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[null,"1.","Record Nr.",null,"UNINA9910830655703321"]
[null,null,"Autore",null,"Tulkoff Cheryl"]
[null,null,"Titolo",null,"Design for excellence in electronics manufacturing / / Cheryl Tulkoff, Greg Caswell"]
[null,null,"Pubbl/distr/stampa",null,"Hoboken, NJ : , : Wiley, , [2021]"]
[{"$nulls":4},"©2021"]
[null,null,"ISBN",null,"1-119-10939-6"]
[{"$nulls":4},"1-119-10938-8"]
[{"$nulls":4},"1-119-10940-X"]
[null,null,"Descrizione fisica",null,"1 online resource (xliii, 356 pages) : illustrations"]
[null,null,"Collana",null,"Wiley series in quality and reliability engineering"]
[null,null,"Disciplina",null,"621.381"]
[null,null,"Soggetti",null,"Electronic apparatus and appliances - Design and construction"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"Cover -- Title Page -- Copyright -- Contents -- Contributors -- List of Figures -- List of Tables -- Series Foreword -- Foreword -- Preface -- Acknowledgments -- Acronyms -- Chapter 1 Introduction to Design for Excellence -- 1.1 Design for Excellence (DfX) in Electronics Manufacturing -- 1.2 Chapter : Establishing a Reliability Program -- 1.3 Chapter : Design for Reliability (DfR) -- 1.4 Chapter : Design for the Use Environment: Reliability Testing and Test Plan Development -- 1.5 Chapter : Design for Manufacturability (DfM) -- 1.6 Chapter : Design for Sustainability -- 1.7 Chapter : Root Cause Problem‐Solving, Failure Analysis, and Continual Improvement Techniques -- Chapter 2 Establishing a Reliability Program -- 2.1 Introduction -- 2.2 Best Practices and the Economics of a Reliability Program -- 2.2.1 Best‐in‐Class Reliability Program Practices -- 2.3 Elements of a Reliability Program -- 2.3.1 Reliability Goals -- 2.3.2 Defined Use Environments -- 2.3.3 Software Reliability -- 2.3.4 General Software Requirements -- 2.4 Reliability Data -- 2.4.1 Sources of Reliability Data -- 2.4.2 Reliability Data from Suppliers -- 2.5 Analyzing Reliability Data: Commonly Used Probability and Statistics Concepts in Reliability -- 2.5.1 Reliability Probability in Electronics -- 2.5.2 Reliability Statistics in Electronics -- 2.5.2.1 Basic Statistics Assumptions and Caveats -- 2.5.2.2 Variation Statistics -- 2.5.2.3 Statistical Distributions Used in Reliability -- 2.6 Reliability Analysis and Prediction Methods -- 2.7 Summary -- References -- Chapter 3 Design for Reliability -- 3.1 "]
[{"$nulls":4},"Introduction -- 3.2 DfR and Physics of Failure -- 3.2.1 Failure Modes and Effects Analysis -- 3.2.2 Fault Tree Analysis -- 3.2.3 Sneak Circuit Analysis -- 3.2.4 DfR at the Concept Stage -- 3.3 Specifications (Product and Environment Definitions and Concerns)."]
[{"$nulls":4},"3.4 Reliability Physics Analysis -- 3.4.1 Reliability Physics Alternatives -- 3.4.2 Reliability Physics Models and Examples -- 3.4.2.1 Arrhenius Equation -- 3.4.2.2 Eyring Equation -- 3.4.2.3 Black's Equation -- 3.4.2.4 Peck's Law -- 3.4.2.5 Norris‐Landzberg Equation -- 3.4.2.6 Creep Mechanisms -- 3.4.3 Component Selection -- 3.4.4 Critical Components -- 3.4.5 Moisture‐Sensitivity Level -- 3.4.6 Temperature‐Sensitivity Level -- 3.4.7 Electrostatic Discharge -- 3.4.8 Lifetime -- 3.5 Surviving the Heat Wave -- 3.6 Redundancy -- 3.7 Plating Materials: Tin Whiskers -- 3.8 Derating and Uprating -- 3.9 Reliability of New Packaging Technologies -- 3.10 Printed Circuit Boards -- 3.10.1 Surface Finishes -- 3.10.1.1 Organic Solderability Preservative (OSP) -- 3.10.1.2 Immersion Silver (ImAg) -- 3.10.1.3 Immersion Tin (ImSn) -- 3.10.1.4 Electroless Nickel Immersion Gold (ENIG) -- 3.10.1.5 Lead‐Free Hot Air Solder Leveled (HASL) -- 3.10.2 Laminate Selection -- 3.10.3 Cracking and Delamination -- 3.10.4 Plated Through‐Holes and Vias -- 3.10.5 Conductive Anodic Filament -- 3.10.6 Strain and Flexure Issues -- 3.10.7 Pad Cratering -- 3.10.8 PCB Buckling -- 3.10.9 Electrochemical Migration -- 3.10.9.1 Temperature -- 3.10.9.2 Relative Humidity -- 3.10.9.3 Voltage Bias -- 3.10.9.4 Conductor Spacing -- 3.10.9.5 Condensation -- 3.10.10 Cleanliness -- 3.10.10.1 Chloride -- 3.10.10.2 Bromide -- 3.10.10.3 Cations -- 3.10.10.4 Weak Organic Acids -- 3.10.10.5 Cleanliness Testing -- 3.11 Non‐Functional Pads -- 3.12 Wearout Mechanisms -- 3.12.1 IC Wearout -- 3.13 Conformal Coating and Potting -- 3.13.1 Silicone -- 3.13.2 Polyurethane -- 3.13.3 Epoxy -- 3.13.4 Acrylic -- 3.13.5 Superhydrophobics -- References -- Chapter 4 Design for the Use Environment: Reliability Testing and Test Plan Development -- 4.1 Introduction -- 4.1.1 Elements of a Testing Program."]
