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[null,"1.","Record Nr.",null,"UNINA9910554838903321"]
[null,null,"Autore",null,"Smallwood J. M (Jeremy M.)"]
[null,null,"Titolo",null,"The ESD control program handbook [[electronic resource] /] / Jeremy M Smallwood, Electrostatic Solutions Ltd, Southampton, Southampton, UK"]
[null,null,"Pubbl/distr/stampa",null,"Hoboken, New Jersey : , : John Wiley & Sons, Inc., , [2020]"]
[{"$nulls":4},"[Piscataqay, New Jersey] : , : IEEE Xplore, , [2020]"]
[null,null,"ISBN",null,"1-118-69455-4"]
[{"$nulls":4},"1-118-69457-0"]
[{"$nulls":4},"1-118-69454-6"]
[null,null,"Edizione",null,"[First edition.]"]
[null,null,"Descrizione fisica",null,"1 online resource (541 pages)"]
[null,null,"Collana",null,"IEEE"]
[null,null,"Disciplina",null,"537.52"]
[null,null,"Soggetti",null,"Electric discharges"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"11.4 Environmental conditions -- 11.5 Summary of the standard test methods and their applications -- 11.6 Measurement equipment -- 11.6.1 Choosing a resistance meter for high resistance measurements -- 11.6.2 Low resistance meter for soldering iron grounding test -- 11.6.3 Resistance measurement electrodes -- 11.6.4 Concentric ring electrodes for packaging surface and volume resistance measurement -- 11.6.5 Two-point probe for packaging surface resistance measurements -- 11.6.6 Footwear test electrode -- 11.6.7 Hand-held electrode -- 11.6.8 Tool test electrode -- 11.6.9 Metal plate electrode for volume resistance measurements -- 11.6.10 Insulating supports -- 11.6.11 ESD ground connectors -- 11.6.12 Electrostatic field meters and voltmeters -- 11.6.13 Charge Plate Monitors (CPM) -- 11.7 Common problems with measurements -- 11.7.1 Humidity -- 11.7.2 Accidental measurement of parallel paths -- 11.8 Standard measurements specified by IEC 61340-5-1 and ANSI/ESD S20.20 -- 11.8.1 Resistance to ground -- 11.8.2 Point to point resistance -- 11.8.3 Personal grounding equipment tests -- 11.8.4 Surface resistance of packaging materials -- 11.8.5 Volume resistance of packaging materials -- 11.8.6 ESD Shielding of bags -- 11.8.7 Evaluation of ESD Shielding of packaging systems -- 11.8.8 Measurement of ioniser decay time and offset voltage -- 11.8.9 Walk test of footwear and flooring -- 11.9 Useful measurements not specified by IEC 61340-5-1 and ESD S20.20 -- 11.9.1 Electrostatic "]
[{"$nulls":4},"fields and voltages -- 11.9.2 Measurement of electric fields at the position of the ESDS -- 11.9.3 Measurement of surface voltages on large objects using an electrostatic field meter calibrated as a surface voltmeter -- 11.9.4 Measurement of voltage on devices or small conductors -- 11.9.5 Resistance of tools -- 11.9.6 Resistance of soldering irons -- 11.9.7 Resistance of gloves or finger cots -- 11.9.8 Charge decay measurements -- 11.9.9 Faraday pail measurement of charge on an object -- 11.9.10 ESD event detection."]
