{"text_format":"2","workbook":"xls","n_sheets":1,"sheets":["report2"],"not_rendered":{"charts":0,"images":0,"macros":0,"external_links":1,"defined_names":1,"comments":0,"pivot_tables":0},"unopened":[],"bounds":{"document_bytes":16777216,"sheet_cells":100000,"run_cost":"one","rows_first":2000,"rows_last":500,"rows_between":2000,"halvings":0,"cell_chars":16384,"cell_head_chars":4096},"cells_cut":0,"cells_raw":0,"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"report2","index":0,"n_rows":25,"n_cols":5,"rows_kept":25,"cut":false,"hidden":false,"merged":[[0,2,0,3],[0,4,0,5],[1,2,1,3],[1,4,1,5],[2,2,2,3],[4,2,4,3],[7,2,7,3],[8,2,8,3],[9,2,9,3],[10,2,10,3],[13,2,13,3],[14,2,14,3],[16,2,16,3]],"flags":["formulas_cached_only"]}
[null,"1.","Record Nr.",null,"UNINA9910555085903321"]
[null,null,"Titolo",null,"Industry 4.1 : intelligent manufacturing with zero defects / / edited by Fan-Tien Cheng"]
[null,null,"Pubbl/distr/stampa",null,"Hoboken, New Jersey : , : John Wiley & Sons, Inc., , [2022]"]
[{"$nulls":4},"©2022"]
[null,null,"ISBN",null,"1-119-73992-6"]
[{"$nulls":4},"1-119-73990-X"]
[{"$nulls":4},"1-119-73991-8"]
[null,null,"Descrizione fisica",null,"1 online resource (563 pages)"]
[null,null,"Collana",null,"IEEE Press Series on Systems Science and Engineering Ser."]
[null,null,"Disciplina",null,"658.4038028563"]
[null,null,"Soggetti",null,"Industry 4.0"]
[{"$nulls":4},"Manufacturing processes - Automation"]
[{"$nulls":4},"Manufactures - Defects - Prevention"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,"Nota di contenuto",null,"Cover -- Title Page -- Copyright Page -- Contents -- Editor Biography -- List of Contributors -- Preface -- Acknowledgments -- Foreword -- Chapter 1 Evolution of Automation and Development Strategy of Intelligent Manufacturing with Zero Defects -- 1.1 Introduction -- 1.2 Evolution of Automation -- 1.2.1 e-Manufacturing -- 1.2.2 Industry 4.0 -- 1.2.3 Zero Defects - Vision of Industry 4.1 -- 1.3 Development Strategy of Intelligent Manufacturing with Zero Defects -- 1.3.1 Five-Stage Strategy of Yield Enhancement and Zero-Defects Assurance -- 1.4 Conclusion -- Appendix 1.A - Abbreviation List -- References -- Chapter 2 Data Acquisition and Preprocessing -- 2.1 Introduction -- 2.2 Data Acquisition -- 2.2.1 Process Data Acquisition -- 2.2.2 Metrology Data Acquisition -- 2.3 Data Preprocessing -- 2.3.1 Segmentation -- 2.3.2 Cleaning -- 2.3.3 Feature Extraction -- 2.4 Case Studies -- 2.4.1 Detrending of the Thermal Effect in Strain Gauge Data -- 2.4.2 Automated Segmentation of Signal Data -- 2.4.3 Tool State Diagnosis -- 2.4.4 Tool Diagnosis using Loading Data -- 2.5 Conclusion -- Appendix 2.A - Abbreviation List -- Appendix B - List of Symbols in Equations -- References -- Chapter 3 Communication Standards -- 3.1 Introduction -- 3.2 Communication Standards of the Semiconductor Equipment -- 3.2.1 Manufacturing Portion -- 3.2.2 Engineering Portion (Interface A) -- 3.3 Communication Standards "]
[{"$nulls":4},"of the Industrial Devices and Systems -- 3.3.1 Historical Roadmaps of Classic Open Platform Communications (OPC) and OPC Unified Architecture (OPC-UA) Protocols -- 3.3.2 Fundamentals of OPC-UA -- 3.3.3 Example of Intelligent Manufacturing Hierarchy Applying OPC-UA Protocol -- 3.4 Conclusion -- Appendix 3.A - Abbreviation List -- References -- Chapter 4 Cloud Computing, Internet of Things (IoT), Edge Computing, and Big Data Infrastructure -- 4.1 Introduction."]
