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[null,"1.","Record Nr.",null,"UNINA9910798095903321"]
[null,null,"Autore",null,"Brown Geoff"]
[null,null,"Titolo",null,"Fostering good relationships : partnership work in therapy with looked after and adopted children / / by Geoff Brown"]
[null,null,"Pubbl/distr/stampa",null,"Boca Raton, FL : , : Routledge, an imprint of Taylor and Francis, , [2018]"]
[{"$nulls":4},"©2016"]
[null,null,"ISBN",null,"0-429-91387-7"]
[{"$nulls":4},"9780429896947"]
[{"$nulls":4},"0-429-89964-5"]
[{"$nulls":4},"0-429-47487-3"]
[{"$nulls":4},"1-78241-358-8"]
[null,null,"Descrizione fisica",null,"1 online resource (193 p.)"]
[null,null,"Collana",null,"United Kingdom Council for Psychotherapy Series"]
[null,null,"Disciplina",null,"362.734"]
[null,null,"Soggetti",null,"Adoption"]
[{"$nulls":4},"Foster home care"]
[{"$nulls":4},"Children - Institutional care"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"COVER; CONTENTS; ACKNOWLEDGEMENTS; ABOUT THE AUTHORS AND CONTRIBUTORS; SERIES EDITOR'S PREFACE; FOREWORD Fostering good relationships: partnership work in therapy with looked after and adopted children; Introduction: Why partnerships?; CHAPTER ONE Perspectives on the world of the looked after and adopted child; CHAPTER TWO The views of adoptive parents and a foster parent on partnership working; CHAPTER THREE Partnership with birth families; CHAPTER FOUR Therapeutic multi-disciplinary collaboration"]
[{"$nulls":4},"CHAPTER FIVE Helping children with challenge and change: partnership working in transitions and educationCHAPTER SIX Working together with the stories of children's troubled lives; CHAPTER SEVEN Finding a future beyond the crisis: looked after children in secure care; CHAPTER EIGHT Working in partnership with adolescents in care who have experienced early trauma; POSTSCRIPT; REFERENCES; INDEX"]
[null,null,null,"Sommario/riassunto","This book explores the importance of effective multi-agency and multi-disciplinary partnership work for the mental health of children and young people in care and adoption. It takes an overall systemic perspective, but the co-authors contribute different theoretical approaches. It focuses on practice, showing how practitioners can draw "]
[{"$nulls":4},"on their varied theoretical approaches to enhance the way they work together and in partnership with carers and with professionals from other agencies. The book provides a context that looks at the needs of children and young people in the care and adoption systems, the overall importance for their mental health of joined up 'corporate parenting', and national and local approaches to this. It then moves to focus on practical ways of working therapeutically in partnership with others who contribute diverse skills and perspectives, using specific case examples. Additional chapters look at collaborative ways of working with key carers to enhance their therapeutic role. Finally, some of the main elements of partnership collaboration are explored, as well as the challenges of work across agencies and disciplines."]
[null,"2.","Record Nr.",null,"UNINA9911019340303321"]
[null,null,"Titolo",null,"Lead-free electronics : iNEMI projects lead to successful manufacturing / / edited by Edwin Bradley ... [et al.]"]
[null,null,"Pubbl/distr/stampa",null,"Hoboken, N. J., : Wiley"]
[{"$nulls":4},"Piscataway, N. J., : IEEE Press, c2007"]
[null,null,"ISBN",null,"9786611032487"]
[{"$nulls":4},"9781281032485"]
[{"$nulls":4},"1281032484"]
[{"$nulls":4},"9780470171479"]
[{"$nulls":4},"0470171472"]
[{"$nulls":4},"9780470171462"]
[{"$nulls":4},"0470171464"]
[null,null,"Descrizione fisica",null,"1 online resource (468 p.)"]
[null,null,"Disciplina",null,"621.381531"]
[null,null,"Soggetti",null,"Lead-free electronics manufacturing processes"]
[{"$nulls":4},"Solder and soldering"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"Preface (Ronald W. Gedney) -- Contributors -- Introduction (Jasbir Bath and Carol A. Handwerker) -- Lead-Free Assembly Project -- Alloy Group -- Process Group -- Component Group -- Reliability Group -- Follow-On Projects/Work -- 1. Alloy Selection (Carol A. Handwerker, Ursula Kattner, Kilwon Moon, Jasbir Bath, Edwin Bradley, and Polina Snugovsky) -- 1.1. Introduction -- 1.2. Lead-Free Alloys Considered by iNEMI in 1999 as Replacements for Tin-Lead Eutectic Solder -- 1.3. Fundamental Properties of Lead-Free Solder Alloys Affecting Manufacturing and Reliability -- 1.4. R&D Issues Remaining in Lead-Free Solder Implementation -- 1.5. Summary -- References -- 2. Review and Analysis of Lead-Free Solder Material Properties (Jean-Paul Clech) -- 2.1. Introduction -- 2.2. Tin-Lead Properties and Models -- 2.3. Tin-Silver Properties and Creep Data -- 2.4. Tin-Silver-Copper Properties and Creep Data -- 2.5. Alloy Comparisons -- 2.6. General Conclusions/Recommendations -- Appendix A: Tin-Silver Creep Data -- Appendix B: Tin-Silver-Copper Creep Data -- Acknowledgments -- References -- 3. Lead-Free Solder Paste Technology (Ning-Cheng Lee) "]
[{"$nulls":4},"-- 3.1. Introduction -- 3.2. Materials -- 3.3. Rheology -- 3.4. Applications -- 3.5. Reflow Soldering -- 3.6. Microstructures of Reflowed Joints -- 3.7. Challenges of Lead-Free Reflow Soldering -- 3.8. Summary -- References -- 4. Impact of Elevated Reflow Temperatures on Component Performance (Richard D. Parker, Jack MCCullen, Nick Lycoudes, and R. J. Arvikar) -- 4.1. Introduction to Component \"Lead-Freé<U+009d> Issues -- 4.2. Moisture/Reflow Impact on Packaged Integrated Circuits -- 4.3. Impact of Increased Solder Peak Reflow Temperatures on Moisture Sensitivity Level Ratings -- 4.4. Impact of Increased Solder Peak Reflow Temperatures -- 4.5. Observations on Profiling for the Lead-Free Reflow Processes -- 4.6. IC Package Improvement Options for Better Package MSL at Higher Lead-Free Solder Reflow Temperatures."]
