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[null,"1.","Record Nr.",null,"UNINA9910830486103321"]
[null,null,"Autore",null,"Lee HoSung"]
[null,null,"Titolo",null,"Thermal design : heat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells / / Hosung Lee"]
[null,null,"Pubbl/distr/stampa",null,"Hoboken, NJ : , : John Wiley & Sons, Inc., , [2022]"]
[{"$nulls":4},"©2022"]
[null,null,"ISBN",null,"1-119-68604-0"]
[{"$nulls":4},"1-119-68603-2"]
[null,null,"Edizione",null,"[Second edition.]"]
[null,null,"Descrizione fisica",null,"1 online resource (931 pages)"]
[null,null,"Disciplina",null,"621.4021"]
[null,null,"Soggetti",null,"Heat engineering - Materials"]
[{"$nulls":4},"Thermodynamics"]
[{"$nulls":4},"Heat-transfer media"]
[{"$nulls":4},"Thermoelectric apparatus and appliances"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references."]
[null,null,"Nota di contenuto",null,"Heat Sinks -- Heat Pipes -- Compact Heat Exchangers -- Thermoelectric Design -- Thermoelectric Materials -- Solar Cells -- Appendix A: Thermophysical Properties -- Appendix B -- Appendix C: Pipe Dimensions -- Appendix D: Periodic Table -- Appendix E: Thermoelectric Properties -- Appendix F: Fermi Integral -- Appendix G: Hall Factor -- Appendix H: Curve Fitting of Working Fluids -- Appendix L: Tutorial for MathCAD -- Appendix M: Conversion Factors."]
[null,null,null,"Sommario/riassunto","\"In this significantly updated new edition, Thermal Design details the physical mechanisms of standard thermal devices while integrating essential formulas and detailed derivations to give a practical understanding of the field to students. The textbook examines the design of thermal devices through mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Moreover, it presents information on significant thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems -- all of which are increasingly important and fundamental to numerous fields such as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space.\"--"]