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[null,"1.","Record Nr.",null,"UNINA9910789982003321"]
[null,null,"Titolo",null,"Injection molding [[electronic resource] ] : process, design, and applications / / Phoebe H. Kauffer, editor"]
[null,null,"Pubbl/distr/stampa",null,"New York, : Nova Science Publishers, c2011"]
[null,null,"ISBN",null,"1-61761-420-3"]
[null,null,"Descrizione fisica",null,"1 online resource (304 p.)"]
[null,null,"Collana",null,"Materials science and technologies"]
[null,null,"Disciplina",null,"668.4/12"]
[null,null,"Soggetti",null,"Injection molding of plastics"]
[{"$nulls":4},"Plastics"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"\"\"INJECTION MOLDING: PROCESS, DESIGN AND APPLICATIONS\"\"; \"\"INJECTION MOLDING: PROCESS, DESIGN AND APPLICATIONS\"\"; \"\"CONTENTS \"\"; \"\"PREFACE\"\"; \"\"OVERVIEW OF INJECTION MOLDING AS A MANUFACTURING TECHNIQUE FOR PHARMACEUTICAL APPLICATIONS \"\"; \"\"ABSTRACT \"\"; \"\"1. INTRODUCTION \"\"; \"\"2. MATERIALS USED IN INJECTION MOLDING\"\"; \"\"2.1. Carriers \"\"; \"\"2.2. Plasticizers \"\"; \"\"2.3. Active Pharmaceutical Ingredients \"\"; \"\"3. INJECTION MOLDING APPLICATIONS\"\"; \"\"3.1 Solid Dispersions\"\"; \"\"3.2. Oral Controlled Release Drug Delivery Systems \"\"; \"\"3.3. Medical Implants \"\"; \"\"3.4. Vaginal Rings/Inserts \"\""]
[{"$nulls":4},"\"\"3.5. Other (Bio)-Medical Applications \"\"\"\"CONCLUSION AND OUTLOOK \"\"; \"\"REFERENCES \"\"; \"\"MELT/SOLID WELDLINE IN OVER INJECTION MOLDING: INTERFACIAL CRYSTALLINE STRUCTURES AND ADHESION BETWEEN SEMICRYSTALLINE POLYMER INTERFACES \"\"; \"\"INTRODUCTION \"\"; \"\"EXPERIMENTAL \"\"; \"\"Material\"\"; \"\"Specimens Preparation \"\"; \"\"CHARACTERIZATION \"\"; \"\"Polarized Light Microscope (PLM)\"\"; \"\"Scanning Electron Microscope (SEM) \"\"; \"\"Lap Shear Measurement for Interfacial Bonding Strength \"\"; \"\"PART I. INTERFACIAL CRYSTALLINE STRUCTURES AND ADHESION BETWEEN SEMICRYSTALLINE POLYMER INTERFACES \"\""]
[{"$nulls":4},"\"\"1.1. Morphology Perpendicular to the Flow Direction \"\"\"\"1.2. Morphology along the Flow Direction \"\"; \"\"2. EFFECT OF TEMPERATURE ON INTERFACIAL MORPHOLOGY \"\"; \"\"3. EFFECT OF SHEAR STRESS ON INTERFACIAL MORPHOLOGY\"\"; \"\"4. THE FORMATION MECHANISM OF DIVERSE  INTERFACIAL CRYSTALLINE STRUCTURES\"\"; \"\"4.1. Competing Interfacial Morphology\"\"; \"\"4.2. Interfacial Shish-Kebab Layer (SKL)\"\"; "]
[{"$nulls":4},"\"\"4.3. Interfacial Transcrystalline Layer (TCL)\"\"; \"\"5. THE INTERFACIAL ADHESION OF THE INTERFACE \"\"; \"\"CONCLUSIONS \"\""]
[{"$nulls":4},"\"\"PART II. ENHANCEMENT OF INTERFACIAL ADHESION  AT ASYMMETRIC POLYMER INTERFACE VIA IN-SITU REACTIVE COMPATIBILIZATION \"\"\"\"Introduction \"\"; \"\"Experimental \"\"; \"\"Preparation of Specimens\"\"; \"\"Characterization \"\"; \"\"Interfacial Adhesion \"\"; \"\"Interfacial Morphology \"\"; \"\"Determination of the Density of Copolymers at the Interface \"\"; \"\"Interfacial Fracture Mechanism \"\"; \"\"SECTION I. THE INTERFACIAL ADHESION AND FRACTURE MECHANISM OF PE/PA6 IN SITU REACTIVE COMPATIBILIZED BY THE ADDITION OF PE-MAH INTO PE INTERFACE\"\""]
[{"$nulls":4},"\"\"1. Effect of PE-MAH Content and Processing Parameters on the Interfacial Adhesion \"\"\"\"2. Interfacial Morphology\"\"; \"\"3. Interfacial Fracture Mechanism \"\"; \"\"SECTION II. EFFECT OF GRADIENT COOLING ON THE REACTIVE REINFORCEMENT IN A SEQUENTIAL INJECTION MOLDING \"\"; \"\"1. The Relationship between IS andin a Sequential Injection Molding Process \"\"; \"\"2. The Relationship between IS andin Isothermal Annealing Process \"\"; \"\"SECTION III. EFFECT OF A TIE LAYER ON THE ENHANCED INTERFACIAL ADHESION BETWEEN PE AND PA6  IN A SEQUENTIAL INJECTION MOLDING \"\""]
[{"$nulls":4},"\"\"1. Effect of Processing Parameters on Interfacial Adhesion of Overinjection Molded PE/Tie Layer/PA6 Interface \"\""]