[{"$nulls":4},"References -- Bibliographý<U+0083> -- 12 ESD Training -- 12.1 Why do we need ESD training? -- 12.2 Training planning -- 12.3 Who needs training? -- 12.4 Training form and content -- 12.4.1 Training goals -- 12.4.2 Initial training -- 12.4.3 Refresher training -- 12.4.4 Training methods -- 12.4.5 Supporting information -- 12.4.6 Training considerations -- 12.4.7 Public tutorials and courses -- 12.4.8 Qualifications and Certification -- 12.4.9 National and International ESD groups and electrostatics interest organisations -- 12.4.10 Conferences -- 12.4.11 Books, articles and online resources -- 12.5 Electrostatic and ESD theory -- 12.5.1 The pró<U+0099>s and coń<U+0099>s of theory -- 12.5.2 A technical and non-technical explanation of electrostatic charging -- 12.6 Demonstrations of ESD control related issues -- 12.6.1 The role of demonstrations -- 12.6.2 Demonstrating real ESD damage -- 12.6.3 The cost of ESD damage -- 12.7 Electrostatic demonstrations -- 12.7.1 The value of electrostatic demonstrations -- 12.7.2 The pró<U+0099>s and coń<U+0099>s of demonstrations -- 12.7.3 Useful equipment for demonstrations -- 12.7.4 Showing how easy it is to generate electrostatic charge -- 12.7.5 Understanding electrostatic fields -- 12.7.6 Understanding charge and voltage -- 12.7.7 Tribocharging -- 12.7.8 Production of ESD -- 12.7.9 Equipotential bonding and grounding -- 12.7.10 Induction charging -- 12.7.11 ESD on demand ́<U+0093> the ́<U+009c>perpetual ESD generatoŕ<U+009d> -- 12.7.12 Body voltage and personal grounding -- 12.7.13 Charge generation and electrostatic field shielding of bags -- 12.7.14 Insulators cannot be grounded -- 12.7.15 Neutralising charge - Charge decay and voltage offset of ionisers -- 12.8 Evaluation -- 12.8.1 The need for evaluation -- 12.8.2 Practical test -- 12.8.3 Written tests -- 12.8.4 Pass criteria -- References -- Bibliography -- 13 The future -- 13.1 General trends -- 13.2 ESD withstand voltage trends -- 13.2.1 Integrated circuit ESD withstand voltage trends -- 13.2.2 Other component ESD withstand voltage trends."]
[{"$nulls":4},"13.2.3 Availability of ESD withstand voltage data -- 13.2.4 Device ESD withstand test -- 13.3 ESD control programs and process controls -- 13.3.1 ESD control program development strategies -- 13.3.2 Human body ESD -- 13.3.3 ESD between ESDS and conductive items -- 13.3.4 Charged board, module and cable discharge events -- 13.3.5 Optimisation -- 13.4 Standards -- 13.5 ESD control equipment and materials -- 13.5.1 ESD control materials -- 13.5.2 ESD protective packaging -- 13.6 ESD related measurements -- 13.6.1 ESD protective packaging measurements -- 13.6.2 Voltage measurement on ESDS and ungrounded conductors -- 13.6.3 Measurements related to ESD risk in automated handling equipment -- 13.7 System ESD immunity -- 13.8 Education and training -- References -- Bibliography -- Appendix A. An example draft ESD control program -- A. ESD program plan at XXX LTD -- A.1 Introduction -- A.2 Scope -- A.3 Terms and definitions -- A.4 Personal safety -- A.5 ESD control program -- A.5.1 ESD control program requirements -- A.5.2 ESD Coordinator -- A.5.3 Tailoring ESD control requirements -- A.6 ESD control program technical requirements -- A.6.1 ESD ground -- A.6.2 Personal grounding -- A."]
[{"$nulls":4},"6.3 ESD Protected Areas (EPA) -- A.6.4 ESD protective packaging -- A.6.5 Marking of ESD related items -- A.7 Compliance verification plan -- A.8 ESD training plan -- A.8.1 General requirements of the ESD Training Plan -- A.8.2 Training records -- A.8.3 Training content and frequency -- A.9 ESD control product qualification -- A.10 ESD control program references -- References."]
