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[null,"1.","Record Nr.",null,"UNINA9910814624003321"]
[null,null,"Titolo",null,"Scientific computing in electrical engineering / / Jan Sykulski, editor"]
[null,null,"Pubbl/distr/stampa",null,"Bradford, [England] : , : Emerald Insight, , 2014"]
[{"$nulls":4},"2014"]
[null,null,"ISBN",null,"1-78350-765-9"]
[null,null,"Descrizione fisica",null,"1 online resource (417 p.)"]
[null,null,"Collana",null,"COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, , 0332-1649 ; ; Volume 33, Number 4"]
[null,null,"Disciplina",null,"621.3"]
[null,null,"Soggetti",null,"Electrical engineering - Data processing"]
[{"$nulls":4},"Electrical engineering"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references."]
[null,null,"Nota di contenuto",null,"Cover; Editorial advisory board; Editorial; A reduced basis method for microwave semiconductor devices with geometric variations; Broadband surface impedance boundary conditions for higher order time domain discontinuous Galerkin method; Polynomial fitting of nonlinear sources with correlating inputs; Multiscale simulation of organic heterojunction light harvesting devices; Index-aware model order reduction: LTI DAEs in electric networks; Dielectric breakdown simulations of an OLTC in a transformer ; Robust DC and efficient time-domain fast fault simulation"]
[{"$nulls":4},"Efficient convolution based impedance boundary conditionsOptimal frequency sweep method in multi-rate circuit simulation; Heat generation in silicon nanometric semiconductor  devices; An efficient algorithm for a certain class of robust optimization problems; Quasi 3D modelling and simulation of axial flux machines; Convergence behaviour of coupled pressure and thermal networks; Extended Brauer model for ferromagnetic materials: analysis and computation; Analyzing distortion contributions in a complex device model; Modeling of streamers in transformer oil using OpenFOAM"]
[{"$nulls":4},"Back-reflector design in thin-film silicon solar cells by rigorous 3D light propagation modeling A novel and fast voltage estimation scheme for assessment of power system component outages; A two-step model to optimise transcutaneous electrical stimulation of the human upper arm; A multi-valve controlled saturable reactor and its harmonic optimization; Distorted constriction contact resistance between "]
[{"$nulls":4},"clamped slabs; Efficient evaluation of the earth return mutual impedance of overhead conductors over a horizontally multilayered soil"]
[{"$nulls":4},"Simulation of charge packet formation in layered polymer filmIso-geometric shape optimization of magnetic density separators; Design and performance analysis of live model of Bessel beamformer for adaptive array system; Control of limit cycles in buck converters; Through silicon vias: from a physical point of view to a compact models initiation"]
[null,null,null,"Sommario/riassunto","The Scientific Computing in Electrical Engineering (SCEE) 2012 conference was held September 11-14, 2012 in Zürich Switzerland.The focus of SCEE is on the following topics, with an emphasis on communicating new ideas and algorithms for numerical simulations: computational electromagnetics; circuit and device modelling and simulation; coupled problems; mathematical and computational methods; and model order reduction.Seventeen selected contributions to the conference are published in this ebook of COMPEL and were subject to the journal's regular peer-reviewing procedures."]
[null,"2.","Record Nr.",null,"UNINA9910337937203321"]
[null,null,"Titolo",null,"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging : Materials, Processes, Equipment, and Reliability / / edited by Kim S. Siow"]
[null,null,"Pubbl/distr/stampa",null,"Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019"]
[null,null,"ISBN",null,"3-319-99256-2"]
[null,null,"Edizione",null,"[1st ed. 2019.]"]
[null,null,"Descrizione fisica",null,"1 online resource (XX, 279 p. 175 illus., 122 illus. in color.)"]
[null,null,"Disciplina",null,"620.11295"]
[{"$nulls":4},"620.11297"]
[null,null,"Soggetti",null,"Optical materials"]
[{"$nulls":4},"Electronics - Materials"]
[{"$nulls":4},"Electronics"]
[{"$nulls":4},"Microelectronics"]
[{"$nulls":4},"Metals"]
[{"$nulls":4},"Materials science"]
[{"$nulls":4},"Engineering—Materials"]
[{"$nulls":4},"Quality control"]
[{"$nulls":4},"Reliability"]
[{"$nulls":4},"Industrial safety"]
[{"$nulls":4},"Optical and Electronic Materials"]
[{"$nulls":4},"Electronics and Microelectronics, Instrumentation"]
[{"$nulls":4},"Metallic Materials"]
[{"$nulls":4},"Characterization and Evaluation of Materials"]
[{"$nulls":4},"Materials Engineering"]
[{"$nulls":4},"Quality Control, Reliability, Safety and Risk"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,"Nota di contenuto",null,"Chapter 1: Silver Sintering and Soldering: Bonding Process and Comparison -- Chapter 2: Sintered Silver for LED Applications -- Chapter 3: Process Control of Sintered Ag Joint in Production for Die-Attach Applications -- Chapter 4: Thermomechanical Modeling of High-Temperature Bonded Interface Materials -- Chapter 5: Reliability and Failure Mechanisms of Sintered Ag as Die Attach Joint -- Chapter6: "]
[{"$nulls":4},"Morphological changes in sintered silver due to atomic migration -- Chapter 7: Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials -- Chapter 8: Sintered Copper : Chemistry, Process and Reliability -- Chapter 9: Transient Liquid Phase Bonding -- Chapter 10: Die attach materials for extreme conditions and harsh environments."]
[null,null,null,"Sommario/riassunto","This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field."]