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[null,"1.","Record Nr.",null,"UNINA9910557446503321"]
[null,null,"Autore",null,"Armstrong Ronald W"]
[null,null,"Titolo",null,"Crystal Plasticity at Micro- and Nano-scale Dimensions"]
[null,null,"Pubbl/distr/stampa",null,"Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021"]
[null,null,"Descrizione fisica",null,"1 online resource (322 p.)"]
[null,null,"Soggetti",null,"Technology: general issues"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Sommario/riassunto","The present collection of articles focuses on the mechanical strength properties at micro- and nanoscale dimensions of body-centered cubic, face-centered cubic and hexagonal close-packed crystal structures. The advent of micro-pillar test specimens is shown to provide a new dimensional scale for the investigation of crystal deformation properties. The ultra-small dimensional scale at which these properties are measured is shown to approach the atomic-scale level at which model dislocation mechanics descriptions of crystal slip and deformation twinning behaviors are proposed to be operative, including the achievement of atomic force microscopic measurements of dislocation pile-up interactions with crystal grain boundaries or with hard surface coatings. A special advantage of engineering designs made at such small crystal and polycrystalline dimensions is the achievement of an approximate order-of-magnitude increase in mechanical strength levels. Reasonable extrapolation of macro-scale continuum mechanics descriptions of crystal strength properties at micro- to nano-indentation hardness measurements are demonstrated, in addition to reports on persistent slip band observations and fatigue cracking behaviors. High-entropy alloy, superalloy and energetic crystal properties are reported along with descriptions of deformation rate sensitivities, grain boundary structures, nano-cutting, void nucleation/growth micromechanics and micro-composite electrical properties."]
[null,"2.","Record Nr.",null,"UNINA9910298974603321"]
[null,null,"Titolo",null,"Advanced Computer Architecture : 10th Annual Conference, ACA 2014, Shenyang, China, August 23-24, 2014. Proceedings / / edited by Junjie Wu, Haibo Chen, Xingwei Wang"]
[null,null,"Pubbl/distr/stampa",null,"Berlin, Heidelberg : , : Springer Berlin Heidelberg : , : Imprint : Springer, , 2014"]
[null,null,"ISBN",null,"3-662-44491-7"]
[null,null,"Edizione",null,"[1st ed. 2014.]"]
[null,null,"Descrizione fisica",null,"1 online resource (XII, 255 p. 128 illus.)"]
[null,null,"Collana",null,"Communications in Computer and Information Science, , 1865-0937 ; ; 451"]
[null,null,"Disciplina",null,"004.071"]
[null,null,"Soggetti",null,"Microprocessors"]
[{"$nulls":4},"Computer architecture"]
[{"$nulls":4},"Computers"]
[{"$nulls":4},"Computer systems"]
[{"$nulls":4},"Electronic digital computers - Evaluation"]
[{"$nulls":4},"Processor Architectures"]
[{"$nulls":4},"Hardware Performance and Reliability"]
[{"$nulls":4},"Computer System Implementation"]
[{"$nulls":4},"System Performance and Evaluation"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Bibliographic Level Mode of Issuance: Monograph"]
[null,null,"Nota di contenuto",null,"Processors and circuits -- High performance computing -- GPUs and accelerators -- Cloud and data centers -- Energy and reliability -- Intelligence computing and mobile computing."]
[null,null,null,"Sommario/riassunto","This book constitutes the refereed proceedings of the 10th Annual Conference on Advanced Computer Architecture, ACA 2014, held in Shenyang, China, in August 2014. The 19 revised full papers presented were carefully reviewed and selected from 115 submissions. The papers are organized in topical sections on processors and circuits; high performance computing; GPUs and accelerators; cloud and data centers; energy and reliability; intelligence computing and mobile computing."]