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[null,"1.","Record Nr.",null,"UNINA9910777033903321"]
[null,null,"Autore",null,"Kelly Joe, Ph. D."]
[null,null,"Titolo",null,"Advanced production testing of RF, SoC, and SiP devices / / Joe Kelly, Michael Engelhardt"]
[null,null,"Pubbl/distr/stampa",null,"Boston : , : Artech House, , ©2007"]
[{"$nulls":4},"[Piscataqay, New Jersey] : , : IEEE Xplore, , [2006]"]
[null,null,"ISBN",null,"1-58053-710-3"]
[null,null,"Descrizione fisica",null,"1 online resource (325 p.)"]
[null,null,"Collana",null,"Artech House microwave library"]
[null,null,"Disciplina",null,"621.3815"]
[null,null,"Soggetti",null,"Systems on a chip - Testing"]
[{"$nulls":4},"Embedded computer systems"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"Advanced Production Testing of RF, SoC, and SiP Devices; Contents vii; Preface xvii; Acknowledgments xix; 1 Concepts of Production Testing of RF, SoC, and SiP Devices 1; 2 Tests and Measurements I: Fundamental RF Measurements; 3 Tests and Measurements II: Distortion 35; 4 Tests and Measurements III: Noise 59; 5 Advances in Testing RF and SoC Devices 97; 6 Production Test Equipment; 7 Cost of Test 139; 8 Calibration 159; 9 Contactors 175; 10 Handlers 201; 11 Load Boards 221; 12 Wafer Probing 253; Appendix A Power and Voltage Conversions 265"]
[{"$nulls":4},"Appendix B VSWR, Return Loss, and Reflection Coefficient 271Appendix C RF Coaxial Cables 275; Appendix D RF Connectors 277; Appendix E Decimal to Hexadecimal and ASCII Conversions 283; Appendix F Numerical Prefixes 287; About the Authors 289; Index 291"]
[null,null,null,"Sommario/riassunto","Featuring invaluable input from industry-leading companies and highly-regarded experts in the field, this first-of-its kind resource offers experienced engineers a comprehensive understanding of the advanced topics in RF, SiP (system-in-package), and SoC (system-on-a-chip) production testing that are critical to their work involving semiconductor devices. The book covers key measurement concepts for semiconductor device testing and assists engineers in explaining these concepts to management to aid in the reduction of project cost, time, and resources. Based on real-world experience and packed with time-saving equations, this in-depth volume offers professionals practical information on essential topics that have never been presented in a "]
[{"$nulls":4},"single reference before."]