[{"$nulls":4},"4.1.2 Know the Environment -- 4.2 Standards and Measurements -- 4.3 Failure‐Inducing Stressors -- 4.4 Common Test Types -- 4.4.1 Temperature Cycling -- 4.4.2 Temperature‐Humidity‐Bias Testing -- 4.4.3 Electrical Connection -- 4.4.4 Corrosion Tests -- 4.4.5 Power Cycling -- 4.4.6 Electrical Loads -- 4.4.7 Mechanical Bending -- 4.4.8 Random and Sinusoidal Vibration -- 4.4.9 Mechanical Shock -- 4.4.10 ALT Testing -- 4.4.11 Highly Accelerated Life Testing (HALT) -- 4.4.12 EMC Testing Dos and Don'ts -- 4.5 Test Plan Development -- 4.5.1 The Process -- 4.5.2 Failure Analysis -- 4.5.3 Screening Tests -- 4.5.4 Case Study One -- 4.5.5 Case Study Two -- 4.5.6 Case Study Three -- References -- Chapter 5 Design for Manufacturability -- 5.1 Introduction -- 5.2 Overview of Industry Standard Organizations -- 5.3 Overview of DfM Processes -- 5.3.1 The DfM Process -- 5.4 Component Topics -- 5.4.1 Part Selection -- 5.4.2 Moisture Sensitivity Level (MSL) -- 5.4.3 Temperature Sensitivity Level (TSL) -- 5.4.4 ESD -- 5.4.5 Derating -- 5.4.6 Ceramic Capacitor Cracks -- 5.4.7 Life Expectancies -- 5.4.8 Aluminum Electrolytic Capacitors -- 5.4.9 Resistors -- 5.4.10 Tin Whiskers -- 5.4.11 Integrated Circuits -- 5.5 Printed Circuit Board Topics -- 5.5.1 Laminate Selection -- 5.5.2 Surface Finish -- 5.5.3 Discussion of Different Surface Finishes -- 5.5.4 Stackup -- 5.5.5 Plated Through‐Holes -- 5.5.6 Conductive Anodic Filament (CAF) Formation -- 5.5.7 Copper Weight -- 5.5.8 Pad Geometries -- 5.5.9 Trace and Space Separation -- 5.5.10 Non‐Functional Pads -- 5.5.11 Shipping and Handling -- 5.5.12 Cleanliness and Contamination -- 5.6 Process Materials -- 5.6.1 Solder -- 5.6.2 Solder Paste -- 5.6.3 Flux -- 5.6.4 Stencils -- 5.6.5 Conformal Coating "]
[{"$nulls":4},"-- 5.6.6 Potting -- 5.6.7 Underfill -- 5.6.8 Cleaning Materials -- 5.6.9 Adhesives -- 5.7 Summary: Implementing DfM -- References."]
