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[null,"1.","Record Nr.",null,"UNINA9910557361903321"]
[null,null,"Autore",null,"Behrens Bernd-Arno"]
[null,null,"Titolo",null,"Hybrid Bulk Metal Components"]
[null,null,"Pubbl/distr/stampa",null,"Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021"]
[null,null,"Descrizione fisica",null,"1 online resource (224 p.)"]
[null,null,"Soggetti",null,"Technology: general issues"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Sommario/riassunto","In recent years, the requirements for technical components have steadily been increasing. This development is intensified by the desire for products with a lower weight, smaller size, and extended functionality, but also with a higher resistance against specific stresses. Mono-material components, which are produced by established processes, feature limited properties according to their respective material characteristics. Thus, a significant increase in production quality and efficiency can only be reached by combining different materials in a hybrid metal component. In this way, components with tailored properties can be manufactured that meet the locally varying requirements. Through the local use of different materials within a component, for example, the weight or the use of expensive alloying elements can be reduced. The aim of this Special Issue is to cover the recent progress and new developments regarding all aspects of hybrid bulk metal components. This includes fundamental questions regarding the joining, forming, finishing, simulation, and testing of hybrid metal parts."]
[null,"2.","Record Nr.",null,"UNINA9910557287403321"]
[null,null,"Autore",null,"Boyraz Ozdal"]
[null,null,"Titolo",null,"Silicon Photonics Bloom"]
[null,null,"Pubbl/distr/stampa",null,"Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020"]
[null,null,"Descrizione fisica",null,"1 online resource (184 p.)"]
[null,null,"Soggetti",null,"History of engineering and technology"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Sommario/riassunto","The open access journal Micromachines invites manuscript submissions for the Special Issue \"Silicon Photonics Bloom\". The past two decades have witnessed a tremendous growth of silicon photonics. Lab-scale research on simple passive component designs is now being expanded by on-chip hybrid systems architectures. With the recent injection of government and private funding, we are living the 1980s of the electronic industry, when the first merchant foundries were established. Soon, we will see more and more merchant foundries proposing well-established electronic design tools, product development kits, and mature component libraries. The open access journal Micromachines invites the submission of manuscripts in the developing area of silicon photonics. The goal of this Special Issue is to highlight the recent developments in this cutting-edge technology.]"]