[{"$nulls":4},"Introduction -- Foreword -- Preface -- Acknowledgements -- 1 Definitions and Terminology -- 1.1 Scientific notation and SI unit prefixes -- 1.2 Charge, electrostatic fields and voltage -- 1.2.1 Charge -- 1.2.2 Ions -- 1.2.3 Dissipation and neutralization of electrostatic charge -- 1.2.4 Voltage (potential) -- 1.2.5 Electric or electrostatic field -- 1.2.6 Gausś<U+0099>s Law -- 1.2.7 Electrostatic attraction (ESA) -- 1.2.8 Permittivity -- 1.3 Electric current -- 1.4 Electrostatic discharge (ESD) -- 1.4.1 ESD Models -- 1.4.2 ElectroMagnetic Interference (EMI) -- 1.5 Earthing, grounding and equipotential bonding -- 1.6 Power and Energy -- 1.7 Resistance, resistivity and conductivity -- 1.7.1 Resistance -- 1.7.2 Resistivity and conductivity -- 1.7.2.1 Surface resistivity and surface resistance -- 1.7.2.2 Volume resistance, volume resistivity and conductivity -- 1.7.3 Insulators, conductors, conductive, dissipative and antistatic materials -- 1.7.4 Point to point resistance -- 1.7.5 Resistance to ground -- 1.7.6 Combination of resistances -- 1.8 Capacitance -- 1.9 Shielding -- 1.10 Dielectric breakdown strength -- 1.11 Relative humidity and dew point -- References -- 2 The principles of static electricity and electrostatic discharge (ESD) control -- 2.1 Overview -- 2.2 Contact charge generation (triboelectrification) -- 2.2.1 The polarity and magnitude of charging -- 2.3 Electrostatic charge build-up and dissipation -- 2.3.1 A simple electrical model of electrostatic charge build-up -- 2.3.2 Capacitance is variable -- 2.3.3 Charge decay time -- 2.3.4 Conductors and insulators revisited -- 2.3.5 The effect of relative humidity -- 2.4 Conductors in electrostatic fields -- 2.4.1 Voltage on conducting and insulating bodies and surfaces -- 2.4.2 Electrostatic field in practical situations -- 2.4.3 Faraday cage -- 2.4.4 Induction: An isolated conductive object attains a voltage when in an electric field -- 2.4.1 Induction charging: An object can become charged by grounding it -- 2.4.2 Faraday pail and shielding of charges within a closed object."]
[{"$nulls":4},"2.5 Electrostatic discharges -- 2.5.1 ESD (sparks) between conducting objects -- 2.5.2 ESD from insulating surfaces -- 2.5.3 Corona discharge -- 2.5.4 Other types of discharge -- 2.6 Common electrostatic discharge sources -- 2.6.1 ESD from the human body -- 2.6.2 ESD from charged conductive objects -- 2.6.3 Charged device ESD -- 2.6.4 ESD from a charged board -- 2.6.5 ESD from a charged module -- 2.6.6 ESD from charged cables -- 2.7 Electronic models of ESD -- 2.8 Electrostatic attraction (ESA) -- 2.8.1 ESA and particle contamination -- 2.8.2 Neutralisation of surface voltages by air ions -- 2.8.3 Ionisers -- 2.8.4 Rate of charge neutralisation -- 2.8.5 The region of effective charge neutralisation around an ioniser -- 2.8.6 Ioniser balance and charging of a surface by an unbalanced ioniser -- 2.9 Electromagnetic interference (EMI) -- 2.10 How to avoid ESD damage of components -- 2.10.1 The circumstances leading to ESD damage of a component -- 2.10.2 Risk of ESD damage -- 2.10.3 The principles of ESD control -- References -- Bibliography -- 3 ESD sensitive devices (ESDS) -- 3.1 What are ESD sensitive devices? -- 3.2 Measuring ESD Susceptibility -- 3.2.1 Modelling electrostatic discharges -- 3.2.2 Standard ESD susceptibility tests -- 3.2.3 ESD withstand voltage -- 3.2.4 Human Body Model component susceptibility test -- 3.2.5 System level Human Body ESD susceptibility test -- 3.2.6 Machine Model component susceptibility test -- 3.2.7 "]
[{"$nulls":4},"Charged Device Model component susceptibility test -- 3.2.8 Comparison of test methods -- 3.2.9 Failure criteria used in ESD susceptibility test -- 3.2.10 Transmission line pulse techniques -- 3.2.11 The relation between ESD withstand voltage and ESD damage -- 3.2.12 Trends in component ESD test -- 3.3 ESD susceptibility of components -- 3.3.1 Introduction -- 3.3.2 Latent failures -- 3.3.3 Built-in on-chip ESD protection and ESD protection targets -- 3.3.4 ESD sensitivity of typical components -- 3.3.5 Discrete devices -- 3.3.6 The effect of scaling."]
