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[null,"1.","Record Nr.",null,"UNINA9910779095003321"]
[null,null,"Autore",null,"Clayman CFA"]
[null,null,"Titolo",null,"Corporate finance [[electronic resource] ] : a practical approach / / [edited by] Michelle R. Clayman, Martin S. Fridson, George H. Troughton"]
[null,null,"Pubbl/distr/stampa",null,"Hoboken, N.J., : Wiley, 2012"]
[null,null,"ISBN",null,"1-118-21731-4"]
[{"$nulls":4},"1-280-59044-0"]
[{"$nulls":4},"9786613620279"]
[{"$nulls":4},"1-118-21729-2"]
[null,null,"Edizione",null,"[2nd ed.]"]
[null,null,"Descrizione fisica",null,"1 online resource (530 p.)"]
[null,null,"Collana",null,"CFA Institute investment series ; ; 42"]
[null,null,"Classificazione",null,"BUS027000"]
[null,null,"Disciplina",null,"658.15"]
[null,null,"Soggetti",null,"Corporations - Finance"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Includes index."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references (p. 475-479) and index."]
[null,null,"Nota di contenuto",null,"Corporate Finance: A Practical Approach; Contents; Foreword; Acknowledgments; About the CFA Institute Investment Series; Chapter 1: Corporate Governance; Learning Outcomes; 1. Introduction; 2. Corporate Governance: Objectives and Guiding Principles; 3. Forms of Business and Conflicts of Interest; 3.1. Sole Proprietorships; 3.2. Partnerships; 3.3. Corporations; 4. Specific Sources of Conflict: Agency Relationships; 4.1. Manager-Shareholder Conflicts; 4.2. Director-Shareholder Conflicts; 5. Corporate Governance Evaluation; 5.1. The Board of Directors"]
[{"$nulls":4},"5.2. Examples of Codes of Corporate Governance6. Environmental, Social, and Governance Factors; 7. Valuation Implications of Corporate Governance; 8. Summary; Problems; Chapter 2: Capital Budgeting; Learning Outcomes; 1. Introduction; 2. The Capital Budgeting Process; 3. Basic Principles of Capital Budgeting; 4. Investment Decision Criteria; 4.1. Net Present Value; 4.2. Internal Rate of Return; 4.3. Payback Period; 4.4. Discounted Payback Period; 4.5. Average Accounting Rate of Return; 4.6. Profitability Index; 4.7. NPV Profile; 4.8. Ranking Conflicts between NPV and IRR"]
[{"$nulls":4},"4.9. The Multiple IRR Problem and the No IRR Problem4.10. Popularity and Usage of the Capital Budgeting Methods; 5. Cash Flow Projections; 5.1. Table Format with Cash Flows Collected by Year; 5.2. Table Format with Cash Flows Collected by Type; 5.3. Equation Format for Organizing Cash Flows; 6. More on Cash Flow Projections; 6.1. Straight-Line and "]
[{"$nulls":4},"Accelerated Depreciation Methods; 6.2. Cash Flows for a Replacement Project; 6.3. Spreadsheet Modeling; 6.4. Effects of Inflation on Capital Budgeting Analysis; 7. Project Analysis and Evaluation; 7.1. Mutually Exclusive Projects with Unequal Lives"]
[{"$nulls":4},"7.2. Capital Rationing7.3. Risk Analysis of Capital Investments-Standalone Methods; 7.4. Risk Analysis of Capital Investments-Market Risk Methods; 7.5. Real Options; 7.6. Common Capital Budgeting Pitfalls; 8. Other Income Measures and Valuation Models; 8.1. The Basic Capital Budgeting Model; 8.2. Economic and Accounting Income; 8.3. Economic Profit, Residual Income, and Claims Valuation; 9. Summary; Problems; Chapter 3: Cost of Capital; Learning Outcomes; 1. Introduction; 2. Cost of Capital; 2.1. Taxes and the Cost of Capital; 2.2. Weights of the Weighted Average"]
[{"$nulls":4},"2.3. Applying the Cost of Capital to Capital Budgeting and Security Valuation3. Costs of the Different Sources of Capital; 3.1. Cost of Debt; 3.2. Cost of Preferred Stock; 3.3. Cost of Common Equity; 4. Topics in Cost of Capital Estimation; 4.1. Estimating Beta and Determining a Project Beta; 4.2. Country Risk; 4.3. Marginal Cost of Capital Schedule; 4.4. Flotation Costs; 4.5. What Do CFOs Do?; 5. Summary; Problems; Chapter 4: Measures of Leverage; Learning Outcomes; 1. Introduction; 2. Leverage; 3. Business Risk and Financial Risk; 3.1. Business Risk and Its Components; 3.2. Sales Risk"]