[{"$nulls":4},"Chapter 6 Design for Sustainability -- 6.1 Introduction -- 6.2 Obsolescence Management -- 6.2.1 Obsolescence‐Resolution Techniques -- 6.2.1.1 Industry Standards -- 6.2.1.2 Asset Security -- 6.3 Long‐Term Storage -- 6.4 Long‐Term Reliability Issues -- 6.5 Counterfeit Prevention and Detection Strategies -- 6.6 Supplier Selection -- 6.6.1 Selecting a Printed Circuit Board Fabricator -- 6.6.2 Auditing a Printed Circuit Board Fabricator -- 6.6.2.1 Selecting a Contract Manufacturer -- 6.6.2.2 Auditing a Contract Manufacturer -- 6.6.2.3 Summary -- References -- Chapter 7 Root Cause Problem‐Solving, Failure Analysis, and Continual Improvement Techniques -- 7.1 Introduction -- 7.1.1 Continual Improvement -- 7.1.2 Problem‐Solving -- 7.1.3 Identifying Problems and Improvement Opportunities -- 7.1.4 Overview of Industry Standard Organizations -- 7.2 Root Cause Failure Analysis Methodology -- 7.2.1 Strategies for Selecting an Approach -- 7.2.2 The 5 Whys Approach -- 7.2.3 The Eight Disciplines (8D) -- 7.2.4 Shainin Red X: Diagnostic Journey -- 7.2.5 Six Sigma -- 7.2.6 Physics of Failure -- 7.3 Failure Reporting, Analysis, and Corrective Action System (FRACAS) -- 7.4 Failure Analysis -- 7.4.1 Failure Analysis Techniques -- 7.4.1.1 Visual Inspection -- 7.4.1.2 Electrical Characterization -- 7.4.1.3 Scanning Acoustic Microscopy -- 7.4.1.4 X‐Ray Microscopy -- 7.4.1.5 Thermal Imaging -- 7.4.1.6 SQUID Microscopy -- 7.4.1.7 Decapsulation -- 7.4.1.8 Cross‐Sectioning -- 7.4.1.9 Scanning Electron Microscope / Energy Dispersive X‐ray Spectroscopy (SEM/EDX) -- 7.4.1.10 Surface/Depth Profiling Techniques: Secondary Ion Mass Spectroscopy (SIMS), Auger -- 7.4.1.11 Focused Ion Beam (FIB) -- 7.4.1.12 Mechanical Testing: Wire Pull, Wire Shear, Solder Ball Shear, Die Shear -- 7.4.1.13 Fourier Transform Infra‐Red Spectroscopy FTIR -- 7.4.1.14 Ion Chromatography."]
[{"$nulls":4},"7.4.1.15 Differential Scanning Calorimetry (DSC) -- 7.4.1.16 Thermomechanical Analysis / Dynamic Mechanical Analysis (DMA/TMA) -- 7.4.1.17 Digital Image Correlation (DIC) -- 7.4.1.18 Other Simple Failure Analysis Tools -- 7.4.2 Failure Verification -- 7.4.3 Corrective Action -- 7.4.4 Closing the Failure Report -- 7.5 Continuing Education and Improvement Activities -- 7.6 Summary: Implementing Root Cause Methodology -- References -- Chapter 8 Conclusion to Design for Excellence: Bringing It All Together -- 8.1 Design for Excellence (DfX) in Electronics Manufacturing -- 8.2 Chapter 2: Establishing a Reliability Program -- 8.3 Chapter : Design for Reliability (DfR) -- 8.4 Chapter : Design for the Use Environment: Reliability Testing and Test Plan Development -- 8.5 Chapter : Design for Manufacturability -- 8.6 Chapter : Design for Sustainability -- 8.7 Chapter : Root Cause Problem Solving, Failure Analysis, and Continual Improvement Techniques -- Index -- EULA."]
[null,null,null,"Sommario/riassunto","\"Design for Excellence in Electronics Manufacturing offers comprehensive, up to date coverage specific to design and reliability of electronics. The book will highlight how utilizing the DfX concepts of Design for Reliability, Design for Manufacturability, Design for Environment, Design for Testability, etc., will not only reduce research and development costs, but will also decrease time to market and allow companies to confidently issue warranty coverage. Ultimately, Design for Excellence will increase customer satisfaction, market share, and long term profits. The Design for Excellence material is critical for engineers and management who wish to learn best practices regarding product design. Practices need to be adjusted for different manufacturing processes, suppliers, use environments, and reliability "]
[{"$nulls":4},"expectations, and this book will demonstrate how to do just that\"--"]
[null,"2.","Record Nr.",null,"UNINA9910143610903321"]
[null,null,"Titolo",null,"Computer Safety, Reliability, and Security : 19th International Conference, SAFECOMP 2000, Rotterdam, The Netherlands, October 24-27, 2000 Proceedings / / edited by Floor Koornneef, Meine van der Meulen"]
[null,null,"Pubbl/distr/stampa",null,"Berlin, Heidelberg : , : Springer Berlin Heidelberg : , : Imprint : Springer, , 2000"]
[null,null,"ISBN",null,"3-540-40891-6"]
[null,null,"Edizione",null,"[1st ed. 2000.]"]
