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[null,"1.","Record Nr.",null,"UNINA990004066120403321"]
[null,null,"Autore",null,"Bossy, John <1933- >"]
[null,null,"Titolo",null,"Christianity in the West 1400-1700 / John Bossy"]
[null,null,"Pubbl/distr/stampa",null,"Oxford : Oxford University Press, 1985"]
[{"$nulls":4},"New York"]
[null,null,"Descrizione fisica",null,"189 p. ; 20 cm"]
[null,null,"Collana",null,"Opus : Oxford paperbacks university series"]
[null,null,"Disciplina",null,"274.05"]
[null,null,"Locazione",null,"FLFBC"]
[null,null,"Collocazione",null,"274.05 BOS 1 (BIS)"]
[{"$nulls":4},"274.05 BOS 1 (TER)"]
[{"$nulls":4},"274.05 BOS 1"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,"2.","Record Nr.",null,"UNINA9910450385003321"]
[null,null,"Titolo",null,"Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu"]
[null,null,"Pubbl/distr/stampa",null,"Bradford, England, : Emerald Group Publishing, c2006"]
[null,null,"ISBN",null,"1-280-54757-X"]
[{"$nulls":4},"9786610547579"]
[{"$nulls":4},"1-84663-011-8"]
[null,null,"Descrizione fisica",null,"1 online resource (72 p.)"]
[null,null,"Collana",null,"Soldering & surface mount technology ; ; v.18, no. 2"]
[null,null,"Disciplina",null,"621.381/046"]
[null,null,"Soggetti",null,"Manufacturing processes"]
[{"$nulls":4},"Electronic packaging"]
[{"$nulls":4},"Electronic books."]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,"Nota di contenuto",null,"Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder"]
[{"$nulls":4},"Finite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary"]
[null,null,null,"Sommario/riassunto","This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i"]
[null,"3.","Record Nr.",null,"UNINA9910783234303321"]
[null,null,"Autore",null,"Laine Marlene de"]
[null,null,"Titolo",null,"Fieldwork, participation and practice [[electronic resource] ] : ethics and dilemmas in qualitative research / / Marlene de Laine"]
[null,null,"Pubbl/distr/stampa",null,"London ; Thousand Oaks, Calif., : SAGE, 2000"]
[{"$nulls":4},"London ; Thousand Oaks, Calif. : , : SAGE, , 2000"]
[null,null,"ISBN",null,"1-4462-2817-7"]
[{"$nulls":4},"1-280-36945-0"]
[{"$nulls":4},"9786610369454"]
[{"$nulls":4},"1-4129-3181-9"]
[null,null,"Descrizione fisica",null,"1 online resource (241 p.)"]
[null,null,"Disciplina",null,"174.9301"]
[{"$nulls":4},"300.72"]
[null,null,"Soggetti",null,"Social sciences - Methodology"]
[{"$nulls":4},"Social sciences - Fieldwork"]
[{"$nulls":4},"Qualitative research - Moral and ethical aspects"]
[{"$nulls":4},"Social sciences - Methodology - Moral and ethical aspects"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references (p. [216]-225) and index."]
[null,null,"Nota di contenuto",null,"Machine generated contents note: 1 -- Introduction -- 2 -- The moral career of the qualitative fieldworker -- 3 -- Scripts and staging the self -- 4 -- Back regions and sensitive methods -- 5 -- Roles and role performance -- 6 -- Ethical dilemmas: the demands and expectations -- of various audiences -- 7 -- Field notes: ethics and the emotional self -- 8 -- Textual 'impression management' of self and others -- 9 -- Conclusion -- References -- Index."]
[null,null,null,"Sommario/riassunto","This timely and topical look at the role of ethics in fieldwork takes into account some of the major issues confronting qualitative researchers. The main purposes of this book are twofold: to promote an understanding of the harmful possibilities of fieldwork; and to provide ways of dealing with ethical problems and dilemmas. To these ends, examples of actual fieldwork are provided that address ethical problems and dilemmas, and posit ways of dealing with them."]