[{"$nulls":4},"3.3. Operating Risk"]
[null,null,null,"Sommario/riassunto","\"The book that fills the practitioner need for a distillation of the most important tools and concepts of corporate financeIn today's competitive business environment, companies must find innovative ways to enable rapid and sustainable growth not just to survive, but to thrive. Corporate Finance: A Practical Approach is designed to help financial analysts, executives, and investors achieve this goal with a practice-oriented distillation of the most important tools and concepts of corporate finance.Updated for a post-financial crisis environment, the Second Edition provides coverage of the most important issues surrounding modern corporate finance for the new global economy: Preserves the hallmark conciseness of the first edition while offering expanded coverage of key topics including dividend policy, share repurchases, and capital structure Current, real-world examples are integrated throughout the book to provide the reader with a concrete understanding of critical business growth concepts Explanations and examples are rigorous and global, but make minimal use of mathematics Each chapter presents learning objectives which highlight key material, helping the reader glean the most effective business advice possible Written by the experts at CFA Institute, the world's largest association of professional investment managers Created for current and aspiring financial professionals and investors alike, Corporate Finance focuses on the knowledge, skills, and abilities necessary to succeed in today's global corporate world\"--"]
[null,"2.","Record Nr.",null,"UNINA9910817124503321"]
[null,null,"Autore",null,"Voldman Steven H"]
[null,null,"Titolo",null,"ESD : failure mechanisms and models / / Steven H. Voldman"]
[null,null,"Pubbl/distr/stampa",null,"Chichester, West Sussex, U.K. ; ; Hoboken, NJ, : J. Wiley, 2009"]
[null,null,"ISBN",null,"9786612237133"]
[{"$nulls":4},"9781282237131"]
[{"$nulls":4},"1282237136"]
[{"$nulls":4},"9780470747254"]
[{"$nulls":4},"0470747250"]
[{"$nulls":4},"9780470747261"]
[{"$nulls":4},"0470747269"]
[null,null,"Edizione",null,"[1st ed.]"]
[null,null,"Descrizione fisica",null,"1 online resource (410 p.)"]
[null,null,"Disciplina",null,"621.381"]
[null,null,"Soggetti",null,"Semiconductors - Failures"]
[{"$nulls":4},"Integrated circuits - Protection"]
[{"$nulls":4},"Integrated circuits - Testing"]
[{"$nulls":4},"Integrated circuits - Reliability"]
[{"$nulls":4},"Electric discharges"]
[{"$nulls":4},"Electrostatics"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"ESD Failure Mechanisms and Models; Contents; About the Author; Preface; Acknowledgments; 1 Failure Analysis and ESD; 1.1 INTRODUCTION; 1.1.1 FA Techniques for Evaluation of ESD Events; 1.1.2 Fundamental Concepts of ESD FA Methods and Practices; 1.1.3 ESD Failure: Why Do Semiconductor Chips Fail?; 1.1.4 How to Use FA to Design ESD Robust Technologies; 1.1.5 How to Use FA to Design ESD Robust Circuits; 1.1.6 How to Use FA for Temperature Prediction; 1.1.7 How to Use Failure Models for Power Prediction; 1.1.8 FA Methods, Design Rules, and ESD Ground Rules"]
[{"$nulls":4},"1.1.9 FA and Semiconductor Process-Induced ESD Design Asymmetry 1.1.10 FA Methodology and Electro-thermal Simulation; 1.1.11 FA and ESD Testing Methodology; 1.1.12 FA Methodology for Evaluation of ESD Parasitics; 1.1.13 FA Methods and ESD Device Operation Verification; 1.1.14 FA Methodology to Evaluate Inter-power Rail Electrical Connectivity; 1.1.15 How to Use FA to Eliminate Failure Mechanisms; "]
[{"$nulls":4},"1.2 ESD FAILURE: HOW DO MICRO-ELECTRONIC DEVICES FAIL?; 1.2.1 ESD Failure: How Do Metallurgical Junctions Fail?; 1.2.2 ESD Failure: How Do Insulators Fail?; 1.2.3 ESD Failure: How Do Metals Fail?"]