[null,null,"Descrizione fisica",null,"1 online resource (X, 438 p.)"]
[null,null,"Collana",null,"Lecture Notes in Computer Science, , 0302-9743 ; ; 1943"]
[null,null,"Disciplina",null,"005.1"]
[null,null,"Soggetti",null,"Computer engineering"]
[{"$nulls":4},"Computers"]
[{"$nulls":4},"Data encryption (Computer science)"]
[{"$nulls":4},"Software engineering"]
[{"$nulls":4},"Computers, Special purpose"]
[{"$nulls":4},"Computer logic"]
[{"$nulls":4},"Computer Engineering"]
[{"$nulls":4},"Computing Milieux"]
[{"$nulls":4},"Cryptology"]
[{"$nulls":4},"Software Engineering/Programming and Operating Systems"]
[{"$nulls":4},"Special Purpose and Application-Based Systems"]
[{"$nulls":4},"Logics and Meanings of Programs"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Bibliographic Level Mode of Issuance: Monograph"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references at the end of each chapters and index."]
[null,null,"Nota di contenuto",null,"Invited Paper -- The Ten Most Powerful Principles for Quality in (Software and) Software Organizations for Dependable Systems -- Verification and Validation -- Empirical Assessment of Software On-Line Diagnostics Using Fault Injection -- Speeding-Up Fault Injection Campaigns in VHDL Models -- Specification and Verification of a Safety Shell with Statecharts and Extended Timed Graphs -- Validation of Control System Specifications with Abstract Plant Models -- A Constant Perturbation Method for Evaluation of Structural Diversity in Multiversion Software -- Expert Error: The Case of Trouble-Shooting in Electronics -- The Safety Management of Data-Driven Safety-Related "]
[{"$nulls":4},"Systems -- Software Support for Incident Reporting Systems in Safety-Critical Applications -- Software Process Improvement -- A Dependability-Explicit Model for the Development of Computing Systems -- Deriving Quantified Safety Requirements in Complex Systems -- Improving Software Development by Using Safe Object Oriented Development : OTCD -- A Safety Licensable PES for SIL 4 Applications -- Safety and Security Issues in Electric Power Industry -- Dependability of Computer Control Systems in Power Plants -- A Method of Analysis of Fault Trees with Time Dependencies -- Formal Methods -- A Formal Methods Case Study: Using Light-Weight VDM for the Development of a Security System Module -- Formal Methods: The Problem Is Education -- Formal Methods Diffusion: Past Lessons and Future Prospects -- Invited Paper -- Safe Tech: A Control Oriented Viewpoint -- Safety Guidelines, Standards and Certification -- Derivation of Safety Targets for the Random Failure of Programmable Vehicle Based Systems -- IEC 61508 — A Suitable Basis for the Certification of Safety-Critical Transport-Infrastructure Systems ?? -- Hardware Aspects -- An Approach to Software Assisted Recovery from Hardware Transient Faults for Real Time Systems -- Programmable Electronic System Design & Verification Utilizing DFM -- SIMATIC S7-400F/FH: Safety-Related Programmable Logic Controller -- Safety Assessment I -- Assessment of the Reliability of Fault-Tolerant Software: A Bayesian Approach -- Estimating Dependability of Programmable Systems Using BBNs -- Design for Safety -- Improvements in Process Control Dependability through Internet Security Technology -- A Survey on Safety-Critical Multicast Networking -- Invited Paper -- Causal Reasoning about Aircraft Accidents -- Transport & Infrastructure -- Controlling Requirements Evolution: An Avionics Case Study -- HAZOP Analysis of Formal Models of Safety-Critical Interactive Systems -- Failure Mode and Effect Analysis for Safety-Critical Systems with Software Components -- Safety Assessment II -- Risk Ordering of States in Safecharts -- Dependability Evaluation: Model and Method Based on Activity Theory -- Forensic Software Engineering and the Need for New Approaches to Accident Investigation."]
[null,null,null,"Sommario/riassunto","This book constitutes the refereed proceedings of the 19th International Conference on Computer Safety, Reliability, and Security, SAFECOMP 2000, held in Rotterdam, The Netherlands in October 2000.The 33 revised full papers presented together with three invited papers were carefully reviewed and selected for inclusion in the book. The papers are organized in topical sections on verification and validation; software process improvement; formal methods; safety guidelines, standards and certification; hardware aspects; safety assessment; design for safety; and transport and infrastructure."]