[{"$nulls":4},"4.7. Frequency Control Products -- 4.8. \"Lead-Freé<U+009d> Cost Impact on Components -- 4.9. Packaging Identification of Lead-free Packaged ICs -- 4.10. Conclusions -- Acknowledgments -- References -- 5. Lead-Free Assembly Reliability--General (Edwin Bradley) -- 5.1. Introduction -- 5.2. Basic Physical Properties of Solder -- 5.3. Creep Deformation -- 5.4. Thermal Fatigue -- 5.5. Creep Rupture -- 5.6. Isothermal (Mechanical) Fatigue -- 5.7. Out-of-Plane Bending -- 5.8. Impact/Shock Loading -- 5.9. Effect of Rework on Reliability -- 5.10. High-Temperature Operating Life (HTOL) -- 5.11. Electrochemical Migration -- 5.12. Tin Whiskering -- 5.13. Tin Pest -- 5.14. Summary -- Acknowledgments -- References -- 6. Lead-Free Assembly Reliability: iNEMI Evaluation and Results (Elizabeth Benedetto and John Sohn) -- 6.1. Reliability Team Goals -- 6.2. Reliability Test Matrix -- 6.3. Component-Paste-Board Finish Combinations -- 6.4. Components -- 6.5. Test Vehicles -- 6.6. Pre-Test/Post-Assembly Information -- 6.7. CTE Determination: Component and Boards -- 6.8. Thermal Cycling Conditions -- 6.9. Failure Criteria -- 6.10. Thermal Cycle Relative Performance -- 6.11. Failure Data, Analysis Packages -- 6.12. Weibull Analyses -- 6.13. Post-Cycling Failure Analysis -- 6.14. Bend Testing -- 6.15. Electrochemical Migration Testing [36, 37] -- 6.16. iNEMI Team Conclusions -- 6.17. Overall Summary, Conclusions -- 6.18. ASTM Test Methods -- References -- 7. Tin Whiskers: Mitigation Strategies and Testing (Heidi L. Reynolds, C. J. Lee, and Joe Smetana) -- 7.1. Introduction -- 7.2. Mitigation Strategies -- 7.3. Tin Whisker Test Development -- 7.4. Summary -- Acknowledgments -- References -- 8. Lead-Free Reflow and Rework (Jasbir Bath) -- 8.1. Introduction -- 8.2. Printability of Lead-Free Solder Pastes -- 8.3. Soak Versus Ramp Temperature Profiles -- 8.4. Effect of Peak Temperature Versus Reflow Performance -- 8.5. Effect of Reflow Atmosphere on Solderability of Lead-Free Solder."]
[{"$nulls":4},"8.6. Convection Versus IR Reflow Ovens -- 8.7. Reflow Temperature Delta on Boards and Components -- 8.8. Visual Inspection of Lead-Free Soldered Joints -- 8.9. Automated Optical Inspection (AOI) -- 8.10. X-ray Inspection of Lead-Free Soldered Joints -- 8.11. Acoustic Microscopy Inspection of Components Before and After Lead-Free Reflow -- 8.12. Lead-Free Rework of BGA/CSP Soldered Joints -- 8.13. Lead-Free Hand-Soldering Rework -- 8.14. In-Circuit Testing and Functional Testing (ICT/FT) of Soldered Joints -- 8.15. Yield Data -- 8.16. Surface-Mount Fillet Lifting and Reliability of Reflowed Soldered Joints -- 8.17. Conclusions -- 8.18. Future Work -- Acknowledgments -- References -- 9. Case Study: Pb-Free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies (Jerry Gleason, Charlie Reynolds, Matt Kelly, Jasbir Bath, Quyen Chu, Ken Lyjak, and Patrick Roubaud) -- 9.1. Introduction -- 9.2. Approach and Strategy -- 9.3. Observations and Results -- 9.4. Conclusions -- 9.5. Summary -- "]
[{"$nulls":4},"Acknowledgments -- References -- 10. Implementing RoHS and WEEE-Compliant Products (Jim MCElroy and Cynthia Williams) -- 10.1. Introduction -- 10.2. Are Your Products within the Scope of the EU ROHS? -- 10.3. Ten Steps to ROHS Compliance -- 10.4. Part Numbering Important for Differentiating Lead-Free from Tin-Lead Components and Boards -- 10.5. A Standards-Based Approach to Materials Declaration -- 10.6. Standards -- 10.7. High-Reliability Requirements -- 10.8. Business Impact of Supply Chain Conversion -- 10.9. Summary -- References -- Index."]
[null,null,null,"Sommario/riassunto","Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timely???most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly."]