[{"$nulls":4},"3.3.7 Package effects -- 3.4 Some common types of ESD damage -- 3.4.1 Failure mechanisms -- 3.4.2 Breakdown of thin dielectric layers -- 3.4.3 MOSFETs -- 3.4.4 Susceptibility to electrostatic fields and breakdown between closely spaced conductors -- 3.4.5 Semiconductor junctions -- 3.4.6 Field effect structures and non-conductive device lids -- 3.4.7 Piezoelectric crystals -- 3.4.8 Light emitting diodes -- 3.4.9 Magnetoresistive heads -- 3.4.10 MicroElectroMechanical Systems (MEMS) -- 3.4.11 Burnout of device conductors or resistors -- 3.4.12 Passive components -- 3.4.13 Printed circuit boards and assemblies -- 3.4.14 Modules and system components -- 3.5 System level ESD -- 3.5.1 Introduction -- 3.5.2 The relationship between system level immunity and component ESD withstand -- 3.5.3 Charged cable ESD (Cable Discharge Events) -- 3.5.4 System-Efficient ESD Design (SEED) -- References -- Bibliography -- 4.1 Why habits? -- 4.2 The basis of ESD protection -- 4.3 What is an ESDS? -- 4.4 Habit 1: Always handle ESD sensitive components within an ESD Protected Area (EPA) -- 4.4.1 What is an EPA? -- 4.4.2 Defining the EPA boundary -- 4.4.3 Marking the EPA boundary -- 4.4.4 What is an insignificant level of ESD risk? -- 4.4.5 What are the sources of ESD risk? -- 4.4.6 What ESD protection measures are needed in the EPA? -- 4.4.7 Who will decide what ESD protection measures are required? -- 4.5 Habit 2: Where possible avoid use of insulators near ESDS -- 4.5.1 What is an insulator? -- 4.5.2 Essential and non-essential insulators -- 4.5.3 Remove non-essential insulators from the vicinity of ESDS -- 4.6 Habit 3: Reduce ESD risks from essential insulators -- 4.6.1 What is an insulator? -- 4.6.1 Insulators cannot be grounded -- 4.6.2 What to do about ESD risk from essential insulators -- 4.6.3 Using ionisers to reduce charge levels on insulators -- 4.7 Habit 4: Ground conductors, especially people -- 4.7.1 What is a conductor? -- 4.7.2 Conductive, dissipative or insulative? -- 4.7.3 Properties of a conductor."]
[{"$nulls":4},"4.7.4 Charge and voltage decay time -- 4.7.5 The importance of material contact resistance in protecting ESDS -- 4.7.6 Safety considerations -- 4.7.7 Elimination of ESD by grounding and equipotential bonding -- 4.7.8 Understanding the grounding (earth) system -- 4.7.9 Grounding personnel handling ESDS -- 4.7.10 Grounding ESD control equipment -- 4.7.11 What if a conductor cannot be grounded? -- 4.8 Habit 5: Protect ESDS using ESD packaging -- 4.8.1 Doń<U+0099>t take ordinary packaging materials into an EPA -- 4.8.2 The basic functions of ESD packaging -- 4.8.3 Only open ESD packaging within an EPA -- 4.8.4 Doń<U+0099>t put papers or other unsuitable material in a package with an ESDS -- 4.9 Habit 6: Train personnel to know how to use ESD control equipment and procedures -- 4.9.1 Why train people? -- 4.9.2 Who needs ESD training? -- 4.9.3 What training do they need? -- 4.9.4 Refresher training -- 4.10 Habit 7: Check and test to make sure everythinǵ<U+0099>s working -- 4.10.1 Why do we need to check and test? -- 4.10.2 What needs to be tested? -- 4.10.3 ESD control product qualification -- 4.10.4 ESD control product or system compliance verification -- 4.10.5 Test methods and pass criteria -- 4.10.6 How often should ESD control "]
[{"$nulls":4},"items be tested? -- 4.11 The seven habits and ESD standards -- 4.12 Handling very sensitive devices -- 4.13 Controlling other ESD sources -- References -- Bibliography -- 5 Automated systems -- 5.1 What makes automated handling and assembly different? -- 5.2 Conductive, static dissipative and insulative materials -- 5.3 Safety and AHE -- 5.4 Understanding ESD sources and risks -- 5.5 A strategy for ESD control -- 5.5.1 General principles of ESD control in AHE -- 5.5.2 The conditions leading to ESD damage -- 5.5.3 Strategies for ESD control in automated equipment -- 5.5.4 Qualification of ESD control measures -- 5.5.5 Compliance verification of ESD control measures -- 5.5.6 ESD training implications -- 5.5.7 Modification of existing AHE -- 5.6 Determination and implementation of ESD control measures in AHE."]
