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[null,"1.","Record Nr.",null,"UNINA9910807457303321"]
[null,null,"Autore",null,"Hirsch Francine <1967->"]
[null,null,"Titolo",null,"Empire of nations : ethnographic knowledge and the making of the Soviet Union / / Francine Hirsch"]
[null,null,"Pubbl/distr/stampa",null,"©2005"]
[{"$nulls":4},"Ithaca, New York : , : Cornell University Press, , [2005]"]
[null,null,"ISBN",null,"0-8014-5593-6"]
[null,null,"Descrizione fisica",null,"1 online resource (xx, 368 pages)"]
[null,null,"Disciplina",null,"947.004"]
[null,null,"Soggetti",null,"Ethnology - Soviet Union"]
[{"$nulls":4},"Soviet Union Ethnic relations"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,"2.","Record Nr.",null,"UNINA9910683350203321"]
[null,null,"Autore",null,"Lau John H."]
[null,null,"Titolo",null,"Chiplet Design and Heterogeneous Integration Packaging / / by John H. Lau"]
[null,null,"Pubbl/distr/stampa",null,"Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2023"]
[null,null,"ISBN",null,"9789811999178"]
[{"$nulls":4},"9789811999161"]
[null,null,"Edizione",null,"[1st ed. 2023.]"]
[null,null,"Descrizione fisica",null,"1 online resource (542 pages)"]
[null,null,"Disciplina",null,"354.81150006"]
[null,null,"Soggetti",null,"Electronics"]
[{"$nulls":4},"Electronic circuits"]
[{"$nulls":4},"Microtechnology"]
[{"$nulls":4},"Microelectromechanical systems"]
[{"$nulls":4},"Electronics and Microelectronics, Instrumentation"]
[{"$nulls":4},"Electronic Circuits and Systems"]
[{"$nulls":4},"Microsystems and MEMS"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding."]
[null,null,null,"Sommario/riassunto","The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc."]