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[null,"1.","Record Nr.",null,"UNINA9910483477703321"]
[null,null,"Autore",null,"Lau John H."]
[null,null,"Titolo",null,"Semiconductor advanced packaging / / John H. Lau"]
[null,null,"Pubbl/distr/stampa",null,"Gateway East, Singapore : , : Springer, , [2021]"]
[{"$nulls":4},"©2021"]
[null,null,"ISBN",null,"981-16-1376-1"]
[null,null,"Edizione",null,"[1st ed. 2021.]"]
[null,null,"Descrizione fisica",null,"1 online resource (XXII, 498 p. 557 illus., 530 illus. in color.)"]
[null,null,"Disciplina",null,"621.38152"]
[null,null,"Soggetti",null,"Semiconductors - Design and construction"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"Recent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging."]
[null,null,null,"Sommario/riassunto","The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc."]
[null,"2.","Record Nr.",null,"UNISA996397168003316"]
[null,null,"Titolo",null,"By the King [[electronic resource] ] : a proclamation concerning the post-master of England for forreigne parts"]
[null,null,"Pubbl/distr/stampa",null,"Imprinted at London, : By Robert Barker, Printer to the Kings most Excellent Maiestie : And by the Assignes of Iohn Bill, Anno 1632"]
[null,null,"Descrizione fisica",null,"1 sheet ([1] p.)"]
[null,null,"Soggetti",null,"Postal service - Great Britain"]
[{"$nulls":4},"Broadsides17th century.London (England)"]
[{"$nulls":4},"Great Britain History Charles I, 1625-1649"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Confirming W. Frizell, and T. Withering as deputies to M. de Quester with sole right to handle overseas mail."]
[{"$nulls":4},"\"Giuen at the Court at Oatlands, the nineteenth day of Iuly, in the eight yeere of the raigne of Our Soueraigne Lord Charles, by the grace of God King of England, Scotland, France and Ireland Defender of the Faith,  &c.\""]
[{"$nulls":4},"Reproduction of original in: Society of Antiquaries."]
[null,null,null,"Sommario/riassunto","eebo-0147"]