[{"$nulls":4},"4.2 Cloud Computing -- 4.2.1 Essentials of Cloud Computing -- 4.2.2 Cloud Service Models -- 4.2.3 Cloud Deployment Models -- 4.2.4 Cloud Computing Applications in Manufacturing -- 4.2.5 Summary -- 4.3 IoT and Edge Computing -- 4.3.1 Essentials of IoT -- 4.3.2 Essentials of Edge Computing -- 4.3.3 Applications of IoT and Edge Computing in Manufacturing -- 4.3.4 Summary -- 4.4 Big Data Infrastructure -- 4.4.1 Application Demands -- 4.4.2 Core Software Stack Components -- 4.4.3 Bridging the Gap between Core Software Stack Components and Applications -- 4.4.4 Summary -- 4.5 Conclusion -- Appendix 4.A - Abbreviation List -- Appendix 4.B - List of Symbols in Equations -- References -- Chapter 5 Docker and Kubernetes -- 5.1 Introduction -- 5.2 Fundamentals of Docker -- 5.2.1 Docker Architecture -- 5.2.2 Docker Operational Principles -- 5.2.3 Illustrative Applications of Docker -- 5.2.4 Summary -- 5.3 Fundamentals of Kubernetes -- 5.3.1 Kubernetes Architecture -- 5.3.2 Kubernetes Operational Principles -- 5.3.3 Illustrative Applications of Kubernetes -- 5.3.4 Summary -- 5.4 Conclusion -- Appendix 5.A - Abbreviation List -- References -- Chapter 6 Intelligent Factory Automation (iFA) System Platform -- 6.1 Introduction -- 6.2 Architecture Design of the Advanced Manufacturing Cloud of Things (AMCoT) Framework -- 6.3 -- 6.4 Brief Description of the Baseline Predictive Maintenance (BPM) Scheme in the Intelligent Prediction Maintenance (IPM) Server -- 6.5 Brief Description of the Key-variable Search Algorithm (KSA) Scheme in the Intelligent Yield Management (IYM) Server -- 6.6 The iFA System Platform -- 6.6.1 Cloud-based iFA System Platform -- 6.6.2 Server-based iFA System Platform -- 6.7 Conclusion -- Appendix 6.A - Abbreviation List -- Appendix 6.B - List of Symbols -- References -- Chapter 7 Advanced Manufacturing Cloud of Things (AMCoT) Framework."]
[{"$nulls":4},"7.1 Introduction -- 7.2 Key Components of AMCoT Framework -- 7.2.1 Key Components of Cloud Part -- 7.2.2 Key Components of Factory Part -- 7.2.3 An Example Intelligent Manufacturing Platform Based on AMCoT Framework -- 7.2.4 Summary -- 7.3 Framework Design of Cyber-Physical Agent (CPA) -- 7.3.1 Framework of CPA -- 7.3.2 Framework of Containerized CPA (CPAC) -- 7.3.3 Summary -- 7.4 Rapid Construction Scheme of CPAs (RCSCPA) Based on Docker and Kubernetes -- 7.4.1 Background and Motivation -- 7.4.2 System Architecture of RCSCPA -- 7.4.3 Core Functional Mechanisms of RCSCPA -- 7.4.4 Industrial Case Study of RCSCPA -- 7.4.5 Summary -- 7.5 Big Data Analytics Application Platform -- 7.5.1 Architecture of Big Data Analytics Application Platform -- 7.5.2 Performance Evaluation of Processing Big Data -- 7.5.3 Big Data Analytics Application in Manufacturing - Electrical Discharge Machining -- 7.5.4 Summary -- 7.6 Manufacturing Services Automated Construction Scheme (MSACS) -- 7.6.1 Background and Motivation -- 7.6.2 Design of Three-Phase Workflow of MSACS -- 7.6.3 Architecture Design of MSACS -- 7.6.4 Designs of Core Components -- 7.6.5 Industrial Case Studies -- 7.6.6 Summary -- 7.7 Containerized MSACS (MSACSC) -- 7.8 Conclusion -- Appendix 7.A - Abbreviation List -- Appendix 7.B - Patents (AMCoT + CPA) -- USA Patents -- Taiwan, ROC Patents -- Japan Patent -- China Patent -- References -- Chapter 8 Automatic "]
[{"$nulls":4},"Virtual Metrology (AVM) -- 8.1 Introduction -- 8.1.1 Survey of Virtual Metrology (VM)-Related Literature -- 8.1.2 Necessity of Applying VM -- 8.1.3 Benefits of VM -- 8.2 Evolution of VM and Invention of AVM -- 8.2.1 Invention of AVM -- 8.3 Integrating AVM Functions into the Manufacturing Execution System (MES) -- 8.3.1 Operating Scenarios among AVM, MES Components, and Run-to-Run (R2R) Controllers."]