[{"$nulls":4},"5.6.1 Define the critical path of ESDS -- 5.6.2 Examine the critical path and identify ESD risks -- 5.6.3 Determine appropriate ESD control measures -- 5.6.4 Include ESD control in new equipment specification -- 5.6.5 Document the ESD control measures used in the machine -- 5.6.6 Implement maintenance and compliance verification of ESD control measures -- 5.7 Materials, techniques and equipment used for ESD control in AHE -- 5.7.1 Grounding all conductors that make contact with ESDS -- 5.7.2 Isolated conductors -- 5.7.3 Preventing induced voltages on ESDS -- 5.7.4 Reducing tribocharging of ESDS -- 5.7.5 Using resistive contact materials to limit charged device ESD current -- 5.7.6 Anodisation -- 5.7.7 Bearings -- 5.7.8 Conveyor belts -- 5.7.9 Using ionisers to reduce charge levels on ESDS, essential insulators and isolated conductors -- 5.7.10 Vacuum pickers -- 5.8 ESD protective packaging -- 5.9 Measurements in AHE -- 5.9.1 Overview of measurements in AHE -- 5.9.2 Resistance measurements -- 5.9.3 Electrostatic field and voltage measurements -- 5.9.4 Charge measurements -- 5.9.5 Measurement of the voltage decay time and offset voltage due to neutralization by an ionizer -- 5.9.6 ESD current measurements -- 5.9.7 Detection of ESD using EMI detectors -- 5.1 Handling very sensitive components -- References -- Bibliography -- 6 ESD control standards -- 6.1 Introduction -- 6.2 The development of ESD control standards -- 6.3 Who writes the standards? -- 6.4 The IEC and ESDA standards -- 6.4.1 Standards numbering -- 6.4.2 The language of standards -- 6.4.3 Definitions used in standards -- 6.5 Requirements of IEC61340-5-1 and ANSI/ESD S20.20 standards -- 6.5.1 Background -- 6.5.2 Documentation and planning -- 6.5.3 Technical basis of the ESD control program -- 6.5.4 Personal safety -- 6.5.5 ESD Coordinator -- 6.5.6 Tailoring the ESD program -- 6.5.7 The ESD Program Plan -- 6.5.8 Training Plan -- 6.5.9 Product Qualification Plan -- 6.5.10 Compliance Verification Plan -- 6.5.11 Test methods."]