[{"$nulls":4},"1.3 SENSITIVITY OF SEMICONDUCTOR COMPONENTS 1.3.1 ESD Sensitivity as a Function of Materials; 1.3.2 ESD Sensitivity as a Function of Semiconductor Devices; 1.3.3 ESD Sensitivity as a Function of Product Type; 1.3.4 ESD and Technology Scaling; 1.3.5 ESD Technology Roadmap; 1.4 HOW DO SEMICONDUCTOR CHIPS FAIL--ARE THE FAILURES RANDOM OR SYSTEMATIC?; 1.5 CLOSING COMMENTS AND SUMMARY; PROBLEMS; REFERENCES; 2 Failure Analysis Tools, Models, and Physics of Failure; 2.1 FA TECHNIQUES FOR EVALUATION OF ESD EVENTS; 2.2 FA TOOLS; 2.2.1 Optical Microscope; 2.2.2 Scanning Electron Microscope"]
[{"$nulls":4},"2.2.3 Transmission Electron Microscope 2.2.4 Emission Microscope; 2.2.5 Thermally Induced Voltage Alteration; 2.2.6 Superconducting Quantum Interference Device Microscope; 2.2.7 Atomic Force Microscope; 2.2.8 The 2-D AFM; 2.2.9 Picosecond Current Analysis Tool; 2.2.10 Transmission Line Pulse--Pico second Current Analysis Tool; 2.3 ESD SIMULATION: ESD PULSE MODELS; 2.3.1 Human Body Model; 2.3.2 Machine Model; 2.3.3 Cassette Model; 2.3.4 Socketed Device Model; 2.3.5 Charged Board Model; 2.3.6 Cable Discharge Event; 2.3.7 IEC System-Level Pulse Model; 2.3.8 Human Metal Model"]
[{"$nulls":4},"2.3.9 Transmission Line Pulse Testing 2.3.10 Very Fast Transmission Line Pulse (VF-TLP) Model; 2.3.11 Ultra-fast Transmission Line Pulse (UF-TLP) Model; 2.4 ELECTRO-THERMAL PHYSICAL MODELS; 2.4.1 Tasca Model; 2.4.2 Wunsch-Bell Model; 2.4.3 Smith-Littau Model; 2.4.4 Ash Model; 2.4.5 Arkihpov, Astvatsaturyan, Godovosyn, and Rudenko Model; 2.4.6 Dwyer, Franklin, and Campbell Model; 2.4.7 Vlasov-Sinkevitch Model; 2.5 STATISTICAL MODELS FOR ESD PREDICTION; 2.6 CLOSING COMMENTS AND SUMMARY; PROBLEMS; REFERENCES; 3 CMOS Failure Mechanisms; 3.1 TABLES OF CMOS ESD FAILURE MECHANISMS"]
[{"$nulls":4},"3.2 LOCOS ISOLATION-DEFINED CMOS"]
[null,null,null,"Sommario/riassunto","Electrostatic discharge (ESD) failure mechanisms continue to impact semiconductor components and systems as technologies scale from micro- to nano-electronics. This book studies electrical overstress, ESD, and latchup from a failure analysis and case-study approach. It provides a clear insight into the physics of failure from a generalist perspective, followed by investigation of failure mechanisms in specific technologies, circuits, and systems. The book is unique in covering both the failure mechanism and the practical solutions to fix the problem from either a technology or circuit method"]