,"defined_names":1,"comments":0,"pivot_tables":0},"unopened":[],"bounds":{"document_bytes":16777216,"sheet_cells":100000,"run_cost":"one","rows_first":2000,"rows_last":500,"rows_between":2000,"halvings":0,"cell_chars":16384,"cell_head_chars":4096},"cells_cut":0,"cells_raw":0,"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"report2","index":0,"n_rows":22,"n_cols":5,"rows_kept":22,"cut":false,"hidden":false,"merged":[[0,2,0,3],[0,4,0,5],[1,2,1,3],[1,4,1,5],[2,2,2,3],[4,2,4,3],[6,2,6,3],[7,2,7,3],[8,2,8,3],[10,2,10,3],[11,2,11,3],[15,2,15,3]],"flags":["formulas_cached_only"]}
[null,"1.","Record Nr.",null,"UNINA9910831075903321"]
[null,null,"Titolo",null,"Silicon nanomembranes : fundamental science and applications / / edited by John A. Rogers and Jong-Hyun Ahn"]
[null,null,"Pubbl/distr/stampa",null,"Weinheim, Germany : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2016"]
[{"$nulls":4},"©2016"]
[null,null,"ISBN",null,"3-527-69100-6"]
[{"$nulls":4},"3-527-69099-9"]
[null,null,"Descrizione fisica",null,"1 online resource (369 p.)"]
[null,null,"Disciplina",null,"660.2842"]
[null,null,"Soggetti",null,"Membranes (Technology)"]
[{"$nulls":4},"Nanosilicon"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references at the end of each chapters and index."]
[null,null,"Nota di contenuto",null,"Cover; Title Page; Copyright; Contents; List of Contributors; Part 1 Materials and Processes; Chapter 1 Synthesis, Assembly, and Applications of Semiconductor Nanomembranes; 1.1 Introduction; 1.2 Strategies for Forming Silicon Nanomembranes; 1.2.1 Selective Etching to Release Nanomembranes from Layered Assemblies; 1.2.2 Anisotropic Etching to Release Silicon Nanomembranes from Bulk Silicon Wafers; 1.3 Transfer Printing for Deterministic Assembly; 1.3.1 Introduction; 1.3.2 Mechanics of Transfer Printing; 1.3.3 Transfer Printing for Single- and Multilayer Deterministic Assembly"]
[{"$nulls":4},"1.4 Compressive Buckling for Deterministic Assembly1.4.1 Introduction; 1.4.2 Buckling on Compliant Substrates for Wavy Layouts; 1.4.3 Patterned Adhesion for Controlled, Large-Scale Buckling; 1.4.4 Deterministic Assembly of Complex, Three-Dimensional Architectures by Compressive Buckling; 1.5 Functional Devices Made from Silicon Nanomembranes; 1.5.1 Physically Transient Electronics; 1.5.2 Injectable, Cellular-Scale Optoelectronic Devices for the Brain; 1.5.3 Three-Dimensional Integumentary Membranes for Spatiotemporal Cardiac Measurements; 1.5.4 Arthropod Eyes Inspired Digital Camera"]
[{"$nulls":4},"1.5.5 Cephalopod Skins Inspired Optoelectronic Camouflage Systems1.6 Conclusions and Outlook; References; Chapter 2 Models of Reactive Diffusion for Resorbable Electronics; 2.1 Introduction; 2.2 Hydrolysis of Silicon Nanomembranes; 2.3 Material-Level Dissolution; 2.4 Dissolution of Device with Layered Structures; 2.5 Discussion and Conclusion; "]
[{"$nulls":4},"Acknowledgments; References; Part 2 Applications in Bio-Integrated and Flexible Electronics; Chapter 3 Transparent and Foldable Electronics Enabled by Si Nanomembranes; 3.1 Introduction; 3.2 Fabrication; 3.3 Characterization"]
[{"$nulls":4},"3.3.1 Mechanical Properties of Si NM in Bending and Stretching3.3.2 Optical Properties; 3.3.3 Piezoresistive Effect in Si NM; 3.4 Configurations of Transparent and Foldable Electronic Devices; 3.4.1 Representative Materials for Transparent and Foldable Electronics; 3.4.2 Electrical and Optical Properties of Transparent TFTs; 3.4.3 Modification of the Bending Stiffness with Substrate Thickness; 3.4.4 Electromechanical Properties of Foldable TFTs; 3.4.5 Control of Stiffness by Thinning of Si for Stretchable Electronic Devices; 3.4.6 Control of Strain Distribution by Geometrical Design"]
[{"$nulls":4},"3.4.7 Mechanical Properties of Stretchable Inverters3.5 Concluding Remarks; References; Chapter 4 High-Performance Flexible Electronic and Optoelectronic Devices by Mechanical Exfoliation from a Brittle Substrate; 4.1 Introduction; 4.2 Steady-State Substrate Cracking Parallel to the Interface in a Bilayers; 4.3 Spalling-Mode Fracture for Layer Transfer; 4.4 High-Performance Flexible Electronics by Controlled Spalling; 4.4.1 Ultra-Low-Power Nanoscale Silicon Integrated Circuits on Plastic; 4.4.2 Electrical Characteristics of Flexible Devices and Circuits"]
[{"$nulls":4},"4.4.3 Effect of Strain on Device Performance"]