[{"$nulls":4},"6.5.12 ESD Control Program Plan technical requirements -- 6.5.13 ESD Packaging -- 6.5.14 Marking -- References -- Bibliography -- 7 Selection, use, care and maintenance of equipment and materials for ESD control -- 7.1 Introduction -- 7.1.1 Selection and qualification of equipment -- 7.1.2 Use -- 7.1.3 Cleaning, care and maintenance of equipment -- 7.1.4 Compliance verification -- 7.2 ESD control earth (ground) -- 7.2.1 What does the ESD control earth do? -- 7.2.2 Choosing an ESD control earth -- 7.2.3 Qualification of ESD control earth -- 7.2.4 Compliance verification of ESD control earth -- 7.2.5 Common problems with ground connections -- 7.3 The ESD control floor -- 7.3.1 What does an ESD control floor do? -- 7.3.2 Permanent ESD control floor material -- 7.3.3 Semi-permanent or non-permanent ESD control floor materials -- 7.3.4 Selection of floor materials -- 7.3.5 Floor material qualification test -- 7.3.6 Acceptance of a floor installation -- 7.3.7 Use of floor materials -- 7.3.8 Care and maintenance of floors -- 7.3.9 Compliance verification test -- 7.3.10 "]
[{"$nulls":4},"Common problems -- 7.4 Earth bonding -- 7.4.1 The role of earth bonding points -- 7.4.2 Selection of earth bonding points -- 7.4.3 Qualification of earth bonding points -- 7.4.4 Use of earth bonding points -- 7.4.5 Compliance verification of earth bonding points -- 7.5 Personal grounding -- 7.5.1 What is the purpose of personal grounding? -- 7.5.2 Personal grounding and electrical safety -- 7.5.3 Wrist straps -- 7.5.4 Footwear and flooring grounding -- 7.5.5 Grounding via ESD control seating -- 7.5.1 Personal grounding via an ESD garment -- 7.6 Work surfaces -- 7.6.1 What does a work surface do? -- 7.6.2 Types of work surfaces -- 7.6.3 Selection of a work surface -- 7.6.4 Workstation qualification test -- 7.6.5 Acceptance of work surfaces -- 7.6.6 Cleaning and maintenance of work surfaces -- 7.6.7 Compliance verification test of work surfaces -- 7.6.8 Common problems -- 7.7 Storage racks and shelves -- 7.7.1 Should it be an EPA rack or shelf?."]
[{"$nulls":4},"7.7.2 Selection, care and maintenance of racks and shelves -- 7.7.3 Qualification test of EPA shelves and racks -- 7.7.4 Acceptance of shelves and racks -- 7.7.5 Cleaning and maintenance of shelves and racks -- 7.7.6 Compliance verification test of shelves and racks -- 7.7.7 Common problems -- 7.8 Trolleys, carts and mobile equipment -- 7.8.1 Types of trolleys, carts and mobile equipment -- 7.8.2 Selection, care and maintenance of trolleys, carts and mobile equipment -- 7.8.3 Qualification of trolleys, carts and mobile equipment -- 7.8.4 Compliance verification of trolleys, carts and mobile equipment -- 7.8.5 Common problems -- 7.9 Seats -- 7.9.1 What is an ESD control seat for? -- 7.9.2 Types of ESD seating -- 7.9.3 Selection of seating -- 7.9.4 Qualification test of seating -- 7.9.5 Cleaning and maintenance of seating -- 7.9.6 Compliance verification test of seating -- 7.9.7 Common problems -- 7.9.8 Personal grounding via ESD control seating -- 7.10 Ionisers -- 7.10.1 What does an ioniser do? -- 7.10.2 Ion sources -- 7.10.3 Types of ioniser system -- 7.10.4 Selection of ionisers -- 7.10.5 Qualification test of ionisers -- 7.10.6 Cleaning and maintenance of ionisers -- 7.10.7 Compliance verification test of ionisers -- 7.10.8 Common problems -- 7.11 ESD control garments -- 7.11.1 What does an ESD control garment do? -- 7.11.2 Types of ESD control garments -- 7.11.3 Selection of ESD control garments -- 7.11.4 Qualification test of ESD control garments -- 7.11.5 Use of ESD control garments -- 7.11.6 Cleaning and maintenance of ESD control garments -- 7.11.7 Compliance verification of ESD control garments -- 7.11.8 Personal grounding via an ESD garment -- 7.12 Hand tools -- 7.12.1 Why have ESD hand tools? -- 7.12.2 Types of hand tool -- 7.12.3 Qualification test of hand tools -- 7.12.4 Use of hand tools -- 7.12.5 Compliance verification test of hand tools -- 7.12.6 Common problems with ESD control hand tools -- 7.13 Soldering or desoldering irons -- 7.13.1 ESD control issues with soldering or desoldering irons."]