[{"$nulls":4},"8.4 Applying AVM for Workpiece-to-Workpiece (W2W) Control -- 8.4.1 Background Materials -- 8.4.2 Fundamentals of Applying AVM for W2W Control -- 8.4.3 R2R Control Utilizing VM with Reliance Index (RI) and Global Similarity Index (GSI) -- 8.4.4 Illustrative Examples -- 8.4.5 Summary -- 8.5 AVM System Deployment -- 8.5.1 Automation Levels of VM Systems -- 8.5.2 Deployment of the AVM System -- 8.6 Conclusion -- Appendix 8.A - Abbreviation List -- Appendix 8.B - List of Symbols in Equations -- Appendix 8.C - Patents (AVM) -- References -- Chapter 9 Intelligent Predictive Maintenance (IPM) -- 9.1 Introduction -- 9.1.1 Necessity of Baseline Predictive Maintenance (BPM) -- 9.1.2 Prediction Algorithms of Remaining Useful Life (RUL) -- 9.1.3 Introducing the Factory-wide IPM System -- 9.2 BPM -- 9.2.1 Important Samples Needed for Creating Target-Device Baseline Model -- 9.2.2 Samples Needed for Creating Baseline Individual Similarity Index (ISIB) Model -- 9.2.3 Device-Health-Index (DHI) Module -- 9.2.4 Baseline-Error-Index (BEI) Module -- 9.2.5 Illustration of Fault-Detection-and-Classification (FDC) Logic -- 9.2.6 Flow Chart of Baseline FDC Execution Procedure -- 9.2.7 Exponential-Curve-Fitting (ECF) RUL Prediction Module -- 9.3 Time-Series-Prediction (TSP) Algorithm for Calculating RUL -- 9.3.1 ABPM Scheme -- 9.3.2 Problems Encountered with the ECF Model -- 9.3.3 Details of the TSP Algorithm -- 9.4 Factory-Wide IPM Management Framework -- 9.4.1 Management View and Equipment View of a Factory -- 9.4.2 Health Index Hierarchy (HIH) -- 9.4.3 Factory-wide IPM System Architecture -- 9.5 IPM System Implementation Architecture -- 9.5.1 Implementation Architecture of IPMC based on Docker and Kubernetes -- 9.5.2 Construction and Implementation of the IPMC -- 9.6 IPM System Deployment -- Step 1: TD Selection and Operation Analysis -- Step 2: IPM System Setup."]
[{"$nulls":4},"Step 3: Data Collection -- Step 4: IPM Modeling -- Step 5: IPM Function and Integration Tests -- Step 6: System Release -- 9.7 Conclusion -- Appendix 9.A - Abbreviation List -- Appendix 9.B - List of Symbols in Equations -- Appendix 9.C - Patents (IPM) -- USA Patents -- Taiwan, ROC Patents -- Japan Patent -- European Patent -- China Patents -- Korea Patent -- References -- Chapter 10 Intelligent Yield Management (IYM) -- 10.1 Introduction -- 10.1.1 Traditional Root-Cause Search Procedure of a Yield Loss -- 10.1.2 IYM System -- 10.1.3 Procedure for Finding the Root Causes of a Yield Loss by Applying the Key-variable Search Algorithm (KSA) Scheme -- 10.2 KSA Scheme -- 10.2.1 Data Preprocessing Module -- 10.2.2 KSA Module -- 10.2.3 Blind-stage Search Algorithm (BSA) Module -- 10.2.4 Interaction-Effect Search Algorithm (IESA) Module -- 10.3 IYM System Deployment -- 10.4 Conclusion -- Appendix 10.A - Abbreviation List -- Appendix 10.B - List of Symbols in Equations -- Appendix 10.C - Patents (IYM) -- USA Patents -- Taiwan, ROC Patents -- China Patents -- Korea Patent -- References -- Chapter 11 Application Cases of Intelligent Manufacturing -- 11.1 Introduction -- 11.2 Application Case I: Thin Film Transistor Liquid Crystal Display (TFT-LCD) Industry -- 11.2.1 Automatic Virtual Metrology (AVM) Deployment Examples in the TFT-LCD Industry -- 11.2.2 Intelligent Yield Management (IYM) Deployment Examples in the TFT-LCD Industry -- 11.3 Application Case II: Solar Cell Industry -- 11.3.1 Introducing the Solar Cell Manufacturing Process and Requirement Analysis of Intelligent Manufacturing -- "]
[{"$nulls":4},"11.3.2 T2T Control with AVM Deployment Examples -- 11.3.3 Factory-Wide Intelligent Predictive Maintenance (IPM) Deployment Examples -- 11.3.4 Summary -- 11.4 Application Case III: Semiconductor Industry -- 11.4.1 AVM Deployment Example in the Semiconductor Industry."]
[{"$nulls":4},"11.4.2 IPM Deployment Examples in the Semiconductor Industry."]