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[null,"1.","Record Nr.",null,"UNINA9910708105003321"]
[null,null,"Titolo",null,"Anti-semitism : a growing threat to all faiths : hearing before the Subcommittee on Africa, Global Health, Global Human Rights, and International Organizations of the Committee on Foreign Affairs, House of Representatives, One Hundred Thirteenth Congress, first session, February 27, 2013"]
[null,null,"Pubbl/distr/stampa",null,"Washington : , : U.S. Government Printing Office., , 2013"]
[null,null,"Descrizione fisica",null,"1 online resource (iii, 179 pages) : illustrations"]
[null,null,"Soggetti",null,"Antisemitism"]
[{"$nulls":4},"Antisemitism - Government policy - United States"]
[{"$nulls":4},"Jews - Public opinion"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Title from title screen (viewed on July 23, 2013)."]
[{"$nulls":4},"Paper version available for sale by the Superintendent of Documents, U.S. Government Printing Office."]
[{"$nulls":4},"\"Serial no. 113-15.\""]
[null,null,null,"Nota di bibliografia","Includes bibliographical references."]
[null,"2.","Record Nr.",null,"UNINA9910350301703321"]
[null,null,"Autore",null,"Huang YongAn"]
[null,null,"Titolo",null,"Modeling and Application of Flexible Electronics Packaging / / by YongAn Huang, Zhouping Yin, Xiaodong Wan"]
[null,null,"Pubbl/distr/stampa",null,"Singapore : , : Springer Singapore : , : Imprint : Springer, , 2019"]
[null,null,"ISBN",null,"981-13-3627-X"]
[null,null,"Edizione",null,"[1st ed. 2019.]"]
[null,null,"Descrizione fisica",null,"1 online resource (XVII, 287 p.)"]
[null,null,"Disciplina",null,"621.381"]
[null,null,"Soggetti",null,"Electronics"]
[{"$nulls":4},"Microelectronics"]
[{"$nulls":4},"Optical materials"]
[{"$nulls":4},"Electronics - Materials"]
[{"$nulls":4},"Manufactures"]
[{"$nulls":4},"Mechanics"]
[{"$nulls":4},"Mechanics, Applied"]
[{"$nulls":4},"Computer simulation"]
[{"$nulls":4},"Electronics and Microelectronics, Instrumentation"]
[{"$nulls":4},"Optical and Electronic Materials"]
[{"$nulls":4},"Manufacturing, Machines, Tools, Processes"]
[{"$nulls":4},"Theoretical and Applied Mechanics"]
[{"$nulls":4},"Simulation and Modeling"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,"Nota di contenuto",null,"Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on."]
[null,null,null,"Sommario/riassunto","This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics."]