[{"$nulls":4},"7.13.2 Qualification of soldering irons -- 7.13.3 Compliance verification of soldering irons -- 7.14 Gloves and finger cots -- 7.14.1 Why have gloves and finger cots? -- 7.14.2 Types of gloves and finger cots -- 7.14.3 Selection of gloves or finger cots for ESD control -- 7.14.4 Qualification test of gloves and finger cots -- 7.14.5 Cleaning and maintenance of gloves -- 7.14.6 Compliance verification test of gloves and finger cots -- 7.14.7 Common problems with gloves and finger cots -- 7.15 Marking of ESD control equipment -- References -- Bibliography -- 8 ESD control packaging -- 8.1 Why is packaging important in ESD control? -- 8.2 Packaging functions -- 8.3 ESD control packaging terminology -- 8.3.1 Terminology in general usage -- 8.1 ESD packaging properties -- 8.1.1 Triboelectric charging -- "]
[{"$nulls":4},"8.1.2 Surface resistance -- 8.1.3 Volume resistance -- 8.1.4 Electrostatic field shielding -- 8.1.5 ESD shielding -- 8.2 Use of ESD protective packaging -- 8.2.1 The importance of ESD packaging properties -- 8.2.2 Packaging used within the EPA -- 8.2.3 Packaging used to protect ESDS outside the EPA -- 8.2.4 Packaging used for non-ESD susceptible items -- 8.2.5 Avoiding charged cables and modules -- 8.3 Materials and processes used in ESD protective packaging -- 8.3.1 Introduction -- 8.3.2 Antistats, pink polythene and low charging materials -- 8.3.1 Static dissipative and conductive polymers -- 8.3.2 Intrinsically conductive or dissipative polymers -- 8.3.3 Metallised film -- 8.3.4 Anodised aluminium -- 8.3.5 Vacuum forming of filled polymers -- 8.3.6 Injection moulding -- 8.3.7 Embossing -- 8.3.8 Vapour deposition -- 8.3.9 Surface coating -- 8.3.10 Lamination -- 8.4 Types and forms of ESD protective packaging -- 8.4.1 Bags -- 8.4.2 Bubble wrap -- 8.4.3 Foam -- 8.4.4 Boxes, trays and PCB racks -- 8.4.5 Tape and reel -- 8.4.1 Sticks (tubes) -- 8.4.2 Self-adhesive tapes and labels -- 8.5 Packaging standards -- 8.5.1 ESD control and protection packaging standards -- 8.5.2 Moisture barrier packaging standards."]
[{"$nulls":4},"8.5.3 ESD control packaging measurements -- 8.6 How to select an appropriate packaging system -- 8.6.1 Introduction -- 8.6.2 Customer requirements -- 8.6.3 What is the form of the ESDS? -- 8.6.4 ESD threats and ESD susceptibility -- 8.6.5 The intended packaging task -- 8.6.6 Evaluate the operational environment for the packaging -- 8.6.7 Selecting the ESD packaging type and ESD protective functions -- 8.6.8 Testing the packaging system -- 8.7 Marking of ESD protective packaging -- References -- Bibliography -- 9 How to evaluate an ESD Control Program -- 9.1 Introduction -- 9.2 Evaluation of ESD risks -- 9.2.1 Sources of ESD risk -- 9.2.2 Evaluation of ESD susceptibility of components and assemblies 2 -- 9.3 Evaluating process capability based on HBM, MM and CDM data -- 9.3.1 Process capability evaluation -- 9.3.2 Human body ESD and manual handling processes -- 9.3.3 ESD risk due to ungrounded conductors -- 9.3.4 Charged device ESD risks -- 9.3.5 Damage to voltage sensitive structures such as a capacitor or a MOSFET gate -- 9.3.6 Evaluating ESD risk from electrostatic fields -- 9.3.7 Troubleshooting -- 9.4 Evaluating ESD protection needs -- 9.4.1 Standard ESD control precautions do not necessarily address all ESD risks -- 9.4.2 Evaluating return on investment for ESD protection measures -- 9.4.3 What is the maximum acceptable resistance to ground? -- 9.4.4 Should there be a minimum resistance to ground? -- 9.4.5 ESD from charged tools -- 9.4.6 Use of gloves or finger cots -- 9.4.7 Charged cable ESD -- 9.4.8 Charged board ESD -- 9.4.9 Charged module or assembly ESD -- 9.5 Evaluation of cost effectiveness of the ESD control program -- 9.5.1 The cost of an inadequate ESD control program -- 9.5.2 The benefit arising from of the ESD control program -- 9.5.3 Evaluation of the cost of an ESD control program -- 9.5.4 Return on investment (ROI) in ESD control -- 9.5.5 Optimising an ESD control program -- 9.6 Evaluation of compliance of an ESD control program with a standard."]
