{"text_format":"2","workbook":"xls","n_sheets":1,"sheets":["report2"],"not_rendered":{"charts":0,"images":0,"macros":0,"external_links":1,"defined_names":2,"comments":0,"pivot_tables":0},"unopened":[],"bounds":{"document_bytes":16777216,"sheet_cells":100000,"run_cost":"one","rows_first":2000,"rows_last":500,"rows_between":2000,"halvings":0,"cell_chars":16384,"cell_head_chars":4096},"cells_cut":0,"cells_raw":0,"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"report2","index":0,"n_rows":48,"n_cols":5,"rows_kept":48,"cut":false,"hidden":false,"merged":[[0,2,0,3],[0,4,0,5],[1,2,1,3],[1,4,1,5],[2,2,2,3],[4,2,4,3],[5,2,5,3],[6,2,6,3],[7,2,7,3],[8,2,8,3],[9,2,9,3],[17,2,17,3],[18,2,18,3],[21,2,21,3],[24,2,24,3],[24,4,24,5],[25,2,25,3],[25,4,25,5],[26,2,26,3],[26,4,26,5],[27,2,27,3],[28,2,28,3],[30,2,30,3],[31,2,31,3],[32,2,32,3],[33,2,33,3],[35,2,35,3],[41,2,41,3],[42,2,42,3],[45,2,45,3]],"flags":["formulas_cached_only"]}
[null,"1.","Record Nr.",null,"UNINA9910484726403321"]
[null,null,"Titolo",null,"3D microelectronic packaging : from architectures to applications / / editors, Yan Li, Deepak Goyal"]
[null,null,"Pubbl/distr/stampa",null,"Singapore : , : Springer, , [2021]"]
[{"$nulls":4},"©2021"]
[null,null,"ISBN",null,"981-15-7090-6"]
[null,null,"Edizione",null,"[2nd edition 2021.]"]
[null,null,"Descrizione fisica",null,"1 online resource (XVII, 622 p. 299 illus., 205 illus. in color.)"]
[null,null,"Collana",null,"Springer Series in Advanced Microelectronics, , 1437-0387 ; ; 64"]
[null,null,"Disciplina",null,"929.374"]
[null,null,"Soggetti",null,"Biotechnology"]
[{"$nulls":4},"Electronics"]
[{"$nulls":4},"Electronics - Materials"]
[{"$nulls":4},"Microelectronics"]
[{"$nulls":4},"Microelectronics - Packaging"]
[{"$nulls":4},"Nanotechnology"]
[{"$nulls":4},"Electronic circuits"]
[{"$nulls":4},"Optical materials"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Includes index."]
[null,null,"Nota di contenuto",null,"1. Introduction to 3D microelectronic packaging -- 2. 3D packaging architecture and assembly process design -- 3. Fundamentals of TSV processing and reliability -- 4. Mechanical properties of TSV -- 5. Atomistic View of TSV Protrusion/Intrusion -- 6. Fundamentals and failures in Die preparation for 3D packaging -- 7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging -- 8. Emerging hybrid bonding techniques for 3D packaging -- 9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging -- 10. Fundamentals of solder alloys in 3D packaging -- 11. Fundamentals of electro migration in interconnects of 3D packages -- 12. Fundamentals of heat dissipation in 3D packaging -- 13. Fundamentals of advanced materials and process in substrate technology -- 14. New substrate technologies for 3D packaging. -15. Thermal mechanical and moisture modeling in 3D packaging -- 16. Stress and Strain measurements in 3D packaging -- 17.Processing and Reliability of Solder Interconnections in Stacked Packaging -- 18. Interconnect Quality and Reliability of 3D Packaging "]
[{"$nulls":4},"-- 19. Fundamentals of automotive reliability of 3D packages -- 20. Fault isolation and failure analysis of 3D packaging."]
[null,null,null,"Sommario/riassunto","This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development. ."]
[null,"2.","Record Nr.",null,"UNINA9910410026003321"]
[null,null,"Autore",null,"Prados Ortiz de Solórzano Nicolás"]
[null,null,"Titolo",null,"Cuba in the Caribbean Cold War : Exiles, Revolutionaries and Tyrants, 1952-1959 / / by Nicolás Prados Ortiz de Solórzano"]
[null,null,"Pubbl/distr/stampa",null,"Cham : , : Springer International Publishing : , : Imprint : Palgrave Macmillan, , 2020"]
[null,null,"ISBN",null,"9783030463632"]
[{"$nulls":4},"303046363X"]
[null,null,"Edizione",null,"[1st ed. 2020.]"]
[null,null,"Descrizione fisica",null,"1 online resource (xiii, 113 pages) : maps"]
[null,null,"Collana",null,"St Antony's Series, , 2633-5972"]
[null,null,"Disciplina",null,"972.91064092"]
[{"$nulls":4},"900"]
[null,null,"Soggetti",null,"Latin America - History"]
[{"$nulls":4},"Social history"]
[{"$nulls":4},"World politics"]
[{"$nulls":4},"Latin American History"]
[{"$nulls":4},"Social History"]
[{"$nulls":4},"Political History"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"Chapter 1. Introduction: The Caribbean Legion Revived -- Chapter 2. A Caribbean Cold War, 1947-1955 -- Chapter 3. The Internationalization of the Cuban Revolution, 1955-1956 -- Chapter 4. The Caribbean Legion supplying the Sierra Maestra, 1957-1958 -- Chapter 5. Conclusion: The Demise of the Caribbean Legion, 1959-1961."]
[null,null,null,"Sommario/riassunto","This book argues that during the Cuban Revolution (1952-1958), Fidel Castro, his allies, and members of the Movimiento 26 de Julio tapped into a larger network of transnational revolutionaries who sought to overthrow the region's dictatorships. With his research in multiple archives including those in Cuba, Prados offers a new, transnational perspective on conflicts over dictatorship and democracy, which shaped the Caribbean in the decades that followed World War II. The book traces the roots of the 'Caribbean Legion', a transnational network of anti-dictatorial revolutionaries, before detailing how Castro and many of his allies in exile exploited this web during the struggle against Fulgencio Batista. Contacts in this network provided the Cuban revolutionaries with crucial military, financial, and diplomatic support from the democratic governments of José Figueres in Costa Rica, and "]
[{"$nulls":4},"Rómulo Betancourt in Venezuela, entangling the Cuban revolutionaries in a larger regional struggle between democratic regimes and military dictatorships. This transnational involvement shaped the revolutionary regime of 1959 and had far-reaching repercussions for the larger geopolitical dynamics in the region, and for the Cold War as a whole. Nicolás Prados Ortiz de Solórzano is a doctoral candidate in History at the University of Oxford, UK. He is currently investigating the relationship between democracy and transnational revolutionary networks operating in Latin America and the Caribbean from the mid-1940s to the early 1960s."]