[{"$nulls":4},"9.6.1 Two steps to compliance evaluation -- 9.6.2 Using checklists to evaluate compliance of documentation with a standard -- 9.6.3 Evaluation of compliance of a facility with the ESD control program -- 9.6.4 Common Problems -- References -- 10 How to develop an ESD control program -- 10.1 What do we need for a successful ESD control program? -- 10.1.1 The ESD control strategy -- 10.1.2 How to develop an ESD control program -- 10.1.3 Safety and ESD control -- 10.2 The EPA -- 10.2.1 Where do I need an EPA? -- 10.2.2 Boundaries and signage -- 10.3 What are the sources of ESD risk in the EPA? -- 10.4 "]
[{"$nulls":4},"How to determine appropriate ESD measures -- 10.4.1 ESD control principles -- 10.4.2 Select convenient ways of working -- 10.5 Documentation of ESD procedures -- 10.5.1 What should the documentation cover? -- 10.5.2 Writing an ESD Control Program Plan that is compliant with a standard -- 10.5.3 Introduction section -- 10.5.4 Scope -- 10.5.5 Terms and definitions -- 10.5.6 Personal safety -- 10.5.7 ESD Control Program -- 10.5.8 ESD Program Plan -- 10.5.9 ESD Training Plan -- 10.5.10 ESD control product qualification -- 10.5.11 Compliance verification plan -- 10.5.12 ESD Program Technical requirements -- 10.5.13 ESD Protected areas -- 10.5.14 ESD protective packaging -- 10.5.15 Marking of ESD related items -- 10.5.16 References -- 10.6 Evaluating ESD protection needs -- 10.7 Optimising the ESD control program -- 10.7.1 Costs and benefits of ESD control -- 10.7.2 Strategies for optimisation -- 10.8 Considerations for specific areas of the facility -- 10.8.1 The varying ESD control requirements of different areas -- 10.8.2 Goods In and Stores -- 10.8.3 Kitting -- 10.8.4 Despatch -- 10.8.5 Test -- 10.8.6 Research and development -- 10.9 Update and improvement -- 11 ESD Measurements -- 11.1 Introduction -- 11.2 Standard measurements -- 11.3 Product qualification or compliance verification? -- 11.3.1 Measurement methods for Product Qualification -- 11.3.2 Measurement methods for Compliance Verification."]
[null,null,null,"Sommario/riassunto","\"An essential guide providing engineers involved with electronics production with the understanding and practical skills needed to develop and maintain an effective ESD control program for manufacturing, storage, and handling of ESD sensitive components. Every company that handles ESD susceptible components such as semiconductor devices needs an understanding of ESD control in order to avoid ESD damage in their processes. Despite this, there are very few books available on the subject and much of the currently available literature is not aligned with current practices and the ESD program standards IEC 61340-5-1 and ESD S20:20. Because within the industry, people often move into a position of responsibility for ESD control from different backgrounds with a minimal knowledge of the subject, The ESD Control Program Handbook explains the principles and practice of ESD control in an easily accessible way whilst also providing more depth and a wealth of references for those who want to gain a deeper knowledge of the subject. It covers the scientific basis of ESD, an overview of ESD susceptible components, principles of ESD control, development of an ESD control program, ESD training and how to do the most commonly used ESD related measurements. Key features : Gives the reader a sound understanding of the subject to analyse the ESD control requirements of their manufacturing processes, and develop an effective ESD control program. As well as dispensing the practical knowledge, it also contains enough theory and background for readers to understand the principles of ESD control\"--"]